Patents by Inventor Chien-Wu Chen

Chien-Wu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250066555
    Abstract: A foam is provided. The foam includes a foaming material and a plurality of cells arranged within the foaming material. The foaming material is prepared from a composition, which includes 0.01-2.0 parts by weight of a flow aid and 100 parts by weight of a block copolymer. The block copolymer includes a first block, a second block, and a linking moiety. The first block is connected to the second block via the linking moiety. The first block is an aromatic polyester block. The second block is an aliphatic polyether block, an aliphatic polyester block, or an aliphatic polycarbonate block. The linking moiety is a residue of a dehydrogenated polyol.
    Type: Application
    Filed: August 26, 2024
    Publication date: February 27, 2025
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An WU, Chin-Lang WU, Sheng-Lung CHANG, Chien-Ming CHEN
  • Patent number: 10001855
    Abstract: A touch display device and a method for driving the same are provided. The touch display device includes a display panel and a touch panel. In the method, the touch display device provides a source output signal and outputs a plurality of pixel voltages during an enable period of the source output signal to drive the display panel. The touch display device periodically reduces the enable period of the source output signal according to a horizontal synchronization signal corresponding to a turned-on sequence of each row of pixels, so as to establish a touch sensing period. Based thereon, the touch sensing circuit scans the touch panel during the touch sensing period that does not overlap with the enable period of the source output signal, so as to obtain sensing signals for accurately indicating electrical variations of the touch panel.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 19, 2018
    Assignees: HannStar Display(Nanjing) Corp., HannStar Display Corporation
    Inventor: Chien-Wu Chen
  • Publication number: 20180166367
    Abstract: A flip-chip packaging diode with a multichip structure includes at least two flip-chips arranged with an interval apart from each other and horizontally disposed on the top of a lower guide plate, and each flip-chip has a bottom electrically connected to the lower guide plate and a top having a conductive layer. An insulating material is filled between the two flip-chips and at the outer periphery of the two flip-chips, so that the conductive layers at the tops of the two flip-chips are isolated to form a first electrode and a second electrode for electrically connecting an external circuit. With this structure, a series circuit is formed between the two flip-chips.
    Type: Application
    Filed: January 6, 2017
    Publication date: June 14, 2018
    Applicant: FORMOSA MICROSEMI CO., LTD.
    Inventors: Wen-Hu WU, Chien-Wu CHEN, His-Piao LAI, Hui-Min LIN
  • Publication number: 20160202819
    Abstract: A touch display device and a method for driving the same are provided. The touch display device includes a display panel and a touch panel. In the method, the touch display device provides a source output signal and outputs a plurality of pixel voltages during an enable period of the source output signal to drive the display panel. The touch display device periodically reduces the enable period of the source output signal according to a horizontal synchronization signal corresponding to a turned-on sequence of each row of pixels, so as to establish a touch sensing period. Based thereon, the touch sensing circuit scans the touch panel during the touch sensing period that does not overlap with the enable period of the source output signal, so as to obtain sensing signals for accurately indicating electrical variations of the touch panel.
    Type: Application
    Filed: December 11, 2015
    Publication date: July 14, 2016
    Inventor: Chien-Wu Chen
  • Patent number: 8791551
    Abstract: A well-through type diode element/component manufacturing method which has a pair (pairs) of first and said second electrodes of a diode element/component built on same plane by a process of metallization after a mode of well-through type to penetrate a PN junction depletion region/barrier region, and leads electrons of one of the electrodes to flow through the Depletion/Barrier region without hindrance; the present invention directly conduct the operations of insulation protecting, metallization and the process of elongate welding ball etc., it can independently complete a novel technique of Chip-Scale Package (CSP); it has the features of: grains being exactly the article produced, no need of connecting lines, low energy consumption, low cost and light, thin and small etc.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: July 29, 2014
    Assignee: Formosa Microsemi Co., Ltd.
    Inventors: Wen-Ping Huang, Wen-Hu Wu, His-Piao Lai, Chien-Wu Chen
  • Publication number: 20130241056
    Abstract: A well-through type diode element/component manufacturing method which has a pair (pairs) of first and said second electrodes of a diode element/component built on same plane by a process of metallization after a mode of well-through type to penetrate a PN junction depletion region/barrier region, and leads electrons of one of the electrodes to flow through the Depletion/Barrier region without hindrance; the present invention directly conduct the operations of insulation protecting, metallization and the process of elongate welding ball etc., it can independently complete a novel technique of Chip-Scale Package (CSP); it has the features of: grains being exactly the article produced, no need of connecting lines, low energy consumption, low cost and light, thin and small etc.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: FORMOSA MICROSEMI CO., Ltd.
    Inventors: Wen-Ping HUANG, Wen-Hu Wu, His-Piao Lai, Chien-Wu Chen
  • Publication number: 20060145495
    Abstract: A finger device for grasping objects is disclosed, which comprises multiple base members and a driving belt. Each base member comprises a main body, a first axle defined in the main body, a second axle defined in the main body, an elastic member and a binding member. The binding member is used for connecting the neighboring main bodies for continuous motion. The elastic member also connects the neighboring main bodies for changing or recovering the relative positions of the main bodies. The first axle and the second axle of one base member are located along a different line from the first axle of another base member, and the driving belt is used for connecting to the first axle and the second axle of each base member. Therefore, as the driving belt is pulled, the relative positions of the main bodies change and the finger device bends.
    Type: Application
    Filed: December 22, 2005
    Publication date: July 6, 2006
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Hsing Fang, Wen-Nan Huang, Chien-Wu Chen, Chih-Hsin Chen