Abstract: A steel panel damper is provided for reinforcing a building structure. The steel panel damper is disposed between a first member and an opposite second member arranged in the building structure. The steel panel damper comprises a first elastic segment, a second elastic segment, an energy dissipation segment, a first end plate, and a second end plate. In terms of the cross-sectional area perpendicular to the first direction, the first elastic segment and the second elastic segment are greater than the energy dissipation segment.

Abstract: A semiconductor device structure includes a fin structure formed over a substrate. The structure also includes nanostructures formed over the fin structure. The structure also includes a gate structure wrapped around the nanostructures. The structure also includes a first inner spacer formed beside the gate structure. The structure also includes a second inner spacer formed beside the first inner spacer. The structure also includes spacer layers formed over opposite sides of the gate structure above the nanostructures. The structure also includes source/drain epitaxial structures formed over opposite sides of the fin structure. The second inner spacer is partially embedded in the source/drain epitaxial structures.

Abstract: A sports shoe is provided. The sports shoe includes a shoe vamp and a shoe sole connected to the shoe vamp. The shoe vamp includes a textile component, wherein the textile component includes thermoplastic polyester fibers. The shoe sole includes a shoe outsole and a shoe midsole foam disposed between the shoe outsole and the shoe vamp, wherein the shoe outsole includes a vulcanizate and the shoe midsole foam includes a first thermoplastic elastomer. The vulcanizate includes rubber particles, a second thermoplastic elastomer, and an interface-compatible resin, wherein the content of the rubber particles is greater than the content of the second thermoplastic elastomer. The rubber particles are dispersed in the second thermoplastic elastomer in the form of spherical particles with particle sizes of about 0.5-10 um.

Abstract: A touch display device and a method for driving the same are provided. The touch display device includes a display panel and a touch panel. In the method, the touch display device provides a source output signal and outputs a plurality of pixel voltages during an enable period of the source output signal to drive the display panel. The touch display device periodically reduces the enable period of the source output signal according to a horizontal synchronization signal corresponding to a turned-on sequence of each row of pixels, so as to establish a touch sensing period. Based thereon, the touch sensing circuit scans the touch panel during the touch sensing period that does not overlap with the enable period of the source output signal, so as to obtain sensing signals for accurately indicating electrical variations of the touch panel.

Abstract: A flip-chip packaging diode with a multichip structure includes at least two flip-chips arranged with an interval apart from each other and horizontally disposed on the top of a lower guide plate, and each flip-chip has a bottom electrically connected to the lower guide plate and a top having a conductive layer. An insulating material is filled between the two flip-chips and at the outer periphery of the two flip-chips, so that the conductive layers at the tops of the two flip-chips are isolated to form a first electrode and a second electrode for electrically connecting an external circuit. With this structure, a series circuit is formed between the two flip-chips.

Abstract: A touch display device and a method for driving the same are provided. The touch display device includes a display panel and a touch panel. In the method, the touch display device provides a source output signal and outputs a plurality of pixel voltages during an enable period of the source output signal to drive the display panel. The touch display device periodically reduces the enable period of the source output signal according to a horizontal synchronization signal corresponding to a turned-on sequence of each row of pixels, so as to establish a touch sensing period. Based thereon, the touch sensing circuit scans the touch panel during the touch sensing period that does not overlap with the enable period of the source output signal, so as to obtain sensing signals for accurately indicating electrical variations of the touch panel.

Abstract: A well-through type diode element/component manufacturing method which has a pair (pairs) of first and said second electrodes of a diode element/component built on same plane by a process of metallization after a mode of well-through type to penetrate a PN junction depletion region/barrier region, and leads electrons of one of the electrodes to flow through the Depletion/Barrier region without hindrance; the present invention directly conduct the operations of insulation protecting, metallization and the process of elongate welding ball etc., it can independently complete a novel technique of Chip-Scale Package (CSP); it has the features of: grains being exactly the article produced, no need of connecting lines, low energy consumption, low cost and light, thin and small etc.

Abstract: A well-through type diode element/component manufacturing method which has a pair (pairs) of first and said second electrodes of a diode element/component built on same plane by a process of metallization after a mode of well-through type to penetrate a PN junction depletion region/barrier region, and leads electrons of one of the electrodes to flow through the Depletion/Barrier region without hindrance; the present invention directly conduct the operations of insulation protecting, metallization and the process of elongate welding ball etc., it can independently complete a novel technique of Chip-Scale Package (CSP); it has the features of: grains being exactly the article produced, no need of connecting lines, low energy consumption, low cost and light, thin and small etc.

Abstract: A finger device for grasping objects is disclosed, which comprises multiple base members and a driving belt. Each base member comprises a main body, a first axle defined in the main body, a second axle defined in the main body, an elastic member and a binding member. The binding member is used for connecting the neighboring main bodies for continuous motion. The elastic member also connects the neighboring main bodies for changing or recovering the relative positions of the main bodies. The first axle and the second axle of one base member are located along a different line from the first axle of another base member, and the driving belt is used for connecting to the first axle and the second axle of each base member. Therefore, as the driving belt is pulled, the relative positions of the main bodies change and the finger device bends.