Patents by Inventor Chien-Yang LIN

Chien-Yang LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230280107
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Inventors: Yen-Chih CHEN, Hsih-Ting YOU, Chi-Fu CHEN, Wei-Ta CHEN, Chien-Yang LIN
  • Patent number: 11732976
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 22, 2023
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Hsih-Ting You, Chi-Fu Chen, Wei-Ta Chen, Chien-Yang Lin