Patents by Inventor Chien Yao WANG

Chien Yao WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154065
    Abstract: An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in a
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Chien-Chih LIAO, Tzu-Yao TSENG, Tsun-Kai KO, Chien-Fu SHEN
  • Patent number: 11978768
    Abstract: A method manufacturing of a semiconductor structure including following steps is provided. A material layer is provided. A first mask layer is formed on the material layer. Core patterns are formed on the first mask layer. A spacer material layer is conformally formed on the core patterns. An etch-back process is performed on the spacer material layer. A portion of the spacer material layer located on two ends of the core pattern is removed, then spacer structures are formed. Each spacer structure includes a merged spacer and a non-merged spacer. The core patterns are removed. The first patterned mask layer is formed to cover a portion of the merged spacer and expose another portion of the merged spacer and the non-merged spacer. The first patterned mask layer and the spacer structure are used as a mask, and the first mask layer is patterned into a second patterned mask layer.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: May 7, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Tseng-Yao Pan, Chien-Hsiang Yu, Ching-Yung Wang, Cheng-Hong Wei, Ming-Tsang Wang
  • Patent number: 11965217
    Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yi-Chen Li, Chih-Cheng Tsou, Min-Hsien Wu, Hsin-Yao Wang, Chien-Ru Lin
  • Publication number: 20240087974
    Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 11663462
    Abstract: A machine learning method and a machine learning device are provided. The machine learning method includes: receiving an input signal and performing normalization on the input signal; transmitting the normalized input signal to a convolutional layer; and adding a sparse coding layer after the convolutional layer, wherein the sparse coding layer uses dictionary atoms to reconstruct signals on a projection of the normalized input signal passing through the convolutional layer, and the sparse coding layer receives a mini-batch input to refresh the dictionary atoms.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: May 30, 2023
    Assignee: National Central University
    Inventors: Jia-Ching Wang, Chien-Yao Wang, Chih-Hsuan Yang
  • Patent number: 10685474
    Abstract: The present invention provides a method for repairing incomplete 3D depth image using 2D image information. The method includes the following steps: obtaining 2D image information and 3D depth image information; dividing 2D image information into 2D reconstruction blocks and 2D reconstruction boundaries, and corresponding to 3D reconstruction of blocks and 3D reconstruction boundaries; analyzing each 3D reconstruction block, partitioning into residual-surface blocks and repaired blocks; and proceeding at least one 3D image reconstruction, which extends with the initial depth value of the 3D depth image of each of the residual-surface block and covers all the corresponding repaired block to form a repair block and to achieve the purpose of repairing incomplete 3D depth images using 2D image information.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 16, 2020
    Assignee: NATIONAL CENTRAL UNIVERSITY
    Inventors: Yeh-Wei Yu, Chi-Chung Lau, Ching-Cherng Sun, Tsung-Hsun Yang, Tzu-Kai Wang, Jia-Ching Wang, Chien-Yao Wang, Kuan-Chung Wang
  • Publication number: 20200035013
    Abstract: The present invention provides a method for repairing incomplete 3D depth image using 2D image information. The method includes the following steps: obtaining 2D image information and 3D depth image information; dividing 2D image information into 2D reconstruction blocks and 2D reconstruction boundaries, and corresponding to 3D reconstruction of blocks and 3D reconstruction boundaries; analyzing each 3D reconstruction block, partitioning into residual-surface blocks and repaired blocks; and proceeding at least one 3D image reconstruction, which extends with the initial depth value of the 3D depth image of each of the residual-surface block and covers all the corresponding repaired block to form a repair block and to achieve the purpose of repairing incomplete 3D depth images using 2D image information.
    Type: Application
    Filed: November 19, 2018
    Publication date: January 30, 2020
    Inventors: Yeh-Wei YU, Chi-Chung LAU, Ching-Cherng SUN, Tsung-Hsun YANG, Tzu-Kai WANG, Jia-Ching WANG, Chien-Yao WANG, Kuan-Chung WANG
  • Publication number: 20200012932
    Abstract: A machine learning method and a machine learning device are provided. The machine learning method includes: receiving an input signal and performing normalization on the input signal; transmitting the normalized input signal to a convolutional layer; and adding a sparse coding layer after the convolutional layer, wherein the sparse coding layer uses dictionary atoms to reconstruct signals on a projection of the normalized input signal passing through the convolutional layer, and the sparse coding layer receives a mini-batch input to refresh the dictionary atoms.
    Type: Application
    Filed: July 10, 2018
    Publication date: January 9, 2020
    Applicant: National Central University
    Inventors: Jia-Ching Wang, Chien-Yao Wang, Chih-Hsuan Yang
  • Publication number: 20190251421
    Abstract: A source separation method and a source separation device are provided. The source separation method comprises: obtaining at least two source time-frequency signals and a mixed time-frequency signal of the at least two source time-frequency signals; disposing the mixed time-frequency signal at an input layer of a complex-valued deep neural network, and taking the at least two time-frequency signals as a target of the complex-valued deep neural network; calculating a cost function of the complex-valued deep neural network; and performing partial differential to a real part and an imaginary part of a network parameter of the complex-valued deep neural network respectively to minimize the cost function.
    Type: Application
    Filed: March 5, 2018
    Publication date: August 15, 2019
    Applicant: National Central University
    Inventors: Jia-Ching Wang, Yuan-Shan Lee, Shu-Fan Wang, Chien-Yao Wang
  • Patent number: 10346353
    Abstract: An integration device and an integration method thereof are provided. The integration device includes a storage and a processor. The storage stores a first database which includes a plurality of first artifacts. The processor accesses the first database and a second database, and compares each second artifact of the second database with the first artifacts to update the first database.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: July 9, 2019
    Assignee: Institute For Information Industry
    Inventor: Chien Yao Wang
  • Patent number: 10133769
    Abstract: An integration device and an integration method thereof are provided. The integration device executes an artifact integration procedure to integrate the artifacts in a first database and the artifacts in the second database. Based on the access authority of each process role in the first database and the access authority of each process role added from the second database into the first database, the integration device further modifies a plurality of application programming interfaces associated with the integrated artifacts and modifies a plurality of processes according to the modified application programming interfaces. In addition, the integration device further executes a process role integration procedure to integrate the process roles of the first database and the process roles added from the second database into the first database.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: November 20, 2018
    Assignee: Institute For Information Industry
    Inventors: Kai-Hsuan Chan, Yan-Ming Chen, Chien-Yao Wang
  • Publication number: 20180137160
    Abstract: An integration device and an integration method thereof are provided. The integration device executes an artifact integration procedure to integrate the artifacts in a first database and the artifacts in the second database. Based on the access authority of each process role in the first database and the access authority of each process role added from the second database into the first database, the integration device further modifies a plurality of application programming interfaces associated with the integrated artifacts and modifies a plurality of processes according to the modified application programming interfaces. In addition, the integration device further executes a process role integration procedure to integrate the process roles of the first database and the process roles added from the second database into the first database.
    Type: Application
    Filed: November 22, 2016
    Publication date: May 17, 2018
    Inventors: Kai-Hsuan CHAN, Yan-Ming CHEN, Chien-Yao WANG
  • Publication number: 20170124097
    Abstract: An integration device and an integration method thereof are provided. The integration device includes a storage and a processor. The storage stores a first database which includes a plurality of first artifacts. The processor accesses the first database and a second database, and compares each second artifact of the second database with the first artifacts to update the first database.
    Type: Application
    Filed: November 18, 2015
    Publication date: May 4, 2017
    Inventor: Chien Yao WANG