Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

Abstract: An input buffer circuit includes an input differential amplifier unit, a differential amplifier stage, and a buffer. The input differential amplifier unit has input terminals and at least one output terminal, wherein at least two of the input terminals of the input differential amplifier unit are configured to be capacitively coupled respectively so as to provide at least one pair of signal paths for a first input signal and a second input signal of a differential input signal. The differential amplifier stage, coupled to the input differential amplifier unit, has first and second differential input terminals, and a corresponding output terminal, wherein the first and second differential input terminals are capable of being coupled to the first input signal and the second input signal respectively. The buffer, coupled to the output terminal of the differential amplifier stage, is used for outputting an output single-ended signal.

Abstract: An input buffer circuit includes an input differential amplifier unit, a differential amplifier stage, and a buffer. The input differential amplifier unit has input terminals and at least one output terminal, wherein at least two of the input terminals of the input differential amplifier unit are configured to be capacitively coupled respectively so as to provide at least one pair of signal paths for a first input signal and a second input signal of a differential input signal. The differential amplifier stage, coupled to the input differential amplifier unit, has first and second differential input terminals, and a corresponding output terminal, wherein the first and second differential input terminals are capable of being coupled to the first input signal and the second input signal respectively. The buffer, coupled to the output terminal of the differential amplifier stage, is used for outputting an output single-ended signal.

Abstract: A circuit for generating multiphase clock signals and corresponding indication signals is provided. The circuit includes a multiphase clock generation circuit, a DLL circuit, a timing circuit, and a phase comparison circuit. The multiphase clock generation circuit receives an external clock to provide a plurality of first clock signals, phases of which differ from one another. The DLL circuit receives the external clock signal to provide a second clock signal. The timing circuit receives the second clock signal and a comparison signal to provide a plurality of indication signals. Each of the plurality of indication signals has rising edges which lead the rising edges of a corresponding one of the first clock signals. The phase comparison provides the comparison signal if a delayed phase of the corresponding one of the indication signals is within a phase of one of the first clock signals.

Abstract: An anti-fuse circuit including a plurality of programmable units and a test module is provided. The programmable units receive a stress voltage, a program data, and a write enable signal. During a programming period, the programmable units sequentially transmit the program data. When the write enable signal is enabled, the stress voltage stresses the programmable units according to the program data, and the programmable units output programming results for test. The test module is coupled to the programmable units and receives the program data and the programming results. During a test period, the test module compares the programming results with the program data and outputs different logic levels according to a result of the comparison of the first programming results and the program data. A method for anti-fuse programming and test adapted to the foregoing anti-fuse circuit is also provided.

Abstract: An anti-fuse circuit including a plurality of programmable units and a test module is provided. The programmable units receive a stress voltage, a program data, and a write enable signal. During a programming period, the programmable units sequentially transmit the program data. When the write enable signal is enabled, the stress voltage stresses the programmable units according to the program data, and the programmable units output programming results for test. The test module is coupled to the programmable units and receives the program data and the programming results. During a test period, the test module compares the programming results with the program data and outputs different logic levels according to a result of the comparison of the first programming results and the program data. A method for anti-fuse programming and test adapted to the foregoing anti-fuse circuit is also provided.

Abstract: A circuit for generating multiphase clock signals and corresponding indication signals is provided. The circuit includes a multiphase clock generation circuit, a DLL circuit, a timing circuit, and a phase comparison circuit. The multiphase clock generation circuit receives an external clock to provide a plurality of first clock signals, phases of which differ from one another. The DLL circuit receives the external clock signal to provide a second clock signal. The timing circuit receives the second clock signal and a comparison signal to provide a plurality of indication signals. Each of the plurality of indication signals has rising edges which lead the rising edges of a corresponding one of the first clock signals. The phase comparison provides the comparison signal if a delayed phase of the corresponding one of the indication signals is within a phase of one of the first clock signals.

Abstract: A duty cycle correction circuit comprises a duty cycle detector, a filter, an amplifier, a charge pump, a control circuit, and a duty cycle corrector. The duty cycle detector is configured to generate a first pair of control signals according to a pair of internal clock signals. The filter is configured to obtain average voltages of the first pair of control signals. The amplifier is configured to compare output voltages of the filter for generating an enable signal, and the control circuit is configured to generate a selection signal according to the enable signal. The charge pump is configured to generate a second pair of control signals according to the enable signal and the selection signal, and the duty cycle corrector is configured to receive a pair of external clock signals, the first pair of control signals, and the second pair of control signals for generating the pair of internal clock signals with a corrected duty cycle.

Abstract: A duty cycle correction circuit comprises a duty cycle detector, a filter, an amplifier, a charge pump, a control circuit, and a duty cycle corrector. The duty cycle detector is configured to generate a first pair of control signals according to a pair of internal clock signals. The filter is configured to obtain average voltages of the first pair of control signals. The amplifier is configured to compare output voltages of the filter for generating an enable signal, and the control circuit is configured to generate a selection signal according to the enable signal. The charge pump is configured to generate a second pair of control signals according to the enable signal and the selection signal, and the duty cycle corrector is configured to receive a pair of external clock signals, the first pair of control signals, and the second pair of control signals for generating the pair of internal clock signals with a corrected duty cycle.

Abstract: A charge pump cell with an input and output nodes includes a first, second, and third equalization units, and a first, second, and third capacitors. The input node is coupled to the inputs of the first, second and third equalization units, and the output node is coupled to the second equalization unit. One end of the second capacitor is coupled to the control end of the first equalization unit for enabling or disabling the first equalization unit, and also coupled to the output of the third equalization unit. One end of the third capacitor is coupled to the output of the second equalization unit. One end of the first capacitor is coupled to the control ends of the second and third equalization units, and also coupled to the output of the first equalization unit.

Abstract: A charge pump cell with an input and output nodes includes a first, second, and third equalization units, and a first, second, and third capacitors. The input node is coupled to the inputs of the first, second and third equalization units, and the output node is coupled to the second equalization unit. One end of the second capacitor is coupled to the control end of the first equalization unit for enabling or disabling the first equalization unit, and also coupled to the output of the third equalization unit. One end of the third capacitor is coupled to the output of the second equalization unit. One end of the first capacitor is coupled to the control ends of the second and third equalization units, and also coupled to the output of the first equalization unit.

Abstract: A DRAM bit line precharge voltage generator comprises a first amplifier having a first current source and comparing a first voltage with a precharge voltage to control a first PMOS transistor, a second amplifier having a second current source and comparing a second voltage with the precharge voltage to control a second PMOS transistor, a third amplifier having a third current source and comparing a third voltage with the precharge voltage to control a first NMOS transistor, and a fourth amplifier having a fourth current source and comparing the first voltage with the precharge voltage to control a second NMOS transistor. The precharge voltage feedbacks from an output node connected between the second PMOS transistor and the first NMOS transistor.

Abstract: A circuit for providing a reference voltage includes a bandgap reference circuit, the bandgap reference circuit providing a first reference voltage and a data storage. The data storage stores a digital value corresponding to the first reference voltage. A digital to analog converter is coupled to the data storage for providing a second reference voltage corresponding to the digital value. The circuit also includes an output switch circuit responsive to at least one control signal, the output switch circuit providing either the first reference voltage or the second reference voltage to an output node responsive to the control signal.

Abstract: A DRAM bit line precharge voltage generator comprises a first amplifier having a first current source and comparing a first voltage with a precharge voltage to control a first PMOS transistor, a second amplifier having a second current source and comparing a second voltage with the precharge voltage to control a second PMOS transistor, a third amplifier having a third current source and comparing a third voltage with the precharge voltage to control a first NMOS transistor, and a fourth amplifier having a fourth current source and comparing the first voltage with the precharge voltage to control a second NMOS transistor. The precharge voltage feedbacks from an output node connected between the second PMOS transistor and the first NMOS transistor.

Abstract: A circuit for providing a reference voltage includes a bandgap reference circuit, the bandgap reference circuit providing a first reference voltage and a data storage. The data storage stores a digital value corresponding to the first reference voltage. A digital to analog converter is coupled to the data storage for providing a second reference voltage corresponding to the digital value. The circuit also includes an output switch circuit responsive to at least one control signal, the output switch circuit providing either the first reference voltage or the second reference voltage to an output node responsive to the control signal.

Abstract: A device comprising a temperature-dependent self refresh circuit for a memory device is provided where the self refresh circuit includes: a temperature sensor circuit for providing an output that reflects an operation temperature; means for switching the temperature sensor circuit to a low power state during a self refresh operation; an encoder for encoding temperature data from said output; and a programmable oscillator responsive to the encoded data to provide a temperature-dependent refresh signal for the self refresh operation.