Abstract: An electrical connector assembly includes: a male connector, provided with a conductive shell; a first substrate, accommodated in the conductive shell and used to transmit receiving signals; a second substrate, accommodated in the conductive shell and used to transmit sending signals; a shielding sheet, located between the first substrate and the second substrate; a female connector, provided with a first conductive body and a second conductive body; a plurality of first signal terminals, accommodated in the first conductive body and used to transmit receiving signals; and a plurality of second signal terminals, accommodated in the second conductive body and used to transmit sending signals. The first signal terminals and the first substrate are electrically contacted to each other. The second signal terminals and the second substrate are electrically contacted to each other. The first conductive body and/or the second conductive body are used to lap joint with the shielding sheet.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: A heating module for dye sublimation printing on an article comprises a first heating plate, an infrared heating source, and a metal shield. The infrared heating source is disposed under the first heating plate and emits a radiation. The metal shield can prevent the radiation, emitted by the infrared heating source, from projecting directly on the article. The first heating plate preheats a retransfer sheet to be softened and then molded on the article. Consequently, the infrared heating source heats the retransfer sheet for sublimation dye transfer on the article.

Abstract: A heating module for dye sublimation printing on an article comprises a first heating plate, an infrared heating source, and a metal shield. The infrared heating source is disposed under the first heating plate and emits a radiation. The metal shield can prevent the radiation, emitted by the infrared heating source, from projecting directly on the article. The first heating plate preheats a retransfer sheet to be softened and then molded on the article. Consequently, the infrared heating source heats the retransfer sheet for sublimation dye transfer on the article.