Patents by Inventor Chien-Yi HSIEH

Chien-Yi HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152194
    Abstract: A power consumption reduction method can include defining y operation scenarios according to x types of extracted information, generating z power profiles each used for controlling power provided to a subset of a plurality of processors, assigning the z power profiles to the y operation scenarios in a machine learning model, collecting to-be-evaluated information by the plurality of processors, comparing the to-be-evaluated information with the x types of extracted information to find a most similar type of extracted information, using the machine learning model to select an optimal power profile from the z power profiles according to the most similar type of extracted information, and applying the optimal power profile to control the power provided to the subset of the plurality of processors. The subset of the plurality of processors are of the same type of processor. x, y and z can be an integer larger than zero.
    Type: Application
    Filed: August 18, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Wen-Wen Hsieh, Ying-Yi Teng, Chien-Chih Wang
  • Publication number: 20240119200
    Abstract: A method of building a characteristic model includes: acquiring raw electrical data from a measurement system outside one or more processing units; acquiring operational state-related data from an information collector inside the one or more processing units; performing a data annealing process on the raw electrical data and the operational state-related data to obtain and purified electrical data and purified operational state-related data; and performing a machine learning (ML)-based process to build the characteristic model based on the purified electrical data and the purified operational state-related data.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Jen Chen, Chien-Chih Wang, Wen-Wen Hsieh, Ying-Yi Teng
  • Patent number: 11929561
    Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: March 12, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: I-Shu Lee, Chih-Hung Cho, Hau Yuen Tan, Chien-Yi Wu, Po-Sheng Chen, Chao-Hsu Wu, Yi Chen, Hung-Ming Yu, Chih-Chien Hsieh
  • Publication number: 20170295831
    Abstract: A defrosting tray includes a metal substrate, a thermal conductive ceramic coating formed on the top surface of the metal substrate, and an inorganic nanocoating formed on a top surface of the thermal conductive ceramic coating. The thermal conductive ceramic coating is configured to enhance a heat transfer capability of the metal substrate. In particular, the first ceramic coating and the first inorganic nanocoating together define a defrosting surface with sub-micron pyramidal arrays.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 19, 2017
    Inventor: Chien-Yi HSIEH
  • Publication number: 20170298624
    Abstract: This invention relates to a suspended ceiling, comprising a metal grid structure and a plurality of drop-in ceiling panels supported by the metal grid structure. Each of the ceiling panels includes a thermal conductive metal substrate, a heat insulating coating formed on the top surface of the metal substrate, and a thermal conductive ceramic coating formed on the bottom surface of the metal substrate. The heat insulating coating is provided to prevent heat generated in a plenum space between the dropped ceiling and a actual ceiling from traveling down to the room below the dropped ceiling. And, the thermal conductive ceramic coating is provided to enhance a heat transfer capability of the metal substrate. As such, the ceiling panels can facilitate rapid cooling of an air-conditioned room.
    Type: Application
    Filed: April 13, 2016
    Publication date: October 19, 2017
    Inventor: Chien-Yi HSIEH