Abstract: An electronic device including a metal casing and at least one antenna module is provided. The metal casing includes at least one window. The at least one antenna module is disposed in the at least one window. The at least one antenna module includes a first radiator and a second radiator. The first radiator includes a feeding end, a first ground end joined to the metal casing, a second ground end, a first portion extending from the feeding end to the first ground end, and a second portion extending from the feeding end to the second ground end. A first coupling gap is between the second radiator and the first portion. A second coupling gap is between at least part of the second radiator and the metal casing, and the second radiator includes a third ground end joined to the metal casing.

Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: An antenna module includes first to third radiators and a ground radiator. The first radiator includes first and second sections and excites at a first frequency band. An extension direction of the first section, including a feeding end, is not parallel to an extension direction of the second section. The second radiator includes third and fourth sections. The third section extends from an intersection of the first and second sections. The third section excites at a second frequency band. The third radiator is disposed beside the first radiator and away from the second radiator. The ground radiator is disposed on one side of the first, second, and third radiators, and includes a ground end. The fourth section of the second radiator is connected to the third section and the ground radiator. The third radiator is connected to the ground end.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: An electronic device is provided here, which includes a casing, a keycap and a keyboard backlight module. The casing has a first opening. The keycap is disposed corresponding to the first opening, and a gap is formed between the keycap and a periphery of the first opening. The keyboard backlight module includes a shielding layer, the shielding layer includes a light transmission area corresponding to the first opening and a light block portion, and the light block portion is located in the light transmission area and covers a region where at least one light path passes through the gap and intersects the light transmission area through.

Abstract: The electronic device provided includes a housing with two first through holes and two second through holes, a light guiding structure, and a light source. A first section is provided between the two first through holes, and a second section is provided between the two second through holes. The length of the first section is less than the length of the second section. The light guiding structure includes a light guiding layer, a diffusion layer, and a light adjusting layer. The light adjusting layer is disposed at the position of the first section. The light source is disposed at a position that corresponds to an intersection of the first section and the second section. Light emitted by the light source passes through the light transmitting portion and the intersection, and is separately emitted through the first through holes and the second through holes along the light transmitting portion.

Abstract: The electronic device provided includes a housing with two first through holes and two second through holes, a light guiding structure, and a light source. A first section is provided between the two first through holes, and a second section is provided between the two second through holes. The length of the first section is less than the length of the second section. The light guiding structure includes a light guiding layer, a diffusion layer, and a light adjusting layer. . The light adjusting layer is disposed at the position of the first section. The light source is disposed at a position that corresponds to an intersection of the first section and the second section. Light emitted by the light source passes through the light transmitting portion and the intersection, and is separately emitted through the first through holes and the second through holes along the light transmitting portion.

Abstract: An electronic device is provided here, which includes a casing, a keycap and a keyboard backlight module. The casing has a first opening. The keycap is disposed corresponding to the first opening, and a gap is formed between the keycap and a periphery of the first opening. The keyboard backlight module includes a shielding layer, the shielding layer includes a light transmission area corresponding to the first opening and a light block portion, and the light block portion is located in the light transmission area and covers a region where at least one light path passes through the gap and intersects the light transmission area through.

Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.

Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.

Abstract: A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured.

Abstract: A molded fluorescent plastic lens and a manufacturing method thereof are disclosed. The fluorescent material 3 is attached on surface of plastic preform or a cavity of a mold core of a mold. By plastic molding, the plastic preform is heated, pressured and cast into a molded fluorescent plastic lens with a fluorescent surface. Thus the molded fluorescent plastic lens not only has shape and optical properties of the molded forming lens, but also has fluorescent properties from a fluorescent surface layer formed by fluorescent material inserted into the plastic. Thus the produced molded fluorescent plastic lens is applied to road reflectors, white light LED or other optical elements for use.

Abstract: A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element.

Abstract: The present invention discloses an external optical disk drive assembly, which comprises a slim internal optical disk drive including a first transmission port; and an external module being disposed outside the slim internal optical disk drive and electrically coupled to the first transmission port, so that the slim internal optical disk drive is converted into the external optical disk drive, characterized in that the external module is disposed within the area covered by the slim internal optical disk drive.

Abstract: A molded fluorescent glass lens and a manufacturing method thereof are disclosed. Firstly, coat fluorescent material on surface of a glass preform or a cavity of a mold core. Then by glass precision molding, the mold core is heated and pressured for casting the glass preform into a molded fluorescent glass lens. The fluorescent glass lens not only has shape and optical properties of the molded forming lens, but also has fluorescent properties from a fluorescent surface layer formed by fluorescent material inserted into the glass. Thus the produced molded fluorescent glass lens is applied to road reflectors, white light LED or other optical elements for use.

Abstract: A loader module of an optical access apparatus is provided. The optical access apparatus has a main control printed circuit board (PCB). The loader module comprises an optical pick-up head, a drive unit, a first signal line, a second signal line and a non-volatile memory (NVM). The first signal line is configured to electrically connect the optical pick-up head, the drive unit and the main control PCB. The second signal line is configured to electrically connect the NVM and the main control PCB. The NVM is configured to store control information. The control information is transmitted to the main control PCB via the second signal line so that the main control PCB can control the loader module.

Abstract: A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having greater flexibility than the non-working zone, and are of the same thickness and material. The interconnecting zones are defined by flexible circuit board member such that the interconnecting zones can be quickly cut off using a single machine during processing of the rigid-flex printed circuit board module. Thus, the speed of separating the working zone from the non-working zone can be increased, and costs and time associated with processing and manufacturing can be reduced. Additionally, the processing flow can be simplified, and the product quality of the working zone after cutting can be ensured.