Abstract: An electronic device including a substrate with a trench and an inductor disposed on the substrate is provided. The inductor includes a first conductive layer and a second conductive layer. The first conductive layer is conformally disposed on the substrate. At least a portion of the first conductive layer is disposed in the trench. The first conductive layer has a first end portion and a second end portion. The second conductive layer is conformally disposed on the first conductive layer. The second conductive layer has a first end portion and a second end portion on the first end portion of the first conductive layer and the second end portion of the first conductive layer, respectively. The first end portion of the second conductive layer is electrically connected with the second end portion of the first conductive layer.

Abstract: A process-management system and a process-management method are provided. The process-management system includes a process-planning module, a process-management module, and a process-executing module. The process-planning module stores a preset workflow and is configured to receive a first input instruction and a second input instruction. The process-planning module provides the preset workflow according to the first input instruction, and adjusts the preset workflow according to the second input instruction to generate a customized workflow. The process-management module is electrically connected to the process-planning module and is configured to generate a work instruction according to the preset workflow or the customized workflow. The process-executing module is electrically connected to the process-management module and configured to process a workpiece according to the work instruction.

Abstract: An electronic device capable of discharging static electricity is disclosed. The electronic device includes a housing, an antenna arrangement region, and an electrostatic discharge guide. The antenna arrangement region is disposed inside the housing. The electrostatic discharge guide includes a first conductive region, a second conductive region, a non-conductive region, and a discharging unit. The first conductive region is disposed on an inner surface of the housing, and the antenna arrangement region is disposed in the first conductive region. The second conductive region is disposed on the inner surface of the housing. The discharging unit is located in the first conductive region and has a tip, the tip extends toward the second conductive region to cause a spacing between the tip and the second conductive region to be less than or equal to a width of the non-conductive region.

Abstract: A radiofrequency filter includes a substrate, an isolation structure, an electrically conductive structure, a spacer structure, a dielectric layer, a patterned electrically conductive film, a first contact structure, and a second contact structure. The isolation structure is disposed in the substrate. The electrically conductive structure is disposed on the isolation structure. The spacer structure is disposed on the substrate and located on a sidewall of the electrically conductive structure. The dielectric layer is disposed on the electrically conductive structure. The patterned electrically conductive film is disposed on the dielectric layer. At least a part of the dielectric layer is located between the electrically conductive structure and the patterned electrically conductive film in a vertical direction. The first contact structure and the second contact structure are disposed on and electrically connected with the patterned electrically conductive film.

Abstract: A processing path generating method includes the following steps. An image-capturing device is moved to the first position of the region of interest to perform an image-capture on a workpiece, so as to obtain a first image. The image-capturing device is moved to a second position to perform the image-capture on the workpiece, so as to obtain a second image. A first edge characteristic and a second edge characteristic of the workpiece are obtained according to the first image and the second image. Three-dimensional edge information of the workpiece is fitted according to the first edge characteristic and the second edge characteristic. A processing path is generated according to the three-dimensional edge information.

Abstract: An electronic device capable of discharging static electricity is disclosed. The electronic device includes a housing, an antenna arrangement region, and an electrostatic discharge guide. The antenna arrangement region is disposed inside the housing. The electrostatic discharge guide includes a first conductive region, a second conductive region, a non-conductive region, and a discharging unit. The first conductive region is disposed on an inner surface of the housing, and the antenna arrangement region is disposed in the first conductive region. The second conductive region is disposed on the inner surface of the housing. The discharging unit is located in the first conductive region and has a tip, the tip extends toward the second conductive region to cause a spacing between the tip and the second conductive region to be less than or equal to a width of the non-conductive region.

Abstract: A contour accuracy measuring system and a contour accuracy measuring method are provided. The contour accuracy measuring system captures location coordinate data of shafts of a machine tool. The location coordinate data are calculated to obtain a first true round trajectory on an inclined plane as reference information. The contour accuracy measuring system then adjusts parameters of the locations of the shafts based on the location coordinate data of the shafts of the reference information to generate a second true round trajectory on the inclined plane, so as to get to know whether the locations of the shafts after the parameters are adjusted comply with a standard. Therefore, the overall measurement process can be speeded up by automatically measuring the parameters and automatically testing an operating status.

Abstract: Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

Abstract: Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

Abstract: An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

Abstract: An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.

Abstract: A contour accuracy measuring system and a contour accuracy measuring method are provided. The contour accuracy measuring system captures location coordinate data of shafts of a machine tool. The location coordinate data are calculated to obtain a first true round trajectory on an inclined plane as reference information. The contour accuracy measuring system then adjusts parameters of the locations of the shafts based on the location coordinate data of the shafts of the reference information to generate a second true round trajectory on the inclined plane, so as to get to know whether the locations of the shafts after the parameters are adjusted comply with a standard. Therefore, the overall measurement process can be speeded up by automatically measuring the parameters and automatically testing an operating status.

Abstract: Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.

Abstract: A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.

Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.

Abstract: A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

Abstract: An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.