Abstract: A cooling device includes a heat sink (10), a fan (30), and a fan duct (50) covering the heat sink and fan therein. The heat sink includes a base (12) defining at least a through hole (18) at each of two opposite sides thereof. The fan duct comprises a top wall (52) and two side walls (54). A mounting portion (60) extends outwardly from a bottom of each side wall and has at least a tube (64) defining a mounting hole (640) in an outer wall thereof. A plurality of pins (70) extends through the through holes into the tubes. The pins have retaining rings (74) abutting against a bottom surface (120) of the base of the heat sink, and hooks (76) locked in the mounting holes.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A method for controlling the rotating speed of a fan is disclosed. The method includes the steps of: reading a standard temperature Tc of a central processing unit (CPU); reading a thermal diode's temperature Td and a system ambient temperature Ta; comparing Td with a minimum temperature Tl, such that the fan begins processing the heat of the CPU begins; if Td>Tl, increasing pulse-width modulation (PWM) duty cycle of the fan to 100%; if Td<=Tl, comparing a critical temperature T0 with Ta; if Ta>T0, increasing PWM fan duty cycle to 100%; if Ta<=T0, setting the fan duty cycle at 40%; sending the PWM fan duty cycle to a fan speed controller.

Abstract: A method for controlling the rotating speed of a fan is disclosed. The method includes the steps of: reading a standard temperature Tc of a central processing unit (CPU); reading a thermal diode's temperature Td and a system ambient temperature Ta; comparing Td with a minimum temperature Tl, such that the fan begins processing the heat of the CPU begins; if Td>Tl, increasing pulse-width modulation (PWM) duty cycle of the fan to 100%; if Td<=Tl, comparing a critical temperature T0 with Ta; if Ta>T0, increasing PWM fan duty cycle to 100%; if Ta<=T0, setting the fan duty cycle at 40%; sending the PWM fan duty cycle to a fan speed controller.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A cooling device includes a heat sink (10), a fan (30), and a fan duct (50) covering the heat sink and fan therein. The heat sink includes a base (12) defining at least a through hole (18) at each of two opposite sides thereof. The fan duct comprises a top wall (52) and two side walls (54). A mounting portion (60) extends outwardly from a bottom of each side wall and has at least a tube (64) defining a mounting hole (640) in an outer wall thereof. A plurality of pins (70) extends through the through holes into the tubes. The pins have retaining rings (74) abutting against a bottom surface (120) of the base of the heat sink, and hooks (76) locked in the mounting holes.