Abstract: An electronic device including a metal casing and at least one antenna module is provided. The metal casing includes at least one window. The at least one antenna module is disposed in the at least one window. The at least one antenna module includes a first radiator and a second radiator. The first radiator includes a feeding end, a first ground end joined to the metal casing, a second ground end, a first portion extending from the feeding end to the first ground end, and a second portion extending from the feeding end to the second ground end. A first coupling gap is between the second radiator and the first portion. A second coupling gap is between at least part of the second radiator and the metal casing, and the second radiator includes a third ground end joined to the metal casing.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: An antenna module includes first to third radiators and a ground radiator. The first radiator includes first and second sections and excites at a first frequency band. An extension direction of the first section, including a feeding end, is not parallel to an extension direction of the second section. The second radiator includes third and fourth sections. The third section extends from an intersection of the first and second sections. The third section excites at a second frequency band. The third radiator is disposed beside the first radiator and away from the second radiator. The ground radiator is disposed on one side of the first, second, and third radiators, and includes a ground end. The fourth section of the second radiator is connected to the third section and the ground radiator. The third radiator is connected to the ground end.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.

Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: An electronic device including a metal back cover, a metal frame, a first radiator and a second radiator is provided. The metal frame includes a disconnected part and two connecting parts, the two connecting parts are located at two sides of the disconnected part, separated from the disconnected part and connected to the metal back cover. A U-shaped slot is formed between the disconnected part and the metal back cover, and between the disconnected part and the two connecting parts. The first radiator is located beside the disconnected part and includes a feeding end and a first connecting end away from the feeding end, and the first connecting end is connected to the disconnected part. The second radiator is located beside the disconnected part, and includes a ground end and a second connecting end opposite to each other. The ground end is connected to the metal back cover.

Abstract: An electronic device includes a metal back cover, a metal frame, and two radiators. The metal frame disposed at a side of the metal back cover includes two disconnecting parts, a second slot, and two connecting parts. A first slot is formed between each of the disconnecting parts and the metal back cover. The second slot is formed between the two disconnecting parts. The two connecting parts are connected to a side away from the second slot of the two disconnecting parts respectively and are connected to the metal back cover. Each of the radiators connects the metal back cover to the corresponding disconnecting part over the first slot. The two radiators are disposed symmetrically based on the second slot. Each radiator is coupled with the corresponding disconnecting part, the corresponding connecting part, and the metal back cover to resonate a first, a second, and a third frequency band.

Abstract: An electronic device includes a casing, a circuit board and at least one antenna module. The casing has an accommodating space and an inner side wall surrounding the accommodating space. The circuit board is disposed in the accommodating space. Each of the antenna modules includes a first radiator and a second radiator. The first radiator is disposed on the circuit board and adjacent to the inner side wall, and includes a first section, a second section and a third section extending from the first section in opposite directions respectively. The first section includes a feeding end, and the third section includes a grounding end. The second radiator is disposed on the inner side wall. A coupling gap is formed between the first radiator and the second radiator.

Abstract: An electronic device including a metal bottom plate, a metal frame and at least one radiator is provided. The metal bottom plate includes at least one ground terminal. The metal frame includes at least one slot, at least one disconnecting part, at least one first connecting part and at least one second connecting part. The disconnecting part includes a first part and a second part. Each radiator includes a first terminal and a second terminal. The second terminal is connected to a junction between the first part and the second part. The first terminal, the second terminal, the first part, the first connecting part and the ground terminal form a first antenna path radiating at a first frequency band. The first terminal, the second terminal, the second part, the second connecting part and the ground terminal form a second antenna path radiating at a second frequency band.

Abstract: An antenna module includes a first, a second, a third radiators, and a ground radiator. The first radiator includes a first section and a second section. The second radiator is connected to the first radiator, and includes a third section and a fourth section connected to each other. The fourth section includes a feed end. The third radiator is connected to the third section of the second radiator. The ground radiator is connected to the third radiator. The first, the second, the third, and the ground radiator are sequentially connected in a bent manner to form a stepped shape. The first section of the first radiator and the fourth section of the second radiator jointly resonate at a low frequency band, and the second section of the first radiator, the second radiator, the third radiator, and the ground radiator jointly resonate at a high frequency band.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: An antenna module includes first, second, third antenna radiators, and first, second, third ground radiators. The first antenna radiator includes a first feeding terminal. The second antenna radiator extends from the first antenna radiator. The third antenna radiator extends from the first feeding terminal. The first ground radiator is disposed beside the first and second antenna radiators. A first coupling gap exists between the first ground radiator and the first and second antenna radiators. The second ground radiator is disposed beside the second antenna radiator. A second coupling gap exists between the second ground radiator and the second antenna radiator. The third ground radiator is disposed beside the first and second antenna radiators. A third coupling gap exists between the third ground radiator and the first antenna radiator. A fourth coupling gap exists between the third ground radiator and the second antenna radiator.

Abstract: An electronic device including a metal housing, a first antenna module, and a second antenna module is disclosed. The metal housing includes a back cover and a frame, the frame is located on a side of the back cover, and a slot is arranged between the back cover and the frame. The frame includes two slits and a segment, and the two slits are connected with the slot to form a U shape. The segment is surrounded by the two slits and the slot. The first antenna module includes an antenna radiator formed by the segment. The antenna radiator is coupled to the back cover across the slot through multiple connecting portions. The second antenna module is disposed on the connecting portions to be coupled to the back cover and grounded, and an antenna coupling gap exists between the second antenna module and the frame.

Abstract: An antenna module includes a first radiator, a ground plane and a second radiator. The first radiator includes a first section and a second section. The first section includes a first end and a second end. The first end is a feeding end, and the second end is connected to the second section. The first section includes first parts bent back and forth along a first direction, the second section includes second parts bent back and forth along a second direction, and an included angle formed between the first direction and the second direction is 60 degrees to 120 degrees. The ground plane is disposed beside the first section of the first radiator. An end of the second radiator is connected to the feeding end of the first radiator, and the other end of the second radiator is vertically connected to the ground plane.