Patents by Inventor Chien-Ying Tseng

Chien-Ying Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional printing apparatus
    Patent number: 9855706
    Abstract: A 3-D printing apparatus including a base and a printing head module is provided. The base includes a first supplying platform, a printing bed and a second supplying platform disposed in order along a printing path. The first supplying platform and the second supplying platform carry building powder respectively; the first supplying platform and the second supplying platform are alternately lifted to a printing-reference plane of the base for supplying the building powder to the printing bed. The printing head module is movably disposed above the base and configured to move along a forward direction of the print path to transfer the building powder of the first supplying platform onto the printing bed, and move along a backward direction of the printing path to transfer building powder of the second supplying platform onto the printing bed to form bonded powder layers stacked together to form a 3-D object.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: January 2, 2018
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Shih-Jer Din, Ming-Chih Huang, Chien-Ying Tseng
  • THREE DIMENSIONAL PRINTING APPARATUS
    Publication number: 20160221263
    Abstract: A 3-D printing apparatus including a base and a printing head module is provided. The base includes a first supplying platform, a printing bed and a second supplying platform disposed in order along a printing path. The first supplying platform and the second supplying platform carry building powder respectively; the first supplying platform and the second supplying platform are alternately lifted to a printing-reference plane of the base for supplying the building powder to the printing bed. The printing head module is movably disposed above the base and configured to move along a forward direction of the print path to transfer the building powder of the first supplying platform onto the printing bed, and move along a backward direction of the printing path to transfer building powder of the second supplying platform onto the printing bed to form bonded powder layers stacked together to form a 3-D object.
    Type: Application
    Filed: April 30, 2015
    Publication date: August 4, 2016
    Inventors: Shih-Jer Din, Ming-Chih Huang, Chien-Ying Tseng