Abstract: An exemplary securing structure includes a base, a fastener, and a spring mounted around the fastener. The base defines a through hole, and two slots located adjacent to and communicating with the securing hole. Two barriers are formed at a bottom of the base corresponding to the slots. A gap is defined between the bottom surface and each of the barriers. The fastener includes a head, a bolt, and two blocks extending outwardly from a periphery of the bolt corresponding to the slots, respectively. When the bolt is extended through the securing hole with the blocks extending through the slots until the blocks are received in the gaps, the fastener is then rotatable to cause the block to escape from the gap and abut on the bottom surface of the base, with the spring resiliently compressed between the head of the fastener and a top side of the base.

Abstract: An exemplary securing structure includes a base, a fastener, and a spring mounted around the fastener. The base defines a securing hole, and two slots located aside the securing hole and communicating with the securing hole. The fastener includes a head, a bolt extending downwardly from the head, and two blocks extending outwardly from an outer periphery of the bolt corresponding to the slots. The bolt is extendable through the securing hole together with the blocks extending through the slots, respectively. The fastener is then rotatable to a position such that the blocks abuts a bottom side of the base. The spring is resiliently compressed between the head of the fastener and a top side of the base.

Abstract: An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.

Abstract: A liquid cooling apparatus for cooling an inversely mounted electronic component, includes a casing defining a receiving room therein, a diaphragm, a partition plate forming a nozzle thereon, and a piezoelectric element attached to the diaphragm in such a manner that a vibrating direction thereof is perpendicular to the diaphragm. The diaphragm is arranged in the receiving room and divides the receiving room into a top first chamber and a bottom second chamber isolated from each other. The partition plate is arranged in the first chamber and divides the first chamber into an upper region and a lower region. The lower region is filled with a working fluid. When the diaphragm is driven to vibrate upwardly by the piezoelectric element, the diaphragm pushes the working fluid in the lower region of the first chamber to the upper region of the first chamber via the nozzle.

Abstract: An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.

Abstract: An airflow generator includes stacked airflow-generating units. Each airflow-generating unit includes a casing, first and second vibrating diaphragms received in the casing and spaced from each other, first and second driving members for driving the first and second vibrating diaphragms, and a nozzle connected to the casing. An inner space of the casing is divided into a first chamber formed between the first and second vibrating diaphragms, and a second chamber and a third chamber located at two opposite sides of the first chamber. The first driving member includes a first movable magnet attached to the first vibrating diaphragm, and a first stationary magnet received in the second chamber and attached to the casing. The second driving member includes a second movable magnet attached to the second vibrating diaphragm, and a second stationary magnet received in the third chamber and attached to the casing.

Abstract: An exemplary securing structure includes a base, a fastener, and a spring mounted around the fastener. The base defines a through hole, and two slots located adjacent to and communicating with the securing hole. Two barriers are formed at a bottom of the base corresponding to the slots. A gap is defined between the bottom surface and each of the barriers. The fastener includes a head, a bolt, and two blocks extending outwardly from a periphery of the bolt corresponding to the slots, respectively. When the bolt is extended through the securing hole with the blocks extending through the slots until the blocks are received in the gaps, the fastener is then rotatable to cause the block to escape from the gap and abut on the bottom surface of the base, with the spring resiliently compressed between the head of the fastener and a top side of the base.

Abstract: A heat dissipation apparatus includes a heat sink defining a plurality of air passages therein, and an airflow generator arranged on the heat sink and including a plurality of airflow-generating units. Each airflow-generating unit includes a casing, and a vibration diaphragm and a driving member arranged in the casing. The vibration diaphragm divides an inner space of the casing into first and second chamber isolated from each other. The second chamber communicates with the exterior via an orifice defined in a bottom wall of the casing. The driving member is capable of vibrating the vibration diaphragm when alternating voltage is applied thereto. When the driving member vibrates the vibration diaphragm towards the bottom wall of the casing, the vibration diaphragm compresses the air inside the second chamber of the casing towards the orifice, generating airflow from the orifice to the air passages of the heat sink.

Abstract: An exemplary securing structure includes a base, a fastener, and a spring mounted around the fastener. The base defines a securing hole, and two slots located aside the securing hole and communicating with the securing hole. The fastener includes a head, a bolt extending downwardly from the head, and two blocks extending outwardly from an outer periphery of the bolt corresponding to the slots. The bolt is extendable through the securing hole together with the blocks extending through the slots, respectively. The fastener is then rotatable to a position such that the blocks abuts a bottom side of the base. The spring is resiliently compressed between the head of the fastener and a top side of the base.

Abstract: An exemplary heat dissipation device includes a heat sink defining a plurality of air passages therein, and an airflow generator disposed at a side of the heat sink. The airflow generator includes airflow-generating units stacked together. Each airflow-generating unit includes a casing in which two spaced vibration diaphragms are received, and a nozzle connected to the casing. A chamber is defined between the two vibration diaphragms within the casing. The nozzle defines an air channel therein for communicating the chamber with an exterior of the casing. Two piezoelectric elements are respectively attached to the two vibration diaphragms. When the two piezoelectric elements drive the two vibration diaphragms towards each other, the two vibration diaphragms compress the air in the chamber and drive the air towards the air channel of the nozzle, thereby generating an airflow from the nozzle towards the air passages of the heat sink.

Abstract: A liquid cooling apparatus for cooling an inversely mounted electronic component, includes a casing defining a receiving room therein, a diaphragm, a partition plate forming a nozzle thereon, and a piezoelectric element attached to the diaphragm in such a manner that that a vibrating direction thereof is perpendicular to the diaphragm. The diaphragm is arranged in the receiving room and divides the receiving room into a top first chamber and a bottom second chamber isolated from each other. The partition plate is arranged in the first chamber and divides the first chamber into an upper region and a lower region. The lower region is filled with a working fluid. When the diaphragm is driven to vibrate upwardly by the piezoelectric element, the diaphragm pushes the working fluid in the lower region of the first chamber to the upper region of the first chamber via the nozzle.

Abstract: An exemplary miniaturized liquid cooling device includes a base, a closed loop pipe and electrode units formed on the base. The loop pipe has a pipe body defining a loop passage therein for accommodating a working fluid. A hydrophobic layer is formed on an inner surface of the pipe body. The electrode units are spaced from each other along the loop pipe. Each electrode unit comprises a first electrode and an opposite second electrode. The first and the second electrodes of each electrode unit are located at two sides of the pipe body of the loop pipe to sandwich the pipe body therebetween. A first dielectric layer is formed between the first electrode and an outer surface of the pipe body. A second dielectric layer is formed between the second electrode and the outer surface of the pipe body.