Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. The electronic component is coupled to the first substrate top side and coupled to the connector structure. The lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A method of manufacturing an optical component having micro-structures is described. The method detects a crystallization temperature within a crystallization temperature interval for fully filling the molding material into a mold cavity to rapidly produce the optical element having a micro-structure with a large area.

Abstract: A connector assembling structure is provided. The connector assembling structure includes a shell, a circuit board, a connector, a fixing member, and an elastic member. The circuit board is disposed on the shell. The connector is disposed on the circuit board. The fixing member is fixed on the shell. The elastic member is disposed on the fixing member. The circuit board includes a pillar. The fixing member includes a fixing member opening corresponding to the pillar. The pillar passes through the fixing member opening. The size of the fixing member opening is greater than the size of the pillar, such that the circuit board and the elastic member may move relative to the fixing member through the fixing member opening.

Abstract: A connector assembling structure is provided. The connector assembling structure includes a shell, a circuit board, a connector, a fixing member, and an elastic member. The circuit board is disposed on the shell. The connector is disposed on the circuit board. The fixing member is fixed on the shell. The elastic member is disposed on the fixing member. The circuit board includes a pillar. The fixing member includes a fixing member opening corresponding to the pillar. The pillar passes through the fixing member opening. The size of the fixing member opening is greater than the size of the pillar, such that the circuit board and the elastic member may move relative to the fixing member through the fixing member opening.

Abstract: A method of manufacturing an optical component having micro-structures is described. The method detects a crystallization temperature within a crystallization temperature interval for fully filling the molding material into a mold cavity to rapidly produce the optical element having a micro-structure with a large area.

Abstract: A headband adjustment structure includes a rotary adjusting assembly, a wearing unit having an adjustable accommodation space, a cable management module located between the wearing unit and the rotary adjusting assembly for carrying a cable, an adjustment gear set linkably coupled to the cable management module, and a driving rotation shaft set passing through the wearing unit and the cable management module, and linkably coupled to the wearing unit and the adjustment gear set, and coaxially connected to the rotary adjusting assembly. When the rotary adjusting assembly rotates the driving rotation shaft set, the driving rotation shaft set synchronously moves the wearing unit to adjust the adjustable accommodation space, and moves the cable management module through the adjustment gear set. The amount of the movement of the cable management module is different from that of the wearing unit.

Abstract: A headband adjustment structure includes a rotary adjusting assembly, a wearing unit having an adjustable accommodation space, a cable management module located between the wearing unit and the rotary adjusting assembly for carrying a cable, an adjustment gear set linkably coupled to the cable management module, and a driving rotation shaft set passing through the wearing unit and the cable management module, and linkably coupled to the wearing unit and the adjustment gear set, and coaxially connected to the rotary adjusting assembly. When the rotary adjusting assembly rotates the driving rotation shaft set, the driving rotation shaft set synchronously moves the wearing unit to adjust the adjustable accommodation space, and moves the cable management module through the adjustment gear set. The amount of the movement of the cable management module is different from that of the wearing unit.

Abstract: A method of manufacturing an optical component having micro-structures is described. The method detects a crystallization temperature within a crystallization temperature interval for fully filling the molding material into a mold cavity to rapidly produce the optical element having a micro-structure with a large area.