Abstract: A robotic arm system includes first robotic arm, second robotic arm and main controller. The first robotic arm and the second robotic arm are configured to grab object. The main controller is configured to: determine whether first force vector of first force applied by the first robotic arm to the object is equal to second force vector of second force applied by the second robotic arm to the object; when the first force vector and the second force vector are not equal, obtain a first difference between the first force vector and the second force vector; and according to the first difference, change at least one of the first force applied by the first robotic arm to the object and the second force applied by the second robotic arm to the object so that the first force vector and the second force vector are equal.

Abstract: A media docking device includes an input circuit, an output circuit and a processing circuit. The input circuit is electrically connected to a media source device for receiving media data. The output circuit is electrically connected to a media play device. The processing circuit is electrically connected to the input circuit and the output circuit. The processing circuit determines if a verification procedure is passed. If the verification procedure is passed, the processing circuit transfers the media data to the media play device. If the verification procedure is not passed, the processing circuit limits a transmission of the media data, such that the media data will not be completely played by the media play device.

Abstract: A media docking device includes an input module, an output module and a processing module. The input module is electrically connected to a media source device for receiving media data. The output module is electrically connected to a media play device. The processing module determines if an instruction is received from the media source device or a remote device. If the instruction is not received, the processing module transfers the media data to the output module to transmit to the media play device. If the instruction is received, the processing module limits a transmission of the media data according to the instruction, such that the media data will not be completely played by the media play device.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

Abstract: An active circuit includes an active element, an input unit, and a bypass unit. The active element is coupled to an output terminal of the active circuit for outputting an output signal. The input unit is coupled to an input terminal of the active circuit, and is coupled to an input terminal of the active element through a node. The input unit adjusts a capacitance value of the input unit according to a first control signal. The bypass unit is coupled to an output terminal of the input unit through the node, and is coupled to the output terminal of the active circuit. The bypass unit turns on or off a signal bypassing path according to a second control signal.

Abstract: An active circuit includes an active element, an input unit, and a bypass unit. The active element is coupled to an output terminal of the active circuit for outputting an output signal. The input unit is coupled to an input terminal of the active circuit, and is coupled to an input terminal of the active element through a node. The input unit adjusts a capacitance value of the input unit according to a first control signal. The bypass unit is coupled to an output terminal of the input unit through the node, and is coupled to the output terminal of the active circuit. The bypass unit turns on or off a signal bypassing path according to a second control signal.

Abstract: In general, techniques are described for delegating responsibility for performing a connectivity protocol from one or more endpoint devices to network infrastructure situated along a network forwarding path connecting the endpoint devices. In some examples, an intermediate network device includes a connectivity protocol module of control unit that operates a connectivity protocol session on behalf of a server, wherein the server exchanges application data with the client using an application-layer communication session with the client. The connectivity protocol module monitors connectivity for the application-layer communication session with the connectivity protocol session by exchanging connectivity protocol messages for the connectivity protocol session with the client to determine a connectivity status for the communication session.

Abstract: A method for lithography exposing process is provided. The method includes performing a first lithography exposing process to a resist layer using a mask having a focus-sensitive pattern and an energy-sensitive pattern; measuring critical dimensions (CDs) of transferred focus-sensitive pattern and transferred energy-sensitive pattern on the resist layer; extracting Bossung curves from the CDs; and determining slopes of the Bossung curves.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

Abstract: In general, techniques are described for delegating responsibility for performing a connectivity protocol from one or more endpoint devices to network infrastructure situated along a network forwarding path connecting the endpoint devices. In some examples, an intermediate network device includes a connectivity protocol module of control unit that operates a connectivity protocol session on behalf of a server, wherein the server exchanges application data with the client using an application-layer communication session with the client. The connectivity protocol module monitors connectivity for the application-layer communication session with the connectivity protocol session by exchanging connectivity protocol messages for the connectivity protocol session with the client to determine a connectivity status for the communication session.

Abstract: A frequency-shift keying (FSK) receiver includes an injection-locking oscillating circuit to receive a FSK input signal, and a phase detecting circuit. The injection-locking oscillating circuit outputs a locked signal having a phase that tracks a phase of the FSK input signal. A difference between the phases of the FSK input signal and the locked signal is associated with a difference between a frequency of the FSK input signal and a free-running frequency of the injection-locking oscillating circuit. The phase detecting circuit receives the FSK input signal and the locked signal, and outputs a baseband logic signal according to the difference between the phases of the FSK input signal and the locked signal.

Abstract: A method for lithography exposing process is provided. The method includes performing a first lithography exposing process to a resist layer using a mask having a focus-sensitive pattern and an energy-sensitive pattern; measuring critical dimensions (CDs) of transferred focus-sensitive pattern and transferred energy-sensitive pattern on the resist layer; extracting Bossung curves from the CDs; and determining slops of the Bossung curves.

Abstract: A frequency-shift keying (FSK) receiver includes an injection-locking oscillating circuit to receive a FSK input signal, and a phase detecting circuit. The injection-locking oscillating circuit outputs a locked signal having a phase that tracks a phase of the FSK input signal. A difference between the phases of the FSK input signal and the locked signal is associated with a difference between a frequency of the FSK input signal and a free-running frequency of the injection-locking oscillating circuit. The phase detecting circuit receives the FSK input signal and the locked signal, and outputs a baseband logic signal according to the difference between the phases of the FSK input signal and the locked signal.