Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A chainwheel has a chainwheel body, a first combining hole set and a second combining hole set. The chainwheel body has a center point. The first combining hole set has multiple first combining holes that are formed through the chainwheel body. The first distances between the first combining holes and the center point are equal. The second combining hole set has multiple second combining holes that are formed through the chainwheel body. The second distances between the second combining holes and the center point are equal. The second distance is longer than the first distance. Therefore, the chainwheel can be combined with crank modules of different sizes by the first combining holes and the second combining holes.

Abstract: A chainwheel has a chainwheel body, a first combining hole set and a second combining hole set. The chainwheel body has a center point. The first combining hole set has multiple first combining holes that are formed through the chainwheel body. The first distances between the first combining holes and the center point are equal. The second combining hole set has multiple second combining holes that are formed through the chainwheel body. The second distances between the second combining holes and the center point are equal. The second distance is longer than the first distance. Therefore, the chainwheel can be combined with crank modules of different sizes by the first combining holes and the second combining holes.

Abstract: A handlebar stem assembly includes a handlebar stem, a tubular housing formed on one end portion of the handlebar stem, a passage transversely defined in an inner wall of the tubular housing, and an adjusting member rotatably mounted in the passage such that a handlebar of a bicycle can be eccentrically mounted in the adjusting member.