Abstract: A method for beam management performed by a UE is provided. The method includes: receiving a DCI format in a first BWP based on a first QCL assumption specific to the first BWP, the DCI format scheduling a PDSCH reception in a second BWP; receiving an RRC configuration that includes a plurality of candidate TCI states associated with a serving cell in which the PDSCH is scheduled; receiving a MAC CE that indicates a subset of the plurality of candidate TCI states for activation in the second BWP; determining a second QCL assumption specific to the second BWP based on one TCI state in the subset; and receiving the PDSCH in the second BWP based on the second QCL assumption.

Abstract: An IC device includes first through third active areas extending in a first direction and a first gate structure extending perpendicular to and overlying each of the first through third active areas. Each of the first through third active areas includes a first portion adjacent to the first gate structure in the first direction and a second portion adjacent to the first portion and including an endpoint of the corresponding active area, the first active area is positioned between the second and third active areas and includes the endpoint positioned under the first gate structure, and each of the second and third active areas includes the endpoint positioned away from the gate structure in a second direction opposite to the first direction.

Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.

Abstract: A speaker module includes a casing, a speaker unit and a vibration absorber. The speaker unit has a sound cavity. The speaker unit is disposed on the casing, and the speaker unit includes a first diaphragm. The vibration absorber is disposed in the casing, and the vibration absorber has a second diaphragm. When the first diaphragm vibrates, the airflow generated by the first diaphragm drives the second diaphragm to vibrate, and the vibration direction of the second diaphragm is opposite to the vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing.

Abstract: A package structure is provided, including a substrate, a first passivation layer, a metallization layer, a second passivation layer, and a polymer layer. The first passivation layer is formed over the substrate. The metallization layer is conformally formed on the first passivation layer. The second passivation layer is conformally formed on the first passivation layer and the metallization layer. A step structure is formed on the top surface of the second passivation layer, and includes at least one lower part that is lower than the other parts of the step structure. The polymer layer is formed over the second passivation layer. A portion of the polymer layer extends into the lower part of the step structure to engage with the step structure.

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Abstract: A semiconductor device includes a transistor layer, a first via layer over the transistor layer, a first metallization layer over the first via layer, the first metallization layer including first conductors having long axes extending substantially in a first direction, a second via layer over the first metallization layer, and a conductive deep via extending in the second via layer, the first metallization layer, and the first via layer. The first conductors represent a majority of conductive material in the first metallization layer, and a size of the deep via in the first direction in the first metallization layer is substantially less than a minimum length of the first conductors in the first metallization layer.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: A connector is disclosed and includes a main body, a circuit board and a signal connection socket. The main body includes an input side, an output side, power inputs, signal inputs, power outputs and signal outputs. The input side is opposite to the output side, the power inputs and the signal inputs are arranged on the input side respectively, the power outputs are arranged on the output side, the power outputs are electrically connected to the power inputs, and the signal outputs are disposed on a bottom side and electrically connected to the signal inputs. The bottom side is connected between the input side and the output side. The circuit board includes an upper surface, and the bottom side is attached to the upper surface. The signal connection socket is disposed on the upper surface and electrically connected to the signal outputs through the circuit board.

Abstract: In a 3D imaging method using scanning-type coherent diffraction, a 2D photodetector detects diffraction of a coherent beam emitted from a light source that moves in a scanning manner toward a sample object to obtain multiple 2D diffraction data distributions; and a processor converts the 2D diffraction data distributions into multiple 3D intensity distributions in a reciprocal space, performs one or more iterations based on a sample function, a light source function and the 3D intensity distributions to obtain a phase-retrieval sample function, and generates a 3D reconstruction image of the sample object based on the phase-retrieval sample function.

Abstract: Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L1-Ar-L2- (1), wherein -L1- and -L2- are respectively —O— or —CO—; —Ar— is an arylene group. Formula (1) comprises structural units Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness)0.5.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.

Abstract: A 3D reconstruction method for a thin film sample that includes a light element is provided. The method includes performing preprocessing that includes noise removal, field-of-view correction and background subtraction on original projection images captured by a scanning transmission electron microscope to obtain 2D images, performing several rounds of a 3D reconstruction procedure that includes an alignment process and an iterative algorithm based on the 2D images and reference images to obtain a piece of reconstructed 3D image data, generating a reconstructed 3D image related to the thin film sample based on the piece of reconstructed 3D image data, and displaying the reconstructed 3D image.

Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.

Abstract: A 3D reconstruction method for a thin film sample that includes a light element is provided. The method includes performing preprocessing that includes noise removal, field-of-view correction and background subtraction on original projection images captured by a scanning transmission electron microscope to obtain 2D images, performing several rounds of a 3D reconstruction procedure that includes an alignment process and an iterative algorithm based on the 2D images and reference images to obtain a piece of reconstructed 3D image data, generating a reconstructed 3D image related to the thin film sample based on the piece of reconstructed 3D image data, and displaying the reconstructed 3D image.

Abstract: In a 3D imaging method using scanning-type coherent diffraction, a 2D photodetector detects diffraction of a coherent beam emitted from a light source that moves in a scanning manner toward a sample object to obtain multiple 2D diffraction data distributions; and a processor converts the 2D diffraction data distributions into multiple 3D intensity distributions in a reciprocal space, performs one or more iterations based on a sample function, a light source function and the 3D intensity distributions to obtain a phase-retrieval sample function, and generates a 3D reconstruction image of the sample object based on the phase-retrieval sample function.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.