Abstract: A processing method for vehicle surround view, a vehicle surround view system and an in-vehicle processing device are provided. The processing method for vehicle surround view includes the following steps: obtaining a first exterior image and a second exterior image; recognizing a first interest object in the first exterior image and a second interest object in the second exterior image; fitting the first interest object to a first geometric contour and fitting the second interest object to a second geometric contour; applying the first geometric contour and the second geometric contour on a 3D model, to obtain a ground point, a first contour position and a second contour position; obtaining a merged contour position according to the ground point; and projecting the first interest object or the second interest object at the merged contour position on a vehicle surround image.

Abstract: A method for 5G Session Management (5GSM) handling of network rejection not due to congestion control is provided. A User Equipment (UE) receives a 5GSM reject message from a mobile communication network. The 5GSM reject message indicates a network rejection not due to congestion control. The UE associates a back-off timer with a Home Public Land Mobile Network (HPLMN) Single-Network Slice Selection Assistance Information (S-NSSAI). The UE prevents itself from sending a 5GSM request message for the same HPLMN S-NSSAI that is associated with the back-off timer.

Abstract: In 5GS, Single-Network Slice Selection Assistance Information (S-NSSAI) based backoff (BO) timers (T3584/T3585) can be applied to either the registered PLMN or all the PLMNs based on a 5GSM congestion re-attempt indicator. For a specific PDU session, the corresponding BO timer applied to the registered PLMN and the BO timer applied to all PLMN can be both running concurrently. It is proposed for a UE to stop both the BO timer applied to all the PLMNs and the BO timer applied to the registered PLMN, if running, in all the following scenarios: 1) Receiving a PDU session release command without a BO timer, 2) Receiving a PDU session release command with 5GSM cause #39, 3) Receiving a PDU session modification command, 4) Receiving a 5GSM message with a 5GSM congestion control BO timer value, and 5) Receiving a PDU session authentication command.

Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.

Abstract: A display device is provided. The display device includes a first electrode and a second electrode. The first electrode includes a first main portion, a first peripheral portion, and a plurality of first extending portions. Part of the first extending portions extend into the first peripheral portion and are connected to each other via a first vertically-extending portion. Other part of the first extending portions do not extend into the first peripheral portion and are separated from each other. The second electrode includes a second main portion, a second peripheral portion, and a plurality of second extending portions. Part of the second extending portions extend into the second peripheral portion and are connected to each other via a second vertically-extending portion. Other part of the second extending portions do not extend into the second peripheral portion and are separated from each other.

Abstract: A user equipment (UE) includes one or more non-transitory computer-readable media containing computer-executable instructions embodied therein, and at least one processor coupled to the one or more non-transitory computer-readable media. The at least one processor configured to execute the computer-executable instructions to receive downlink control information (DCI) on a downlink (DL) channel of a non-terrestrial network (NTN), the DL channel reception ending in a first slot, and transmit an uplink (UL) transmission on a UL channel of the NTN in a second slot. The second slot is separate from the first slot by a timing offset, where a duration of the timing offset is dependent on a type of the UL transmission and a numerology of the UL transmission.

Abstract: Example implementations relate to computing device locations and computing devices having audio components thereon that change operational states. In some examples, a non-transitory computer-readable storage medium can include instructions that when executed cause a processor of an electronic device to determine a default host computing device of a plurality of computing devices, request a location of a first computing device of the plurality of computing devices using a sensor of the default host computing device, and request a location of a second computing device of the plurality of computing devices using the sensor. The instructions when executed can cause the processor to determine a first audio loop potential associated with the first computing device and a second audio loop potential associated with the second computing device, assign the first computing device as an active client and assign the second computing device as an inactive client.

Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: A close-end fuel cell and an anode bipolar plate thereof are provided. The anode bipolar plate includes an airtight conductive frame and a conductive porous substrate disposed within the airtight conductive frame. In the airtight conductive frame, an edge of a first side has a fuel inlet, and an edge of a second side has a fuel outlet. The conductive porous substrate has at least one flow channel, where a first end of the flow channel communicates with the fuel inlet, a second end of the flow channel communicates with the fuel outlet. The flow channel is provided with a blocking part near the fuel inlet to divide the flow channel into two areas.

Abstract: In a 3D imaging method using scanning-type coherent diffraction, a 2D photodetector detects diffraction of a coherent beam emitted from a light source that moves in a scanning manner toward a sample object to obtain multiple 2D diffraction data distributions; and a processor converts the 2D diffraction data distributions into multiple 3D intensity distributions in a reciprocal space, performs one or more iterations based on a sample function, a light source function and the 3D intensity distributions to obtain a phase-retrieval sample function, and generates a 3D reconstruction image of the sample object based on the phase-retrieval sample function.

Abstract: Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L1-Ar-L2- (1), wherein -L1- and -L2- are respectively —O— or —CO—; —Ar— is an arylene group. Formula (1) comprises structural units Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness)0.5.

Abstract: A semiconductor device includes a transistor layer, a first via layer over the transistor layer, a first metallization layer over the first via layer, the first metallization layer including first conductors having long axes extending substantially in a first direction, a second via layer over the first metallization layer, and a conductive deep via extending in the second via layer, the first metallization layer, and the first via layer. The first conductors represent a majority of conductive material in the first metallization layer, and a size of the deep via in the first direction in the first metallization layer is substantially less than a minimum length of the first conductors in the first metallization layer.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.

Abstract: A 3D reconstruction method for a thin film sample that includes a light element is provided. The method includes performing preprocessing that includes noise removal, field-of-view correction and background subtraction on original projection images captured by a scanning transmission electron microscope to obtain 2D images, performing several rounds of a 3D reconstruction procedure that includes an alignment process and an iterative algorithm based on the 2D images and reference images to obtain a piece of reconstructed 3D image data, generating a reconstructed 3D image related to the thin film sample based on the piece of reconstructed 3D image data, and displaying the reconstructed 3D image.

Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.

Abstract: A 3D reconstruction method for a thin film sample that includes a light element is provided. The method includes performing preprocessing that includes noise removal, field-of-view correction and background subtraction on original projection images captured by a scanning transmission electron microscope to obtain 2D images, performing several rounds of a 3D reconstruction procedure that includes an alignment process and an iterative algorithm based on the 2D images and reference images to obtain a piece of reconstructed 3D image data, generating a reconstructed 3D image related to the thin film sample based on the piece of reconstructed 3D image data, and displaying the reconstructed 3D image.

Abstract: In a 3D imaging method using scanning-type coherent diffraction, a 2D photodetector detects diffraction of a coherent beam emitted from a light source that moves in a scanning manner toward a sample object to obtain multiple 2D diffraction data distributions; and a processor converts the 2D diffraction data distributions into multiple 3D intensity distributions in a reciprocal space, performs one or more iterations based on a sample function, a light source function and the 3D intensity distributions to obtain a phase-retrieval sample function, and generates a 3D reconstruction image of the sample object based on the phase-retrieval sample function.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.