Abstract: A projection position guiding method adapted to a projection system is provided. The projection system includes a projection target, an image capturing device and a projector. The projection position guiding method includes: projecting a projection content onto the projection target by the projector to generate a projection image, the projection content includes multiple positioning grid points arranged at intervals; capturing the projection target by the image capturing device to generate a captured image, and the captured image includes at least part of the projection image; and determining whether the positioning grid points satisfy multiple recognizable conditions according to the projection image in the captured image, when it is determined that the positioning grid points include at least one unrecognizable grid point that does not satisfy at least one of the recognizable conditions, adjusting a color of the at least one unrecognizable grid point in the projection content.

Abstract: A computing device comprises a cover, a chassis, a cover closure sensor, and a cooling fan. An airflow detector and a thermal sensor are located within the chassis. The computing device comprises a processor and a memory storing instructions executable by the processor to detect a thermal trip condition using at least signals from the airflow detector, the thermal sensor, and the cover closure sensor. A cooling action is performed at least on condition of (1) determining that a velocity of an airflow within at least a portion of the chassis is less than or equal to a threshold velocity, (2) determining that the cover is closed, and (3) determining that a temperature of the computing device is greater than or equal to a threshold temperature.

Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.

Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.

Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.

Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.

Abstract: An assembled configuration of cooling fins and heat pipes facilitates filling of a thermal interface material between contact surfaces of the cooling fins and the heat pipes and enhances stability of the cooling fins. The configuration is characterized in that each of the juxtaposed cooling fins is formed at an end thereof contacting the heat pipes with a bent portion having at least two sections so as to define an accommodating space for the thermal interface material and an extending section, wherein the accommodating space can be sufficiently filled with the thermal interface material and the extending section can be nestingly overlapped by an adjacent cooling fin, so as to effectively prevent the thermal interface material from leaking out and enhance stability of the assembled cooling fins.

Abstract: A heatsink clamper includes a buckle piece and a main body. The buckle piece includes a latch member buckled to a side of a seat that mounts the heatsink and the hot element of an electronic device, and a press member one end pivoted on an end of the latch member and another end includes a latch end correspondent to the latch portion of the latch member. The latch member includes a latch portion and a raised end. The main body includes a buckle latched to another side of the seat, and a pressing arm linked together included a hole correspondent to the raised end for passing through the raised end and moving relatively. When pressing the press member to move the latch end into the latch portion, the pressing arm is also pressed and deformed to provide a pressure to the heatsink through a receptacle groove.