Patents by Inventor Chieu S. Nguyen

Chieu S. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130243972
    Abstract: A method for coating a work piece with resin including applying a controlled volume of liquid resin to the work piece with an applicator and allowing consecutive streams of resin to meld together to form a self leveling surface. The resin can be actively or passively cured. The work piece can be planar or cylindrical.
    Type: Application
    Filed: May 8, 2013
    Publication date: September 19, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: JAMES M. NELSON, MITCHELL A. F. JOHNSON, WILLIAM BLAKE KOLB, PATRICK R. FLEMING, PAUL E. HUMPAL, CHIEU S. NGUYEN, CHARLES A. EVERTZ, JACK W. LAI, MIKHAIL L. PEKUROVSKY
  • Patent number: 8460754
    Abstract: A method for coating a work piece with resin including applying a controlled volume of liquid resin to the work piece with an applicator and allowing consecutive streams of resin to meld together to form a self leveling surface. The resin can be actively or passively cured. The work piece can be planar or cylindrical.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: June 11, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: James M. Nelson, Mitchell A. F. Johnson, William B. Kolb, Patrick R. Fleming, Paul E. Humpal, Chieu S. Nguyen, Charles A. Evertz, Jack W. Lai, Mikhail L. Pekurovsky
  • Publication number: 20110151199
    Abstract: A method for coating a work piece with resin including applying a controlled volume of liquid resin to the work piece with an applicator and allowing consecutive streams of resin to meld together to form a self leveling surface. The resin can be actively or passively cured. The work piece can be planar or cylindrical.
    Type: Application
    Filed: December 21, 2009
    Publication date: June 23, 2011
    Inventors: James M. Nelson, Mitchell A. Johnson, William B. Kolb, Patrick R. Fleming, Paul E. Humpal, Chieu S. Nguyen, Charles A. Evertz, Jack W. Lai, Mikhail L. Pekurovsky