Abstract: A gas cooling module for an immersion electronic apparatus and a test device equipped with the gas cooling module are provided. The immersion electronic apparatus includes a boiler disposed on a heat source of a circuit board. The gas cooling module includes a gas supply source and a fluid guide member. Cooling gas is introduced from the gas supply source into the fluid guide member, and is ejected toward the boiler, so that heat can be effectively taken away, and the immersion electronic apparatus can be tested in an air environment. The test device further integrates a housing, the immersion electronic apparatus is placed in the housing, and the test device is equipped with the foregoing gas cooling module, to perform a more comprehensive performance test.

Abstract: An immersion cooling system includes a work tank, a buffer tank, and a communication control assembly. The work tank has a work-tank gas-phase region and a work-tank liquid-phase region. The buffer tank has a buffer-tank gas-phase region and a buffer-tank liquid-phase region. The communication control assembly includes a first pipeline, a first pump, a second pipeline, and a second valve. In response to that the first pump is actuated, through the first pipeline, a fluid of the work-tank liquid-phase region is transported to the buffer-tank liquid-phase region, or a fluid of the buffer-tank liquid-phase region is transported to the work-tank liquid-phase region. In response to that the second valve is actuated, through the second pipeline, the work-tank gas-phase region is selectively in communication with the buffer-tank gas-phase region.

Abstract: The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.

Abstract: The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.

Abstract: A fan control system includes a host device including a detecting unit for detecting a component so as to generate a detecting signal. The host device further includes BIOS for storing relationship information between the detecting signal and a rotational speed of a fan and for generating a rotational signal according to the detecting signal and the relationship information. The fan control system further includes a fan device including a fan and a fan driving unit for driving the fan. The fan device further includes a rotational speed modulating unit for controlling the fan driving unit to drive the fan to rotate at a second rotational speed outside a first range when a first rotational speed corresponding to the rotational signal according to the relationship information is within the first range.

Abstract: A fan control system includes a host device including a detecting unit for detecting a component so as to generate a detecting signal. The host device further includes BIOS for storing relationship information between the detecting signal and a rotational speed of a fan and for generating a rotational signal according to the detecting signal and the relationship information. The fan control system further includes a fan device including a fan and a fan driving unit for driving the fan. The fan device further includes a rotational speed modulating unit for controlling the fan driving unit to drive the fan to rotate at a second rotational speed outside a first range when a first rotational speed corresponding to the rotational signal according to the relationship information is within the first range.

Abstract: A heat dissipation device adapted for dissipating heat generated by a heat source is provided. The heat dissipation device includes a base and a heat dissipation fin assembly. The base is disposed on the heat source. The heat dissipation fin assembly is disposed on the base and includes a plurality of parallel fins. The heat dissipation fins assembly has opposite air inlet side and air outlet side. A turbulence generating structure is formed by at least a part of the fins or holes at the air inlet or the air outlet of the heat dissipation fin assembly.