Patents by Inventor Chih-An Su

Chih-An Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132904
    Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Applicant: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Jer-Cheng KUO, Ruey-Chih SU, Li-Kun HUANG, Ya-Yun LIAO, Ching-I LEE, Shao-Kang HUNG
  • Patent number: 11968856
    Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Po-Jui Chen, Hoang Yan Lin, Guo-Dong Su, Wei-Kai Lee, Chi-Jui Chang, Wan-Yu Lin, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Patent number: 11956994
    Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
  • Publication number: 20240107780
    Abstract: A system on chip (SoC) die package is attached to a redistribution structure of a semiconductor device package such that a top surface of the SoC die package is above a top surface of an adjacent memory die package. This may be achieved through the use of various attachment structures that increase the height of the SoC die package. After encapsulating the memory die package and the SoC die package in an encapsulation layer, the encapsulation layer is grinded down. The top surface of the SoC die package being above the top surface of the adjacent memory die package results in the top surface of the SoC die package being exposed through the encapsulation layer after the grinding operation. This enables heat to be dissipated through the top surface of the SoC die package.
    Type: Application
    Filed: January 5, 2023
    Publication date: March 28, 2024
    Inventors: Chih-Wei WU, Ying-Ching SHIH, Wen-Chih CHIOU, An-Jhih SU, Chia-Nan YUAN
  • Publication number: 20240096848
    Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 21, 2024
    Inventors: Chih-Wei Wu, Ching-Feng Yang, Ying-Ching Shih, An-Jhih Su, Wen-Chih Chiou
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Publication number: 20240088562
    Abstract: An antenna structure includes a metal mechanism element, a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a tuning circuit. A slot is formed in the metal mechanism element. The first radiation element is coupled to the feeding radiation element. The tuning circuit is coupled to the first radiation element. The second radiation element is coupled to the feeding radiation element. The third radiation element is coupled to a first grounding point on the metal mechanism element. The fourth radiation element is coupled to a second grounding point on the metal mechanism element. The fifth radiation element is coupled to a third grounding point on the metal mechanism element.
    Type: Application
    Filed: August 17, 2023
    Publication date: March 14, 2024
    Inventors: Guan-Ren SU, Meng-Kai WU, Hsieh-Chih LIN
  • Patent number: 11925457
    Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: March 12, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, CENTRAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Ming-Feng Wu, Yu-Hsuan Chen, Kuo-Chih Su, Chun-Hsiang Wang
  • Patent number: 11894459
    Abstract: The present disclosure describes a semiconductor structure that includes a channel region, a source region adjacent to the channel region, a drain region, a drift region adjacent to the drain region, and a dual gate structure. The dual gate structure includes a first gate structure over portions of the channel region and portions of the drift region. The dual gate structure also includes a second gate structure over the drift region.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: February 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Chih Su, Ruey-Hsin Liu, Pei-Lun Wang, Jia-Rui Lee, Jyun-Guan Jhou
  • Publication number: 20240000211
    Abstract: The present invention discloses a nail grinding pen, which comprises a pen barrel, a motor, and an inner body. The inner side of the pen barrel has a receiving space, and an opening connected to the receiving space provided on one side of the pen barrel. The motor is arranged in the receiving space, and driven by electric power to rotate the rotating shaft. The inner body is connected to the rotating shaft, and one end of the inner body facing the opening has a gripper for fixing a grinding head, so that the motor is able to drive the grinding head into rotation by rotating the gripper.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 4, 2024
    Inventor: Yueh Chih SU
  • Patent number: 11835618
    Abstract: A multiple-target vital sign detector includes a self-injection-locked oscillator (SILO), a chirp up/down converter, a frequency demodulator and a multiple-target vital sign processor. The chirp up/down converter performs conversion from an oscillation signal generated by the SILO to a frequency-modulated continuous wave (FMCW) signal to detect an area and from a received FMCW signal reflected from the area to an injection signal, while the SILO is injected with the injection signal to enter a self-injection-locked state. The locations and vital signs of multiple subjects are extracted from the oscillation signal using the frequency demodulator and the multiple-target vital sign processor. The objective of using the SILO is to improve the sensitivity of the FMCW detection process so as to more effectively distinguish the vital signs of multiple subjects at different locations.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: December 5, 2023
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Tzyy-Sheng Horng, Fu-Kang Wang, Wei-Chih Su, Mu-Cyun Tang, Rezki El Arif
  • Publication number: 20230387211
    Abstract: A high-voltage device includes a substrate, a gate structure over the substrate, a drain region disposed on a first side of the gate structure, a plurality of source regions disposed on a second side of the gate structure, and a plurality of doped regions disposed on the second side of the gate structure. The gate structure includes a plurality of first portions and a plurality of second portions alternately arranged. Width of the first portions are greater than widths of the second portions. The source regions are adjacent to the first portions of the gate structures, and the doped regions are adjacent to the second portions of the gate structure. The drain region and the source regions include dopants of a first conductivity type, and the doped regions include dopants of a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other.
    Type: Application
    Filed: May 30, 2022
    Publication date: November 30, 2023
    Inventors: YU-YING LAI, PO-CHIH SU, YU-TING WEI, RUEY-HSIN LIU
  • Publication number: 20230300302
    Abstract: A projection apparatus, an illumination apparatus thereof, and a light source driving method thereof are provided. A control module converts a bit control signal into first light source timing signals, converts the first light source timing signals into second light source timing signals according to a lookup table, generates a driving current corresponding to each light source according to the lookup table, outputs second light source driving signals corresponding to the light sources according to the second light source timing signals. The lookup table includes a driving current ratio corresponding to the light sources. A driving module drives the light sources according to the second light source driving signals and the driving current for the light sources to have overlapping light-emitting timings.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 21, 2023
    Applicant: Coretronic Corporation
    Inventors: Hsin-Chang Huang, Chien-Yi Yang, Pei-Jen Liao, Yun-Shih Chen, Wei-Chih Su
  • Publication number: 20230228864
    Abstract: A SIL monopulse radar includes a self-injection-locking oscillator (SILO), a transmit antenna, two receive antennas, a hybrid coupler, a first demodulator, a second demodulator and a processor. The transmit antenna transmits the oscillation signal of the SILO to object. The two receive antennas receive a reflected signal from the object as a first echo signal and a second echo signal. The hybrid coupler outputs a difference signal and a sum signal. The difference signal is injected into the SILO. The first demodulator frequency-demodulates the oscillation signal to produce a first demodulated signal. The second demodulator phase-demodulates the sum signal by using the oscillation signal as a reference signal to produce a second demodulated signal. The processor processes the first and second demodulated signals to produce a monopulse ratio signal. The SIL monopulse radar can identify the posture and motion of a human body by analyzing the monopulse ratio signal.
    Type: Application
    Filed: October 24, 2022
    Publication date: July 20, 2023
    Inventors: Tzyy-Sheng Horng, Wei-Chih Su, Xuan-Xin Wu, Mu-Cyun Tang
  • Patent number: 11662453
    Abstract: A digital self-injection-locked (SIL) radar includes a digital SIL oscillator, a wireless signal transceiver and a digital frequency demodulator. The digital SIL oscillator generates a digital output signal. The wireless signal transceiver is electrically connected to the digital SIL oscillator to convert the digital output signal into a wireless signal for transmission to a target, receives a reflected signal from the target, and converts the reflected signal into a digital injection signal for injection into the digital SIL oscillator. Accordingly, the digital SIL oscillator operates in an SIL state and generates a digital oscillation signal. The digital frequency demodulator is electrically connected to the digital SIL oscillator to receive and demodulate the digital oscillation signal into a digital demodulation signal.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: May 30, 2023
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Shiang-Hwua Yu, Tzyy-Sheng Horng, Wei-Chih Su
  • Publication number: 20230156958
    Abstract: A liquid cooling device includes a water cooling radiator, a first pump and a cold plate. The water cooling radiator has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the water cooling radiator, the first pump is disposed on the first surface or the second surface of the water cooling radiator, and the cold plate is disposed on the second surface of the water cooling radiator.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 18, 2023
    Inventors: Mu-Shu FAN, Chien-Chih SU, Hsing-Pao YU, Chia-Chen WANG
  • Patent number: 11611262
    Abstract: A dynamic nameplate is provided, which includes: a base disposed on a circuit board; and a rotating member disposed on the base through a bearing, so that the rotating member can rotate relative to the base. The dynamic nameplate can provide dynamic effects without using a conventional motor.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 21, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Mu-Shu Fan, Chien-Chih Su, Kuan-Cheng Lu
  • Patent number: D1001809
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: October 17, 2023
    Assignee: Acer Incorporated
    Inventors: Szu-Wei Yang, Kai-Teng Cheng, Fang-Ying Huang, Hsin-Chih Su