Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

Abstract: A Duo Aloe Vera Cruces Concentricis antenna structure is provided and includes a first conductive layer, a dielectric layer and a second conductive layer. The first metal units of the first conductive layer form a first tapered hole, The second metal units of the first conductive layer are located in the first tapered hole and form a second tapered hole. The third metal units and the fourth metal units of the dielectric layer are aligned with the first metal units and the second metal units, respectively. The second conductive layer is connected to the dielectric layer. The first tapered hole has at least one first center line. The second tapered hole has at least one second center line. An included angle between the at least one first center line and the at least one second center line is 45 degrees.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first interconnect arranged within an inter-level dielectric (ILD) layer. The first interconnect has opposing sidewalls that are both laterally separated from closest neighboring interconnects within the ILD layer by one or more air-gaps along a cross-sectional view. A second interconnect is arranged within the ILD layer. The ILD layer laterally contacts opposing sidewalls of the second interconnect as viewed along the cross-sectional view.

Abstract: A package structure includes a package substrate, a first die, a second die, a first underfill, and a second underfill. The first die and a second die are disposed on the package substrate. The first underfill is between the first die and the package substrate, and the first underfill includes a first extension portion extending from a first sidewall of the first die toward the second die. The second underfill is between the second die and the package substrate, and the second underfill includes a second extension portion extending from a second sidewall of the second die toward the first die, the second extension portion overlapping the first extension portion on the package substrate.

Abstract: A memory structure of the present disclosure includes a source/drain region on a substrate, a first dielectric layer covering the source/drain region, a second dielectric layer on the first dielectric layer, and a contact contacting the source/drain region. The contact includes a first contact portion extending into the source/drain region, a second contact portion extending into the first dielectric layer, and a third contact portion extending into the second dielectric layer. A bottom surface of the first contact portion is lower than a top surface of the source/drain region. The second contact portion is between the first contact portion and the third contact portion. A distance between a sidewall of the first contact portion and a sidewall of the source/drain region is 30% to 60% of a width of the source/drain region.

Abstract: The present disclosure is directed to a transfer blade including a first end segment, a second end segment opposite to the first end segment, and an intermediate segment extending from the first end segment to the second end segment. The first end segment includes a first contact region and the second end segment includes a second contact region. The first and second contact regions are configured to contact locations of a surface of a workpiece that do not overlap or are not aligned with a sensitive area of the workpiece. The sensitive area of the workpiece may be an EUV frame or a reticle of the workpiece. A non-contact region extends continuously along the first end segment, the intermediate segment, and the second end segment, and the non-contact region overlaps the sensitive area of the workpiece and is spaced apart from the sensitive area of the workpiece.

Abstract: An alignment holder for holding a composite specimen includes a holder body and a positioning mechanism. The holder body is configured to clamp a first side of the composite specimen therein. The positioning mechanism is movably engaged with the holder body. The positioning mechanism is configured to lean against a second side of the composite specimen and move relatively to the holder body for adjusting a clamping position of the composite specimen clamped by the holder body.

Abstract: A head-mounted display includes a display host, a head belt base, a first lateral head belt, a second lateral head belt, an auxiliary head belt, a knob, a first driving component and a second driving component. The head belt base is connected to the display host through the first and second lateral head belts and the auxiliary head belt. The knob is pivoted to the head belt base, and the knob is coupled to the first and second lateral head belts through the first driving component and is coupled to the auxiliary head belt through the second driving component. The knob synchronously drives the first and second driving components, to drive the first and second lateral head belts through the first driving component and drive the auxiliary head belt through the second driving component. Alternatively, the knob drives one of the first driving component and the second driving component.

Abstract: A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a second sidewall surface of the conductive via. The first dielectric material includes a first material composition, and the second dielectric material includes a second material composition different than the first material composition.

Abstract: An electronic device may have pixels. The pixels may form one or more displays. The displays may be flexible organic light-emitting diode displays or other displays. The electronic device may have first and second display layers that face away from each other and display images in different directions. Image transport layers may overlap the display layers and may have curved edges that overlap a sidewall portion of the electronic device. Image transport layers receive images at input surfaces and transport the received images to corresponding output surfaces. Image transport layers may be provided with hemispherical shapes and other shapes having output surfaces of compound curvature. A folding device may have first and second displays that are overlapped by respective first and second image transport layers that join over a hinge to block the hinge from view. A wristwatch device may have links or other structures with an image transport layer.

Abstract: An electronic device may have a display layer for displaying images. An optical coupling layer having an input surface that receives light from the display panel may convey the light from the input surface to an output surface. The output surface may have different dimensions than the display layer and may have any desired shape. To account for the displacement of light between the active area and the outer surface of the optical coupling layer and to ensure the output image is perceived with the desired distortion, image data may be rendered for the output surface then modified to account for the distortion and displacement that will occur later when the image is transported by the optical coupling layer from the display active area to the output surface of the optical coupling layer. Image distortion control circuitry may modify the rendered image data based on a distortion map.

Abstract: An electronic device including a power supply device and a load is provided. The power supply device includes an energy harvest circuit, a power management circuit, and an energy storage element. The energy harvest circuit receives a wireless signal and harvests energy from the wireless signal to generate a first output voltage. The power management circuit processes the first output voltage to generate a second output voltage. The energy storage element is charged by the second output voltage to provide an operation voltage. The load operates according to the operation voltage.

Abstract: According to the present disclosure, a conductive polymer composite and a strain gauge are provided. The conductive polymer composite includes poly(3,4-ethylenedioxythiophene): polystyrene sulfonate and waterborne polyurethane, and the conductive polymer composite is homogeneous. The strain gauge includes a substrate and a strain sensitive layer. The substrate has a surface, and the strain sensitive layer is connected to the surface of the substrate. The strain sensitive layer is made of the aforementioned conductive polymer composite, and the strain sensitive layer has at least four separations arranged in a staggered way and forms bow-like structures, which makes the strain sensitive layer deform more in a first direction than a second direction perpendicular to the first direction.

Abstract: Conductive traces may be conformally wrapped around the side of a display panel that includes an array of display pixels. The conductive traces may electrically connect contacts on an upper surface of the display panel to corresponding contacts on a flexible printed circuit that is attached to a lower surface of the display panel. The side-wrapped conductive traces may be interposed between first and second insulating layers. The flexible printed circuit may have a multi-step interface that is electrically connected to the side-wrapped conductive traces. A system-in-package including a display driver integrated circuit may be mounted to the flexible printed circuit. The system-in-package may include a plurality of redistribution layers that electrically connect contacts on the display driver integrated circuit to contacts on the flexible printed circuit.

Abstract: Devices and methods for controlling wafer uniformity in plasma-based process is disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a gas distribution plate (GDP) arranged in the process chamber. The housing comprises: a gas inlet configured to receive a process gas, and a gas outlet configured to expel processed gas. The GDP is configured to distribute the process gas within the process chamber. The GDP has a plurality of holes evenly distributed thereon. The GDP comprises a first zone and a second zone. The first zone is closer to the gas outlet than the second zone. At least one hole in the first zone is closed.

Abstract: A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a second sidewall surface of the conductive via. The first dielectric material includes a first material composition, and the second dielectric material includes a second material composition different than the first material composition.

Abstract: Provided is a simple, portable, real-time, and in vivo THz imaging device for imaging a target, e.g., a tooth in the subject. Moreover, the scanning based THz imaging device is much sufficiently sensitive as compared with the common X-ray imaging device. Therefore, the scanning based THz imaging device has the potential to operate in the density for early detection problems such as dental caries or demineralization of the enamel in the teeth. Also provided is a method for diagnosing or imaging the target in the subject by using the scanning based THz imaging device of the present disclosure.

Abstract: Provided is a simple, portable, real-time, and in vivo THz imaging device for imaging a target, e.g., a tooth in the subject. Moreover, the scanning based THz imaging device is much sufficiently sensitive as compared with the common X-ray imaging device. Therefore, the scanning based THz imaging device has the potential to operate in the density for early detection problems such as dental caries or demineralization of the enamel in the teeth. Also provided is a method for diagnosing or imaging the target in the subject by using the scanning based THz imaging device of the present disclosure.

Abstract: The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.

Abstract: Provided are compounds of Formula Ir(LA)m(LC)n or Pt(LA)(LB), and also provided are OLED devices using those compounds.