Abstract: A method that reorders partitioning candidates or motion vectors based on template matching costs for geometric prediction mode (GPM) is provided. A video coder receives data to be encoded or decoded as a current block of a current picture of a video. The current block is partitioned into first and second partitions by a bisecting line defined by an angle-distance pair. The video coder identifies a list of candidate prediction modes for coding the first and second partitions. The video coder computes a template matching (TM) cost for each candidate prediction mode in the list. The video coder receives or signals a selection of a candidate prediction mode based on an index that is assigned to the selected candidate prediction mode based on the computed TM costs. The video coder reconstructs the current block by using the selected candidate prediction mode to predict the first and second partitions.

Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna comprises a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator resonate at a low frequency band and a first high frequency band, and a part of the first radiator and the third radiator resonate at a second high frequency band. The second antenna includes a fourth radiator, the second radiator, and a connecting section. The connecting section is connected between the fourth radiator and the second radiator. A part of the fourth radiator, the connecting section, and the second radiator resonate at the low frequency band and the second high frequency band, and the fourth radiator, the connecting section, and a part of the second radiator resonate at the first high frequency band.

Abstract: A fan assembly is provided. The fan assembly includes a hub, a plurality of fan blades, and a fluid-guiding structure. The fan blades surround the hub. The fluid-guiding structure connects any two adjacent fan blades. Each of the fan blades includes a first end connected to the hub and a second end opposite to the first end. The distance between the fluid-guiding structure and the second end is less than the distance between the fluid-guiding structure and the first end. The fluid-guiding structure includes at least one streamlined surface.

Abstract: A key structure of electronic device including a substrate, a light source disposed on the substrate, an elastic member disposed on the substrate, and a key cap disposed on the elastic member is provided. The elastic member has a tunnel for passing light generated by the light source and projecting toward the key cap. An inner diameter of the tunnel gradually expands from the light source toward the key cap.

Abstract: A video coding system that reorders prediction candidates is provided. A video coder receives data for a block of pixels to be encoded or decoded as a current block of a current picture of a video. The video coder identifies possible candidate prediction positions. The video coder computes a cost for each of the identified possible candidate prediction positions. The video coder assigns, based on the computed costs, a reordered index to each of N lowest cost candidate prediction positions from the identified possible candidate prediction positions. The video coder selects a candidate prediction position using the assigned reordered indices, wherein the selection is signaled in or parsed from the bitstream. The video coder encodes or decodes the current block by using the selected candidate prediction position.

Abstract: A method with a SOTIF scene collection and a self-update mechanism, which is applied to a vehicle, includes a situation judging step, a scene collecting step, a modifying step, a verifying step, and an updating step. As the situation judging step judges that the sensing control dataset belongs to the accident scene dataset, the sensing control dataset collected by the scene collecting step belongs to a SOTIF scene.

Abstract: A method for creating a layout element includes receiving an integrated circuit (IC) layout pattern that includes a shape corresponding to a component of the layout pattern. A mathematical definition of the shape is retrieved from a shape database, and parameter inputs regarding characteristics of the shape are received. A vertex listing is created based on the mathematical definition of the shape and the parameter inputs, and a layout element is created based on the vertex listing.

Abstract: One aspect of the present disclosure pertains to a method of forming a semiconductor device. The method includes forming a high-k gate dielectric layer over a channel region of a substrate; depositing a work function metal layer over the high-k gate dielectric layer; forming a titanium nitride (TiN) cap over the work function metal layer, wherein the TiN cap includes one or more oxygenated regions; depositing a silicon cap layer over the TiN cap; depositing a conductive glue layer over the silicon cap layer; and depositing a gate fill metal layer over the conductive glue layer to form a gate structure.

Abstract: A computing device is electronically connectable to a peripheral device. The computing device may convert an image into a lighting control map and output the lighting control map to the peripheral device. The peripheral device controls lights on the peripheral device in a manner that causes the lights to illuminate in accordance with the lighting control map.

Abstract: An extreme ultraviolet mask including a substrate, a reflective multilayer stack on the substrate and patterned absorber layer on the reflective multilayer stack is provided with a pellicle membrane frame attached to the substrate. In some embodiments, the pellicle membrane frame is attached to the substrate using an adhesive between the pellicle membrane frame and the substrate. In some embodiments, the pellicle membrane frame is located in a trench formed in the reflective multilayer stack and patterned absorber layer. In other embodiments, the pellicle membrane frame not located in a trench formed in the reflective multilayer stack and patterned absorber layer.

Abstract: A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.

Abstract: A method for calibrating a data reception window includes: (A) setting a level of a reference voltage by different predetermined values and repeatedly sampling a data signal to obtain multiple first valid data reception windows; (B) establishing a first eye diagram based on the first valid data reception windows; (C) resetting the level of the reference voltage by the predetermined values combined with a first offset and repeatedly sampling the data signal according to the reference voltage to obtain multiple second valid data reception windows and (D) selectively updating the first eye diagram according to the second valid data reception windows. When width of a second valid data reception window is greater than width of a first valid data reception window corresponding to the same predetermined value, the first valid data reception window in the first eye diagram is replaced by the second valid data reception window.

Abstract: A semiconductor device includes an array region defined on a substrate, a ring of dummy pattern surrounding the array region, and a gap between the array region and the ring of dummy pattern. Preferably, the ring of dummy pattern further includes a ring of magnetic tunneling junction (MTJ) pattern surrounding the array region and a ring of metal interconnect pattern overlapping the ring of MTJ and surrounding the array region.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A method includes forming a first metallic feature, forming a dielectric layer over the first metallic feature, etching the dielectric layer to form an opening, with a top surface of the first metallic feature being exposed through the opening, and performing a first treatment on the top surface of the first metallic feature. The first treatment is performed through the opening, and the first treatment is performed using a first process gas. After the first treatment, a second treatment is performed through the opening, and the second treatment is performed using a second process gas different from the first process gas. A second metallic feature is deposited in the opening.

Abstract: The present invention discloses an RF element group testing system and method. The method comprises steps: adding an identification feature to a first RF signal, which is output by one of the plurality of tested RF elements, to generate an identification RF signal; synthesizing the identification RF signal and a second RF signal, which is output by each of the rest of the tested RF elements, to generate a corresponding synthesis signal; resolving the synthesis signal into the identification RF signal and the corresponding second RF signal according to the identification feature; restoring the identification RF signal into the first RF signal; and calculating at least one signal-feature parameter of the first RF signal and the second RF signal.

Abstract: A moving device, applied in a nucleic acid extraction system and cooperated with a plurality of microtube components, the moving device includes: a workbench; a moving component, disposed on the workbench; a control element, disposed on the moving component and electrically connected to the moving component; a first motor, disposed on the moving component and electrically connected to the control element; a first rotating rod, connected to the first motor; a second motor, disposed on the moving component and electrically connected to the control element; a second rotating rod, connected to the second motor; and a telescopic component, disposed on the moving component corresponding to the first rotating rod and the second rotating rod, electrically connected to the control element, and movable between a first position and a second position.

Abstract: An electronic device includes a chassis, a primary system board mounted to the chassis, first and second connectors, and a set of support members coupled to the chassis. The first connector is directly mounted and electrically connected to the primary system board, and includes first and second support walls, and a first pin protruding from the first support wall. The second connector includes a cable electrically connected to the primary system board, and includes third and fourth support walls, a first hole formed in the third support wall, and a second hole formed in the fourth support wall. A support member of the set of support members includes a second pin. The first pin protrudes into the first hole to couple the second connector to the first connector, and the second pin protrudes into the second hole to further couple the second connector to the first support member.

Abstract: A semiconductor device includes a MEOL structure and a BEOL structure. The BEOL structure is formed over the MEOL structure and includes a first dielectric layer, a spacer and a conductive portion. The first dielectric layer has a lateral surface and a recess, wherein the recess is recessed with respect to the lateral surface. The spacer is formed the lateral surface and covers an opening of the recess. The conductive portion is formed adjacent to the spacer.

Abstract: Optical devices and methods of manufacture are presented in which glass interposers are incorporated with optical devices. In some embodiments a method includes forming a first optical package and then bonding the first optical package to a first glass interposer. The first glass interposer may then be connected to a second interposer.