Patents by Inventor Chih C Shih

Chih C Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11876345
    Abstract: Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: January 16, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Di Liang, Chih C. Shih, Kevin B. Leigh, Geza Kurczveil, Marco Fiorentino
  • Publication number: 20220077656
    Abstract: Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Inventors: DI LIANG, CHIH C. SHIH, KEVIN B. LEIGH, GEZA KURCZVEIL, MARCO FIORENTINO
  • Publication number: 20190103290
    Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Ernesto Ferrer Medina, Niru Kumari, Chih C. Shih, Sergio Escobar-Vargas
  • Patent number: 9176544
    Abstract: Example computer racks to improve environmental sustainability in data centers are disclosed. An example computer rack includes a spine (125); a first set of support structures (500) and a second set of support structures (500) extending from the spine (125). Each of the support structures (500) is positioned to receive a respective blade. A first communication port is carried by the spine (125) and associated with the first set of support structures (500). A second communication port is carried by the spine (125) and associated with the second set of support structures (500).
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: November 3, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Justin James Meza, Jichuan Chang, Parthasarathy Ranganathan, Amip J. Shah, Cullen E. Bash, Chih C. Shih
  • Patent number: 9063715
    Abstract: A virtual power infrastructure for managing distribution of power to a plurality of power demanding units from a plurality of power generators includes a demand manager having logical descriptions of the power demanding units, in which the demand manager is configured to determine power load demands of the power demanding units using the logical descriptions of the power demanding units, and a capacity manager having logical descriptions of the power generators. The capacity manager is configured to determine allocation of power capacity supplied to the power generators from one or more of the power generators to meet the power load demands of the power demanding units, while satisfying one or more predetermined constraints associated with at least one of the power demanding units and the power generators.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: June 23, 2015
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Ratnesh Kumar Sharma, Amip J. Shah, Cullen E. Bash, Chih C. Shih, Chandrakant Patel
  • Patent number: 8744631
    Abstract: A system and method for manipulating environmental conditions in an infrastructure containing a fluid moving device are disclosed that include identifying correlations between operational settings of the fluid moving device and environmental conditions resulting from changes to the operational settings. In addition, an environmental condition detected at a location proximate to or within the plenum following supply of fluid into the plenum by the fluid moving device is received and errors between the received environmental condition and a reference environmental condition are identified. Operational settings for the fluid moving device to achieve the reference environmental condition are determined based upon the identified correlations and errors.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: June 3, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zhikui Wang, Cullen E. Bash, Alan A. McReynolds, Christopher Edward Hoover, Chih C. Shih, Carlos J. Felix, Rongliang Zhou
  • Patent number: 8688288
    Abstract: In a method for managing an infrastructure housing a plurality of disaggregated heat sources, in which a first disaggregated heat source has different heat dissipation characteristics as compared with a second disaggregated heat source, cooling requirements for the disaggregated heat sources are determined, in which the first disaggregated heat source and the second disaggregated heat source are to be positioned in separate homogeneous zones of the infrastructure. In addition, a respective available cooling resource is associated with the disaggregated heat sources based upon the determined cooling requirements of the disaggregated heat sources.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: April 1, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Amip J. Shah, Cullen E. Bash, Chih C. Shih, Jichuan Chang, Parthasarathy Ranganathan, Justin James Meza
  • Patent number: 8641804
    Abstract: Systems and methods to condition air are disclosed. An example system includes a desiccant heat transfer device to supply conditioned air to a facility, an air intake to receive air to be conditioned via the desiccant heat transfer device, and a make-up exhaust to provide exhaust air from a heat dissipating device in the facility to provide heated air to reactivate the desiccant heat transfer device.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: February 4, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ratnesh Kumar Sharma, Chih C. Shih, Thomas W. Christian, Cullen E. Bash
  • Publication number: 20130094138
    Abstract: Example computer racks to improve environmental sustainability in data centers are disclosed. An example computer rack includes a spine (125); a first set of support structures (500) and a second set of support structures (500) extending from the spine (125). Each of the support structures (500) is positioned to receive a respective blade. A first communication port is carried by the spine (125) and associated with the first set of support structures (500). A second communication port is carried by the spine (125) and associated with the second set of support structures (500).
    Type: Application
    Filed: June 16, 2010
    Publication date: April 18, 2013
    Inventors: Justion James Meza, Jichuan Chang, Parthasarathy Ranganathan, Amip J. Shah, Cullen E. Bash, Chih C. Shih
  • Patent number: 8392157
    Abstract: In a method of synthesizing components to design a system meeting an exergy loss target value, one or more candidate sets of components are synthesized and an exergy loss value for each of the one or more candidate sets of components are calculated. A determination as to whether at least one of the candidate set of components meets the exergy loss target value is made and at least one candidate set of components determined to meet the exergy loss target value is identified as the set of components for use in the design of the system.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: March 5, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Amip J. Shah, Ratnesh Kumar Sharma, Chih C. Shih, Abdimonem Beitelal, Cullen E. Bash, Chandrakant Patel
  • Publication number: 20130025450
    Abstract: Systems and methods to condition air are disclosed. An example system includes a desiccant heat transfer device to supply conditioned air to a facility, an air intake to receive air to be conditioned via the desiccant heat transfer device, and a make-up exhaust to provide exhaust air from a heat dissipating device in the facility to provide heated air to reactivate the desiccant heat transfer device.
    Type: Application
    Filed: July 29, 2011
    Publication date: January 31, 2013
    Inventors: Ratnesh Kumar Sharma, Chih C. Shih, Thomas W. Christian, Cullen E. Bash
  • Publication number: 20120203381
    Abstract: In a method for managing an infrastructure housing a plurality of disaggregated heat sources, in which a first disaggregated heat source has different heat dissipation characteristics as compared with a second disaggregated heat source, cooling requirements for the disaggregated heat sources are determined, in which the first disaggregated heat source and the second disaggregated heat source are to be positioned in separate homogeneous zones of the infrastructure. In addition, a respective available cooling resource is associated with the disaggregated heat sources based upon the determined cooling requirements of the disaggregated heat sources.
    Type: Application
    Filed: February 7, 2011
    Publication date: August 9, 2012
    Inventors: Amip J. Shah, Cullen E. Bash, Chih C. Shih, Jichuan Chang, Parthasarathy Ranganathan, Justin James Meza
  • Publication number: 20120197444
    Abstract: A system and method for manipulating environmental conditions in an infrastructure containing a fluid moving device are disclosed that include identifying correlations between operational settings of the fluid moving device and environmental conditions resulting from changes to the operational settings. In addition, an environmental condition detected at a location proximate to or within the plenum following supply of fluid into the plenum by the fluid moving device is received and errors between the received environmental condition and a reference environmental condition are identified. Operational settings for the fluid moving device to achieve the reference environmental condition are determined based upon the identified correlations and errors.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 2, 2012
    Inventors: Zhikui Wang, Cullen E. Bash, Alan A. McReynolds, Christopher Edward Hoover, Chih C. Shih, Carlos J. Felix, Rongliang Zhou
  • Publication number: 20110307110
    Abstract: A virtual power infrastructure for managing distribution of power to a plurality of power demanding units from a plurality of power generators includes a demand manager having logical descriptions of the power demanding units, in which the demand manager is configured to determine power load demands of the power demanding units using the logical descriptions of the power demanding units, and a capacity manager having logical descriptions of the power generators. The capacity manager is configured to determine allocation of power capacity supplied to the power generators from one or more of the power generators to meet the power load demands of the power demanding units, while satisfying one or more predetermined constraints associated with at least one of the power demanding units and the power generators.
    Type: Application
    Filed: June 10, 2010
    Publication date: December 15, 2011
    Inventors: Ratnesh Kumar Sharma, Amip J. Shah, Cullen E. Bash, Chih C. Shih, Chandrakant Patel
  • Patent number: 8051156
    Abstract: A method for integrating information technology (IT) data with non-IT data, comprising: first identifying a non-IT network for accessing non-IT data, second identifying an IT network from which to access the non-IT data from the non-IT network, first determining that the non-IT network is accessible via at least one interface based on Object Linking and Embedding for Process Control (OPC) for accessing at least one device in the non-IT network, second determining that the IT network includes an architecture for Simple Network Management Protocol (SNMP) or Web Based Enterprise Management (WBEM) for managing at least one device in the IT network, and providing the IT network with access to data of the at least one device in the non-IT network by accessing the at least one OPC-based interface via either the SNMP-capable architecture or the WBEM architecture of the IT network.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: November 1, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ratnesh Sharma, Cullen E. Bash, Chandrakant Patel, Chih C. Shih
  • Publication number: 20110106501
    Abstract: A method for automated design of an IT infrastructure, includes a) identifying IT equipment to support services to be provided to meet one or more user requirements; b) identifying one or more auxiliary infrastructures to meet requirements of the identified computer equipment; c) synthesizing the IT equipment and the one or more auxiliary infrastructures to generate a candidate design; d) analyzing one or more operating characteristics of the candidate design; e) repeating steps a)-d) on at least one additional candidate design that differs from the candidate design generated at step c); and f) storing at least one of the candidate design and the at least one additional candidate design.
    Type: Application
    Filed: October 29, 2009
    Publication date: May 5, 2011
    Inventors: Thomas W. Christian, Yuan Chen, Chih C. Shih, Ratnesh Kumar Sharma, Christopher Edward Hoover, Manish Marwah, Amip J. Shah, Chandrakant Patel, Cullen E. Bash, Daniel Juergen Gmach
  • Publication number: 20110099043
    Abstract: In a method of managing a structure having an infrastructure system, a plurality of candidate components configured to provide redundancy to the infrastructure system are identified. Reliability levels of the structure are evaluated with a plurality of different combinations of candidate components. In addition, the structure is managed based upon the evaluated reliability levels.
    Type: Application
    Filed: June 17, 2008
    Publication date: April 28, 2011
    Inventors: Ratnesh Kumar Sharma, Chih C. Shih, Cullen E. Bash, Amip J. Shah, Chandrakant Patel
  • Publication number: 20100305923
    Abstract: In a method of synthesizing components to design a system meeting an exergy loss target value, one or more candidate sets of components are synthesized and an exergy loss value for each of the one or more candidate sets of components are calculated. A determination as to whether at least one of the candidate set of components meets the exergy loss target value is made and at least one candidate set of components determined to meet the exergy loss target value is identified as the set of components for use in the design of the system.
    Type: Application
    Filed: November 27, 2007
    Publication date: December 2, 2010
    Inventors: Amip Shah, Ratnesh Kumar Sharma, Chih C. Shih, Cullen E. Bash, Chandrakant Patel, Abdlmonem Beitelal
  • Publication number: 20090132097
    Abstract: A virtual cooling infrastructure includes a demand manager having logical descriptions of a plurality of heat loads and the demand manager is configured to determine cooling load demands of the heat loads. The infrastructure also includes a capacity manager having logical descriptions of a plurality of cooling system components configured to supply cooling resources to cool the heat loads. The infrastructure further includes a service operator configured to map the cooling resources of the cooling system components to the cooling load demands of the heat loads.
    Type: Application
    Filed: October 29, 2008
    Publication date: May 21, 2009
    Inventors: Ratnesh Kumar Sharma, Amip J. Shah, Cullen E. Bash, Chandrakant Patel, Chih C. Shih
  • Patent number: 6923570
    Abstract: An automated test method characterizes the performance of commercially available thermal interface materials (TIM) for electronic cooling. Such automated internal test vehicle provides an independent study of various TIM's. A spectrum of materials are preferably tested using automated methods so the results are reported in a consistent way. Such reports simplify the comparison and selection of appropriate TIM material for various end-user applications. Such automated test method is observed to be faster and easier to use. It requires minimal operator intervention during the test.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: August 2, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chih C Shih, Cullen E. Bash