Abstract: A method for forming solder bumps (or solder balls after reflow) of improved height and reliability is provided. In one embodiment, a semiconductor substrate having at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad is provided. A layer of under bump metal (UBM) is formed above the passivation layer and the contact pad. A first patterned and etched photoresist layer is provided above the UBM layer, the first patterned and etched photoresist layer defining at least one first opening therein. A second patterned and etched photoresist layer is provided above the first patterned and etched photoresist layer, the second patterned and etched photoresist layer defining at least one second opening therein, the second opening being wider than the first opening. A solder material is filled in the at least one first opening and substantially filled in the at least one second opening.

Abstract: A method of automated signature verification, in which a test signature, e.g., a signature entered by an operator, may be preprocessed and examined for test features. The test features may be compared against features of a set of template signatures, and verified in response to the presence or absence of the test features in the template signatures. The test signature may be preprocessed, so as to normalize it and remove artifacts which are irrelevant to verification. The features of the template signatures may be determined and stored in an associative memory or a data structure with associative memory capabilities, e.g., a discrete Hopfield artificial neural network. The method of verification may be adjusted to greater or lesser sensitivity in response to external conditions.