Patents by Inventor CHIH-CHAN (Clay) GER

CHIH-CHAN (Clay) GER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070002551
    Abstract: A printed circuit board (PCB) assembly includes a first PCB (100) and a second PCB (200), respectively including first conductor trace lines (102) and second conductor trace lines (108) for providing electronic connections among a plurality of electronic components. The first PCB is disposed above the second PCB, and is parallel with the second PCB. The first PCB is electronically connected to the second PCB via at least one of the first conductor trace lines and the second conductor trace lines. A surface area of the first PCB is smaller than that of the second PCB. The second PCB is used as a primary circuit board for a layout of electronic components. Preferably, complex or high voltage circuits are disposed on the first PCB, and other circuits are disposed on the second PCB.
    Type: Application
    Filed: March 4, 2006
    Publication date: January 4, 2007
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIH-CHAN (Clay) GER