Abstract: Conductive contacts, methods for forming the same, and semiconductor devices including the same are disclosed. In an embodiment, a semiconductor device includes a first interlayer dielectric (ILD) layer over a transistor structure; a first contact extending through the first ILD layer, the first contact being electrically coupled with a first source/drain region of the transistor structure, a top surface of the first contact being convex, and the top surface of the first contact being disposed below a top surface of the first ILD layer; a second ILD layer over the first ILD layer and the first contact; and a second contact extending through the second ILD layer, the second contact being electrically coupled with the first contact.

Abstract: Embodiments of the present disclosure provide a semiconductor device structure including a first channel layer formed of a first material, wherein the first channel layer has a first width, a second channel layer formed of a second material different from the first material, wherein the second channel layer has a second width less than the first width, and the second channel layer is in contact with a first surface of the first channel layer. The structure also includes a third channel layer formed of the second material, wherein the third channel layer has a third width less than the second width, and the third channel layer is in contact with a second surface of the first channel layer. The structure also includes a gate dielectric layer conformally disposed on the first channel layer, the second channel layer, and the third channel layer, and a gate electrode layer disposed on the gate dielectric layer.

Abstract: A package structure is provided. The package structure includes a chip-containing structure over a substrate and a first adhesive element directly above the chip-containing structure. The first adhesive element has a first thermal conductivity. The package structure also includes multiple second adhesive elements directly above the chip-containing structure. The second adhesive elements are spaced apart from each other, each of the second adhesive elements has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The package structure further includes a protective lid attached to the chip-containing structure through the first adhesive element and the second adhesive elements. The protective lid extends across opposite sidewalls of the chip-containing structure.

Abstract: An electronic apparatus including a touch display panel and a driver circuit is provided. The touch display panel includes a plurality of first electrodes and at least one second electrode. The plurality of first electrodes are arranged in an active area of the touch display panel, and the at least one second electrode is arranged in a border area of the touch display panel. The driver circuit is coupled to the touch display panel. The driver circuit is configured to drive the plurality of first electrodes to perform a touch sensing operation in a first period. The driver circuit is configured to drive the plurality of first electrodes and the at least one second electrode to perform a gesture sensing operation in a second period.

Abstract: A smoke detection device includes a housing, a smoke collector, an optical detector and a cover plate. The housing has a piercing hole. The smoker collector has a smoke hole, and position of the smoke hole is close to position of the piercing hole. The optical detector is disposed inside the smoke collector and adapted to detect gaseous concentration inside the smoke collector. The cover plate is disposed between the housing and the smoke collector, and used to set a channel from the piercing hole to the smoke hole, so that gaseous matter flows from outside the smoke detection device into the smoke collector through the piercing hole and the smoke hole.

Abstract: This disclosure provides a sealed type windshield wiper structure (1). The carrying seat (20) is combined on the hooking seat (10). The carrying seat (20) includes a carrying board (21) and a carrying frame (22). The carrying board (21) includes a through slot (210), and the carrying frame (22) includes an accommodating slot (220). The elastic piece (30) is inserted in the through slot (210). The waterproof cover (40) includes a shell (41), an inner space (32) and an outer space (43) The carrying seat (20) is inserted in the inner space (42). The rubber wiper (50) includes a piercing strip (51) and a scraping strip (52). The piercing strip (51) is inserted in the outer space (43), and the scraping strip (52) is exposed from the waterproof cover (40) to configure the sealed type windshield wiper structure (1).

Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.

Abstract: The present application discloses a semiconductor package, a semiconductor device, and a method for manufacturing a semiconductor package. The semiconductor package includes a silicon interposer, a redistribution layer (RDL) formed on the silicon interposer, and a plurality of computation nodes disposed on the RDL. Each of the computation nodes includes a computation dies and a plurality of high bandwidth memory dies. Each adjacent computation nodes can be coupled to each other through the RDL. The silicon interposer is a silicon wafer, and the semiconductor package is a wafer level package (WLP). Therefore, the computing power of the plurality of computation nodes can be embedded within one package, thereby achieving a system on wafer (SoW) that has greater computation capability within a smaller area.

Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.

Abstract: A resistive memory device includes a bottom electrode, a top electrode and a resistance changing element. The top electrode is disposed above and spaced apart from the bottom electrode, and has a downward protrusion aligned with the bottom electrode. The resistance changing element covers side and bottom surfaces of the downward protrusion.

Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly and coupled to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly. The driving module includes a first driving assembly and a second driving assembly, and the first driving assembly and the second driving assembly are individually operable.

Abstract: A touch apparatus includes a touch screen and a touch controller. The touch controller is configured to process touch sensing signals received from the touch screen to generate a touch coordinate with respect to a touch event occurring on the touch screen. The touch screen includes a plurality of first touch sensing electrodes and a plurality of second touch sensing electrodes. The first touch sensing electrodes are disposed in a center area of the touch screen, wherein at least one part of the first touch sensing electrodes are rectangular. The second touch sensing electrodes are disposed in an edge area of the touch screen surrounding the center area, wherein each of the second touch sensing electrodes is corresponding to a central angle and a plurality of central angles corresponding to the plurality of second touch sensing electrodes substantially equal.

Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

Abstract: An automatic document feeding device having a main body, a stopping assembly, an actuating assembly and a controller. The main body has a sheet conveying channel of a curvature shape. A sheet feeding roller assembly and a sheet conveying roller assembly are arranged on the sheet conveying channel. The stopping assembly is arranged between the sheet feeding roller assembly and the sheet conveying roller assembly. The stopping assembly is capable of being located in or out of the sheet conveying channel. A buffering channel is located between the stopping assembly and the sheet feeding roller assembly. The controller is electrically connected with the actuating assembly and the sheet feeding roller assembly. The controller controls the actuating assembly to hold the stopping assembly in the sheet conveying channel to block the sheet conveying channel in a predetermined period, and then controls the actuating assembly to stop holding the stopping assembly.

Abstract: This disclosure relates to an assembly structure of a windshield wiper. Abase includes a seat and a slot. A seat includes an accommodating space, a plurality of limiting grooves, a fastening portion and an elastic pressing piece. The slot is disposed on a bottom side of the seat for inserting a wiper blade. The linking set includes a seat plate. The seat plate includes a plurality of guiding blocks, a latch and an elastic arm. The latch is obliquely inserted into the seat and rotate to make the seat plate place in the accommodating space. The linking set is pushed by an external force to make the elastic arm move toward the fastening portion. The elastic arm is engaged with the fastening portion and abuts against the elastic pressing piece. The guiding blocks slide into the limiting grooves correspondingly.

Abstract: A method for dynamically de-activating a secondary cell group (SCG) of dual connectivity includes: checking if at least one radio frequency (RF) band used by the SCG meets a pre-defined criterion, and in response to the at least one RF band meeting the pre-defined criterion, de-activating the SCG. For example, the at least one RF band is a 5G New Radio (NR) band.

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

Abstract: The present disclosure provides an electronic system with defect identification function and a method of qualifying a photoresist pattern formed using a lithography process. The electronic system includes an inspection apparatus and a processor associated with the inspection apparatus. The inspection apparatus is used for acquiring at least one image of the specimen on which a photoresist pattern is formed using a lithography process. The processor is configured to automatically apply machine learning processes implemented through one or more neural networks to identify at least one defect present in the photoresist pattern.

Abstract: The present disclosure proposes an electromagnetic susceptibility (EMS) testing method based on computer-vision. The method includes a training stage and a testing stage. During the training stage, the electronic device receives a testing data and the monitor displays a first picture. A camera captures the first picture to generate a template video. The processor generates a plurality of template images at least according to the template video. During the testing stage, an antenna emits an interference signal to the electronic device. The electronic device receives the testing data and the monitor displays a second picture. The camera captures the second picture to generate a testing video. The processor generates a testing image according to the testing video and calculates a difference ratio between the testing image and each template image. The processor sends an alert signal when the difference ratio is greater than a threshold.