Abstract: An active device array includes a plurality of scan lines, a plurality of data lines, a plurality of pixel structures, a first testing circuit, a second testing circuit, a third testing circuit and a fourth testing circuit. Each of the pixel structures is connected to one of the scan lines and one of the data lines. The first testing circuit is electrically connected to the odd scan lines; the second testing circuit is electrically connected to the (4n+1)th scan lines wherein n is zero or a positive integer; the third testing circuit is electrically connected to the even scan lines; the fourth testing circuit is electrically connected to the (4n+2)th scan lines.

Abstract: An active device array includes a plurality of scan lines, a plurality of data lines, a plurality of pixel structures, a first testing circuit, a second testing circuit, a third testing circuit and a fourth testing circuit. Each of the pixel structures is connected to one of the scan lines and one of the data lines. The first testing circuit is electrically connected to the odd scan lines; the second testing circuit is electrically connected to the (4n+1)th scan lines wherein n is zero or a positive integer; the third testing circuit is electrically connected to the even scan lines; the fourth testing circuit is electrically connected to the (4n+2)th scan lines.

Abstract: A self-drilling screw includes a head portion, a shank portion having an externally threaded section, and a drilling portion opposite to the head portion. The drilling portion has a main section and a tip section, two flutes extending helically through the main and tip sections, and two lands extending helically between the flutes. Each of the lands has a tapered face extending in the tip section and between the flutes, and a drilling edge formed on one end of the tapered face.

Abstract: A process for manufacturing nuclear radiation shields consisting of neutron-absorbing boron carbide particles embedded in a heat-dissipating copper matrix. Copper is electroplated through a layer of loose, electrically nonconductive boron carbide particles on a metal substrate. The carbide particles may be deposited on the substrate while electroplating, and heat exchanger ductwork may be incorporated. To make cylindrical shields, a cylindrical metal substrate is rotated about its axis giving rise to centrifugal forces which hold the carbide particles on the inner surface and aid electrodeposition. A thermomechanical process is described in which boron carbide particles pre-encapsulated with copper are consolidated into a unitary mass on the inner surface of a heated cylindrical substrate with or without the aid of a roller within the cylinder.