Patents by Inventor Chih-Chao Hsieh

Chih-Chao Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10686106
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 16, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Publication number: 20200135652
    Abstract: A chip package is provided. The chip package includes a semiconductor die and a protection layer surrounding the semiconductor die. The chip package also includes a first dielectric layer over the semiconductor die and the protection layer. The first dielectric layer has an upper surface with cutting scratches. The chip package further includes a conductive layer over the first dielectric layer. In addition, the chip package includes a second dielectric layer over the conductive layer and filling some of the cutting scratches. Bottoms of the cutting scratches are positioned at height levels that are lower than a topmost surface of the first dielectric layer and higher than a topmost surface of the semiconductor die.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Shing-Chao CHEN, Chih-Wei LIN, Tsung-Hsien CHIANG, Ming-Da CHENG, Ching-Hua HSIEH
  • Publication number: 20200058627
    Abstract: A package includes a first redistribution structure, a bridge structure, an adhesive layer, a plurality of conductive pillars, an encapsulant, a first die, and a second die. The bridge structure is disposed on the first redistribution structure. The adhesive layer is disposed between the bridge structure and the first redistribution structure. The conductive pillars surround the bridge structure. A height of the conductive pillars is substantially equal to a sum of a height of the adhesive layer and a height of the bridge structure. The encapsulant encapsulates the bridge structure, the adhesive layer, and the conductive pillars. The first die and the second die are disposed over the bridge structure. The first die is electrically connected to the second die through the bridge structure. The first die and the second die are electrically connected to the first redistribution structure through the conductive pillars.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang
  • Patent number: 10529898
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: January 7, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
  • Patent number: 10515900
    Abstract: A chip package is provided. The chip package includes a semiconductor die and a protection layer surrounding the semiconductor die. The chip package also includes a dielectric layer over the semiconductor die and the protection layer. The dielectric layer has an upper surface with cutting scratches. The chip package further includes a conductive layer over the dielectric layer and filling some of the cutting scratches.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh
  • Publication number: 20190366860
    Abstract: An adaptive power supply system for an unmanned vehicle and an operation method thereof are provided. The adaptive power supply system includes an adaptive power supply, a battery, a sensing circuit, and a power dispatch controller. The output terminal of the adaptive power supply powers the load circuit of the unmanned vehicle. The battery is coupled to the output terminal of the adaptive power supply. The sensing circuit senses the output of the output terminal of the adaptive power supply and the output of the battery. The power dispatch controller controls the output of the output terminal of the adaptive power supply according to the sensing result of the sensing circuit. The power dispatch controller determines whether one or both of the adaptive power supply and the battery power the load circuit by adjusting the output of the adaptive power supply.
    Type: Application
    Filed: December 11, 2018
    Publication date: December 5, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Chien-Hung Lin, Yu-Sheng Lee, Chih-Wei Hsu, Yung-Chao Chen, Hsien-Ching Hsieh
  • Publication number: 20190252339
    Abstract: A manufacturing method of integrated fan-out package includes following steps. First and second dies are provided on adhesive layer formed on carrier. Heights of first and second dies are different. First and second dies respectively has first and second conductive posts each having substantially a same height. The dies are pressed against adhesive layer to make active surfaces thereof be in direct contact with adhesive layer and conductive posts thereof be submerged into adhesive layer. Adhesive layer is cured. Encapsulant is formed to encapsulate the dies. Carrier is removed from adhesive layer. Heights of first and second conductive posts are reduced and portions of the adhesive layer is removed. First and second conductive posts are laterally wrapped by and exposed from adhesive layer. Top surfaces of first and second conductive posts are leveled. Redistribution structure is formed over adhesive layer and is electrically connected to first and second conductive posts.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin
  • Patent number: 8417977
    Abstract: An operating method for an integrated interface of a PDA and a wireless communication system includes the following steps. Firstly, when the wireless communication system starts to operate from a standby mode, a state signal is transmitted from the wireless communication system to the PDA. Then, if the PDA receives the state signal when the PDA is in a sleep state, the PDA is wakened and an input source of an audio element inside the PDA is switched to the wireless communication system. An electromagnetic wave signal is received by a wireless communication element and converted into audio data. Afterwards, the audio data is transmitted from the wireless communication system to the PDA and outputted by the audio element.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 9, 2013
    Assignee: HTC Corporation
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Patent number: 8411882
    Abstract: An electronic device is provided. The electronic device includes a housing and an electro-acoustic transducer disposed on the inner surface of the housing. The electro-acoustic transducer includes an electret diaphragm, a conductive plate and at least one spacer. The electret diaphragm is positioned on the inner surface of the housing and has a film body and an electrode layer. The film body has static charges and the electrode layer is formed on the lower surface of the film body. The conductive plate has a plurality of openings and is stacked on the upper surface of the film body. The spacer is positioned between the electret diaphragm and the conductive plate to keep a predetermined distance therebetween.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: April 2, 2013
    Assignee: HTC Corporation
    Inventors: Fang Ching Lee, Yi Tsung Cheng, Chih Chao Hsieh
  • Patent number: 7925904
    Abstract: A battery charging method for a device that has a PDA, a wireless communication system, and a power system having a battery and is charged via an external charging cable. The device further has an external charging circuit for charging the battery. The wireless communication system has an internal charging circuit for charging the battery. The battery charging method includes performing current charging to the battery via the external charging circuit by using the external charging cable; turning on the wireless communication system; and turning on the internal charging circuit for charging after the wireless communication system is turned on.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: April 12, 2011
    Assignee: HTC Corporation
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Publication number: 20100240412
    Abstract: An operating method for an integrated interface of a PDA and a wireless communication system includes the following steps. Firstly, when the wireless communication system starts to operate from a standby mode, a state signal is transmitted from the wireless communication system to the PDA. Then, if the PDA receives the state signal when the PDA is in a sleep state, the PDA is wakened and an input source of an audio element inside the PDA is switched to the wireless communication system. An electromagnetic wave signal is received by a wireless communication element and converted into audio data. Afterwards, the audio data is transmitted from the wireless communication system to the PDA and outputted by the audio element.
    Type: Application
    Filed: May 27, 2010
    Publication date: September 23, 2010
    Applicant: HIGH TECH COMPUTER, CORP.
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Patent number: 7765414
    Abstract: A circuit for an integrated interface of a PDA and a wireless communication system is suitable for integrating the PDA and the wireless communication system. The circuit includes a first serial port has two terminals, in which one of the two terminals is electrically connected to the PDA, and another one of the two terminals is electrically connected to the wireless communication system. The first serial port is used to bi-directionally transmit a control signal between the PDA and the wireless communication system. A second serial port has two terminals, in which one of the two terminals is electrically connected to the PDA, and another one of the two terminals is electrically connected to the wireless communication system. The second serial port is used to bi-directionally transmit data between the PDA and the wireless communication system.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: July 27, 2010
    Assignee: HTC Corporation
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Publication number: 20100111335
    Abstract: An electronic device is provided. The electronic device includes a housing and an electro-acoustic transducer disposed on the inner surface of the housing. The electro-acoustic transducer includes an electret diaphragm, a conductive plate and at least one spacer. The electret diaphragm is positioned on the inner surface of the housing and has a film body and an electrode layer. The film body has static charges and the electrode layer is formed on the lower surface of the film body. The conductive plate has a plurality of openings and is stacked on the upper surface of the film body. The spacer is positioned between the electret diaphragm and the conductive plate to keep a predetermined distance therebetween.
    Type: Application
    Filed: September 15, 2009
    Publication date: May 6, 2010
    Applicant: HTC Corporation
    Inventors: Fang Ching Lee, Yi Tsung Cheng, Chih Chao Hsieh
  • Publication number: 20080034233
    Abstract: A circuit for an integrated interface of a PDA and a wireless communication system is suitable for integrating the PDA and the wireless communication system. The circuit includes a first serial port has two terminals, in which one of the two terminals is electrically connected to the PDA, and another one of the two terminals is electrically connected to the wireless communication system. The first serial port is used to bi-directionally transmit a control signal between the PDA and the wireless communication system. A second serial port has two terminals, in which one of the two terminals is electrically connected to the PDA, and another one of the two terminals is electrically connected to the wireless communication system. The second serial port is used to bi-directionally transmit data between the PDA and the wireless communication system.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 7, 2008
    Applicant: HIGH TECH COMPUTER, CORP.
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Publication number: 20070293278
    Abstract: A battery charging method for a device that has a PDA, a wireless communication system, and a power system having a battery and is charged via an external charging cable. The device further has an external charging circuit for charging the battery. The wireless communication system has an internal charging circuit for charging the battery. The battery charging method includes performing current charging to the battery via the external charging circuit by using the external charging cable; turning on the wireless communication system; and turning on the internal charging circuit for charging after the wireless communication system is turned on.
    Type: Application
    Filed: August 23, 2007
    Publication date: December 20, 2007
    Applicant: HIGH TECH COMPUTER, CORP.
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Patent number: 7278032
    Abstract: A circuit and operating method for an integrated interface of a PDA and a wireless communication system are disclosed. The circuit includes a PDA-turn-on-wireless-communication-system signal line, a PDA-reset-wireless-communication-system signal line, a PDA-state signal line, a wireless-communication-system-state/wake-up-PDA signal line and two serial ports, wherein the serial ports are electrically connected between the PDA and the wireless communication system, and one of the two ports is used to transmit control signal and status data, another one of the two ports is used to transmit digital data signals. Moreover, the PDA-turn-on-wireless-communication-system signal line and the PDA-reset-wireless-communication-system signal line makes the PDA able to turn on and reset the wireless communication system, respectively. The PDA-state signal line and the wireless-communication-system-state/wake-up-PDA signal line transmit the status of the PDA and wireless communication system to each other.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: October 2, 2007
    Assignee: High Tech Computer, Corp.
    Inventors: Hsun-Hsin Chuang, Hsi-Cheng Yeh, Chih-Chao Hsieh, Shi-Je Lin, Wen-Hsing Lin
  • Publication number: 20040034805
    Abstract: A circuit and operating method for an integrated interface of a PDA and a wireless communication system are disclosed. The circuit includes a PDA-turn-on-wireless-communication-system signal line, a PDA-reset-wireless-communication-system signal line, a PDA-state signal line, a wireless-communication-system-state/wake-up-PDA signal line and two serial ports, wherein the serial ports are electrically connected between the PDA and the wireless communication system, and one of the two ports is used to transmit control signal and status data, another one of the two ports is used to transmit digital data signals. Moreover, the PDA-turn-on-wireless-communication-system signal line and the PDA-reset-wireless-communication-system signal line makes the PDA able to turn on and reset the wireless communication system, respectively. The PDA-state signal line and the wireless-communication-system-state/wake-up-PDA signal line transmit the status of the PDA and wireless communication system to each other.
    Type: Application
    Filed: April 7, 2003
    Publication date: February 19, 2004
    Inventors: HSUN-HSIN CHUANG, HSI-CHENG YEH, CHIH-CHAO HSIEH, SHI-JE LIN, WEN-HSING LIN
  • Publication number: 20030189552
    Abstract: A touch panel threshold pressure setup method and apparatus. In this touch panel threshold pressure setup method, at first multiple touches are performed when the setup is run, and with this, the multiple pressure values can be obtained. Then, the obtained pressure values are averaged to obtain an average pressure value. Finally, the average pressure value itself or a value obtained from a certain multiplier multiplied by the obtained average pressure value is used as a threshold pressure value. Moreover, the pressure value mentioned above can be represented by the contact resistance value if the resistance type touch panel is used. However, the pressure value is inverse proportional to the contact resistance value that represents it.
    Type: Application
    Filed: April 1, 2003
    Publication date: October 9, 2003
    Inventors: HSUN-HSIN CHUANG, CHIH-CHAO HSIEH, BOSHIUN CHEN