Abstract: A driving assistance device to accommodate, and communicate with, a portable device includes a housing, a plug connector, a controller and an ejection member. The housing defines a receiving chamber therein and an end opening communicating with the receiving chamber. The housing includes a bulkhead assembled in the receiving chamber to divide the receiving chamber into a first receiving portion and a second receiving portion, the first receiving portion communicates with the opening. The plug connector is assembled to the bulkhead and aligned to the opening. The controller is received in the second receiving portion and electrically coupled to the plug connector. The ejection member can be operated to eject the portable device.

Abstract: A driving assistance device to accommodate, and communicate with, a portable device includes a housing, a plug connector, a controller and an ejection member. The housing defines a receiving chamber therein and an end opening communicating with the receiving chamber. The housing includes a bulkhead assembled in the receiving chamber to divide the receiving chamber into a first receiving portion and a second receiving portion, the first receiving portion communicates with the opening. The plug connector is assembled to the bulkhead and aligned to the opening. The controller is received in the second receiving portion and electrically coupled to the plug connector. The ejection member can be operated to eject the portable device.

Abstract: An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits and a plurality of test-keys on a wafer substrate, wherein the plurality of test-keys are disposed between the adjacent integrated circuits; forming a patterned protective film on the wafer to cover the plurality of integrated circuits and expose the plurality of test-keys; etching the plurality of test-keys by using the patterned protective film as a mask; and dicing an area between the plurality of integrated circuits to form a plurality of discrete integrated circuit dies.

Abstract: An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits and a plurality of test-keys on a wafer substrate, wherein the plurality of test-keys are disposed between the adjacent integrated circuits; forming a patterned protective film on the wafer to cover the plurality of integrated circuits and expose the plurality of test-keys; etching the plurality of test-keys by using the patterned protective film as a mask; and dicing an area between the plurality of integrated circuits to form a plurality of discrete integrated circuit dies.

Abstract: An exercise apparatus is composed of a counterweight device, a pulley assembly, a pulley sensor, an operating device, and a control device. The counterweight device includes a frame, a plurality of weight pieces mounted to the frame, and a plurality of electronic switches mounted to the frame for detecting the number of the weight pieces that are moved. The pulley assembly includes at least one pulley mounted to the frame; and a transmission member mounted to the pulley and connected with the weight pieces. The pulley sensor is mounted to the frame for sensing the status of the pulley. The operating device is connected with the transmission member for driving the pulley assembly to move the weight pieces. The control device is electrically connected with the electronic switches and the pulley sensor for calculating, displaying, and recording data of the user's exercise performance.