Patents by Inventor Chih-Che CHEN
Chih-Che CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240172434Abstract: A semiconductor device includes a stacked gate structure, a plurality of stacks and a first conductive layer. The stacks are disposed aside the stacked gate structure and arranged along both a first direction and a second direction perpendicular to the first direction, wherein the stacks are extended continuously along the first direction and segmented in the second direction. The first conductive layer is disposed between segmented portions of the stacks along the second direction, wherein top surfaces of the segmented portions of the stacks are higher than a top surface of the first conductive layer.Type: ApplicationFiled: January 31, 2024Publication date: May 23, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
-
Publication number: 20240162382Abstract: The present disclosure provides a light-emitting package. The light-emitting package includes a main body, a cavity disposed in the cavity, a base plane in the cavity and a light-emitting element. The light-emitting element is disposed in the cavity and connected to the base plane. The light-emitting element includes a substrate and a semiconductor stack on the substrate. The substrate includes a side wall, and the side wall incudes a first cutting trace. The main body includes a step portion disposed in the cavity and it surrounds the light-emitting element. The step portion comprises a first height relative to base plane, and the first cutting trace comprises a second height relative to the base plane. The second height is greater than the first height.Type: ApplicationFiled: November 10, 2023Publication date: May 16, 2024Inventors: Wu-Tsung LO, Chih-Hao CHEN, Wei-Che WU, Heng-Ying CHO, Tsun-Kai KO
-
Patent number: 11983848Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.Type: GrantFiled: January 6, 2023Date of Patent: May 14, 2024Assignee: MEDIATEK INC.Inventors: Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen, Yu-Sheng Lin, Chih-Wen Goo, Shih-Chin Lin, Tsung-Shian Huang, Ying-Chieh Chen
-
Publication number: 20240151935Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.Type: ApplicationFiled: March 8, 2023Publication date: May 9, 2024Inventors: Hsiao-Hsin HU, Chih-Wen CHIANG, Chia-Che WU, Yu-Chiao LO, Yi-Ho CHEN, Chao-Chang HU, Sin-Jhong SONG
-
Publication number: 20240152029Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.Type: ApplicationFiled: November 2, 2023Publication date: May 9, 2024Inventors: Hsiao-Hsin HU, Chih-Wen CHIANG, Chia-Che WU, Yu-Chiao LO, Yi-Ho CHEN, Chao-Chang HU, Sin-Jhong SONG
-
Publication number: 20240151932Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.Type: ApplicationFiled: March 28, 2023Publication date: May 9, 2024Inventors: Hsiao-Hsin HU, Chih-Wen CHIANG, Chia-Che WU, Yu-Chiao LO, Yi-Ho CHEN, Chao-Chang HU, Sin-Jhong SONG
-
Publication number: 20240155234Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.Type: ApplicationFiled: March 27, 2023Publication date: May 9, 2024Inventors: Hsiao-Hsin HU, Chih-Wen CHIANG, Chia-Che WU, Yu-Chiao LO, Yi-Ho CHEN, Chao-Chang HU, Sin-Jhong SONG
-
Publication number: 20240151936Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.Type: ApplicationFiled: March 27, 2023Publication date: May 9, 2024Inventors: Hsiao-Hsin HU, Chih-Wen CHIANG, Chia-Che WU, Yu-Chiao LO, Yi-Ho CHEN, Chao-Chang HU, Sin-Jhong SONG
-
Publication number: 20240120338Abstract: A semiconductor device structure is provided. The semiconductor device has a first dielectric wall between an n-type source/drain region and a p-type source/drain region to physically and electrically isolate the n-type source/drain region and the p-type source/drain region from each other. A second dielectric wall is formed between a first channel region connected to the n-type source/drain region and a second channel region connected to the p-type source/drain region. A contact is formed to physically and electrically connect the n-type source/drain region with the p-type source/drain region, wherein the contact extends over the first dielectric wall. The first electric wall has a gradually decreasing width W5 towards a tip of the dielectric wall from a top contact position between the first dielectric wall and either the n-type source/drain region or the p-type source/drain region.Type: ApplicationFiled: February 15, 2023Publication date: April 11, 2024Inventors: Ta-Chun LIN, Ming-Che CHEN, Yu-Hsuan LU, Chih-Hao CHANG
-
Patent number: 11949056Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.Type: GrantFiled: April 20, 2023Date of Patent: April 2, 2024Assignee: Lextar Electronics CorporationInventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
-
Patent number: 11925017Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.Type: GrantFiled: January 13, 2020Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
-
Patent number: 9130293Abstract: An electrical connector includes an insulative housing and a number of conductive contacts received in the insulative housing. Each conductive contact is substantially located in a main surface and includes a contacting portion extending beyond the front wall of the insulative housing, an intermediate portion extending rearward from the contacting portion and received in the insulative housing, and a termination portion bending vertically from the intermediate portion. The intermediate portion is torn to form at least an interfering means which extending away from the main surface to interferentially engage with the insulative housing for retaining the conductive contact in the insulative housing reliably.Type: GrantFiled: September 9, 2013Date of Patent: September 8, 2015Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.Inventors: Wang-I Yu, Ya-Juan Gou, Chih-Che Chen
-
Publication number: 20140377967Abstract: An electrical connector includes an insulative housing and a number of conductive contacts received in the insulative housing. Each conductive contact is substantially located in a main surface and includes a contacting portion extending beyond the front wall of the insulative housing, an intermediate portion extending rearward from the contacting portion and received in the insulative housing, and a termination portion bending vertically from the intermediate portion. The intermediate portion is torn to form at least an interfering means which extending away from the main surface to interferentially engage with the insulative housing for retaining the conductive contact in the insulative housing reliably.Type: ApplicationFiled: September 9, 2013Publication date: December 25, 2014Applicant: ALLTOP ELECTRONICS (SUZHOU), LTD.Inventors: Wang-I YU, Ya-Juan GOU, Chih-Che CHEN
-
Patent number: 8419480Abstract: A board-mounted electrical connector has an insulating housing, a first contact module, a second contact module, a spacer and a shell encasing the housing, the first and the second module and the spacer. The housing forms a main body defining a receiving space and a mating tongue extending forwardly from the main body. Each of the first and the second contact module has a first/second insert and a plurality of first/second contacts insert-molded in the first/second insert. The spacer is assembled with the first and the second contact module, and defines a plurality of through holes.Type: GrantFiled: February 28, 2011Date of Patent: April 16, 2013Assignee: Alltop Electronics (Suzhou) Co., LtdInventors: Wang-I Yu, Chih-Che Chen, Hung-Chi Tai
-
Publication number: 20120164890Abstract: A board-mounted electrical connector has an insulating housing, a first contact module, a second contact module, a spacer and a shell encasing the housing, the first and the second module and the spacer. The housing forms a main body defining a receiving space and a mating tongue extending forwardly from the main body. Each of the first and the second contact module has a first/second insert and a plurality of first/second contacts insert-molded in the first/second insert. The spacer is assembled with the first and the second contact module, and defines a plurality of through holes.Type: ApplicationFiled: February 28, 2011Publication date: June 28, 2012Applicant: ALLTOP ELECTRONICS (SUZHOU) CO., LTDInventors: Wang-I YU, Chih-Che CHEN, Hung-Chi TAI