Abstract: A display panel package structure is disclosed, which includes a first substrate, a metal wire layer formed on the first substrate, an insulating layer formed on the metal wire layer, a second substrate, a frit formed on an edge of the second substrate for sealing the first substrate and the second substrate, and a conductive layer formed between the frit and the insulating layer corresponding to the frit for conducting a heat when the frit is heated.

Abstract: A display device includes a first substrate, a second substrate and a sealing material. The first substrate includes an active area and a driving circuit. The driving circuit has a first side facing the active area and a second side opposite to the first side. The second substrate includes a mask layer. A projection of the mask layer on the first substrate at least overlaps the driving circuit from the second side to the first side. The sealing material is between the second substrate and the first substrate, used for sealing the second substrate and the first substrate, and located beside the second side of the driving circuit.

Abstract: A mother substrate structure includes a mother substrate, a cover plate, a sealant and a spacer structure. The mother substrate has light emitting units thereon. The cover plate is disposed above the mother substrate and has unit regions, each unit region corresponding to one of the light emitting unit. The cover plate has a cutting line around each unit region, sealant regions between the cutting line and each of the unit regions, and spacer disposing regions between the cutting line and each of the sealant regions, wherein a distance between the cutting line and each of the spacer disposing region is 0˜100 um. The sealant is disposed in the sealant regions to bond the mother substrate and the cover plate. The spacer structure is disposed in the spacer disposing regions and surrounds each of the light emitting units, and materials of the spacer structure and the sealant include a glass fit.

Abstract: Disclosed herein is an electroluminescent display that includes a first substrate, a second substrate, a light-emitting element array, a sealing member, and a supporting structure. The first substrate and the second substrate are opposite to each other, and the light-emitting element array is disposed between the first substrate and the second substrate. The sealing member is disposed between the first substrate and the second substrate such that an enclosed space is defined by the first substrate, the second substrate and the sealing member. The light-emitting element array is disposed within the enclosed space. The supporting structure is disposed between and interconnects the first substrate and the second substrate while does not form an enclosed space therewith. The sealing member and the supporting structure are both formed of a same glass frit.

Abstract: Disclosed herein is an electroluminescent display that includes a first substrate, a second substrate, a light-emitting element array, a sealing member, and a supporting structure. The first substrate and the second substrate are opposite to each other, and the light-emitting element array is disposed between the first substrate and the second substrate. The sealing member is disposed between the first substrate and the second substrate such that an enclosed space is defined by the first substrate, the second substrate and the sealing member. The light-emitting element array is disposed within the enclosed space. The supporting structure is disposed between and interconnects the first substrate and the second substrate while does not form an enclosed space therewith. The sealing member and the supporting structure are both formed of a same glass frit.

Abstract: Disclosed herein are a glass sealing package and a manufacturing method thereof. The glass sealing package includes a first glass substrate, a second glass substrate and a frit. The coefficient of thermal expansion of the frit lies between that of the two glass substrates. A light emitting element on the first glass substrate is situated in a sealed room formed among the two substrates and the frit. The method includes the steps of proving a first and a second glass substrate, dispensing a frit on the second glass substrate, pre-sintering the frit, assembling the two substrates, and sealing the frit to join the two substrates.

Abstract: A display panel package structure is disclosed, which includes a first substrate, a metal wire layer formed on the first substrate, an insulating layer formed on the metal wire layer, a second substrate, a frit formed on an edge of the second substrate for sealing the first substrate and the second substrate, and a conductive layer formed between the frit and the insulating layer corresponding to the frit for conducting a heat when the frit is heated.

Abstract: An organic electro-luminescent device package includes an organic electro-luminescent device array substrate, a transparent cover, and a fit. The organic electro-luminescent device array substrate includes a first substrate and a plurality of organic electro-luminescent devices arranged on the first substrate in an array. The transparent cover is disposed over the organic electro-luminescent device array substrate. The transparent cover includes a second substrate and a conductive layer disposed on the second substrate. The organic electro-luminescent devices are located between the first substrate and the second substrate. The frit is disposed between the organic electro-luminescent device array substrate and the transparent cover to surround the organic electro-luminescent devices. The fit is located between the first substrate and a portion of the conductive layer, and the portion of the conductive layer corresponding to the frit is transparent.