Patents by Inventor Chih-Che Yeh

Chih-Che Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140010996
    Abstract: A curing process for curing a decorated article is provided. The decorated article includes a substrate, an adhesion layer and a pattern layer disposed on the substrate, sequentially. Processing conditions of the curing process include the following: a temperature ranged between 50° C. to 180° C., a relative humidity ranged between 30% to 100%, and a processing time ranged between 6 hours to 72 hours. A decorated article and a method for manufacturing the decorated article are also provided. The method for manufacturing the decorated article includes bonding a decoration film onto a substrate, and curing the decoration film and the substrate with the curing process. The decorated article is manufactured with the method for manufacturing the decorated article.
    Type: Application
    Filed: November 2, 2012
    Publication date: January 9, 2014
    Applicant: ETANSI INC.
    Inventors: Chih-Che Yeh, Shih-Min Huang
  • Publication number: 20120227898
    Abstract: A continuous decoration transferring and punching apparatus and process thereof which is capable to continuously form a plurality of decorated products is provided. The continuous decoration transferring and punching apparatus includes a first roll feeder for providing a substrate, a second roll feeder for providing a plurality of decoration films, a transferring unit for continuously transferring the decoration films to the substrate and a punching unit for continuously punching the substrate after the decoration films are transferred to the substrate for forming a plurality of decorated pieces. By using the roll feeders to synchronously and continuously transfer the decoration films to the substrate, a large amount of decoration transferred substrates can be obtained at the same time. Moreover, a plurality of decorated pieces can be accomplished through the utilizing of a following punching operation after the transferring process.
    Type: Application
    Filed: March 6, 2012
    Publication date: September 13, 2012
    Applicant: ETANSI INC.
    Inventors: Chih-Chiang Ma, Chih-Che Yeh