Patents by Inventor Chih Cheih Yeh

Chih Cheih Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110121406
    Abstract: An integrated circuit structure includes a semiconductor substrate including a first portion in a first device region, and a second portion in a second device region. A first semiconductor fin is over the semiconductor substrate and has a first fin height. A second semiconductor fin is over the semiconductor substrate and has a second fin height. The first fin height is greater than the second fin height.
    Type: Application
    Filed: August 30, 2010
    Publication date: May 26, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Lin Lee, Chih Cheih Yeh, Chang-Yun Chang, Feng Yuan