Abstract: A rectilinear-block placement method includes disposing a first sub-block of each flexible block on a layout area of a chip canvas according to a reference position, generating an edge-depth map relative to first sub-blocks of flexible blocks on the layout area, predicting positions of second sub-blocks of the flexible blocks with depth values on the edge-depth map by a machine learning model, and positioning the second sub-blocks on the layout area according to the predicted positions of the second sub-blocks of the flexible blocks.

Abstract: The application discloses a method and a system for shaping flexible blocks on a chip canvas in an integrated circuit design. An input is received describing geometric features of flexible blocks. A set of flexible blocks are generated based on the input. Obtained block areas of the set of flexible blocks are computed. Whether the set of flexible blocks are legal is determined based on determining whether area differences between the obtained block areas and a plurality of required areas for the set of flexible blocks meet a requirement. The set of flexible blocks are updated until the set of flexible blocks are all legal.

Abstract: A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: A contact image sensor structure includes a body, a substrate, and a light source unit. The body has a first side surface and a second side surface. The body has a pin slot that passes through the first side surface and the second side surface. The second side surface has a light source receiving slot, and the light source receiving slot links with the pin slot. The substrate has a plurality of pads. The light source unit is fastened in the pin slot and the light source receiving slot. One end of the light source unit has a plurality of pins. The pins pass through the pin slot and contact the pads of the substrate. Thereby, the pins are electrically connected with the pads without welding. The life time and the reliability of the contact image sensor are enhanced, and the assembling process is simplified.