Patents by Inventor Chih-Cheng Chien

Chih-Cheng Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103234
    Abstract: A ferrule of optical cable with multi cores includes a casing and at least one main body. The main body is connected to the casing. A plurality of main body through-holes are formed on the at least one main body. The casing and the main body are separately formed and fixed to each other. A plurality of optical fibers of a fiber optical cable pass through the main body through-holes and extrude out of the casing.
    Type: Application
    Filed: June 16, 2023
    Publication date: March 28, 2024
    Inventors: CHIH-CHENG CHIEN, TSO-HAN CHIEN
  • Publication number: 20240074826
    Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 7, 2024
    Inventors: PO-YUN LIU, CHUN-HUNG KUO, CHIH-CHENG CHIEN, YEN-CHIEH WANG
  • Patent number: 11903907
    Abstract: The invention provides a soluble honokiol derivative (such as a water soluble honokiol derivative) and its application in antagonizing glycoprotein VI receptor and providing antioxidant and neuroprotective effects.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: February 20, 2024
    Assignees: TAIPEI MEDICAL UNIVERSITY, CATHAY GENERAL HOSPITAL
    Inventors: Joen-Rong Sheu, Fa-Kung Lee, Chih-Cheng Chien, Chih-Ming Ho, Chao-Chien Chang, Cheng-Ying Hsieh, Jing-Ping Liou
  • Patent number: 11666406
    Abstract: The present invention is a method for controlling a Davinci surgical device. Firstly, controlling an operation part of a remote operation device to enter the inner of a body for executing a surgical operation. Then, an image capturing unit captures a plurality of corresponding surgical images to a control device, and the control device obtains a first torque component, a second torque component and an element action of the remote surgical device according to the surgical images to operate an output strength of the remote surgical device for further generating corresponding strength feedback by the output strength. Thus, the user can get the control status of the remote surgical device to prevent accidental iatrogenic injury from over-force and to proceed with the operation with improved accuracy.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: June 6, 2023
    Assignee: Gamania Digital Entertainment, Co., Ltd.
    Inventors: Po-Yun Liu, Hsien-Che Chuang, Chih-Cheng Chien, Yen-Chieh Wang
  • Publication number: 20230036677
    Abstract: The present invention is a method for controlling a Davinci surgical device. Firstly, controlling an operation part of a remote operation device to enter the inner of a body for executing a surgical operation. Then, an image capturing unit captures a plurality of corresponding surgical images to a control device, and the control device obtains a first torque component, a second torque component and an element action of the remote surgical device according to the surgical images to operate an output strength of the remote surgical device for further generating corresponding strength feedback by the output strength. Thus, the user can get the control status of the remote surgical device to prevent accidental iatrogenic injury from over-force and to proceed with the operation with improved accuracy.
    Type: Application
    Filed: September 22, 2021
    Publication date: February 2, 2023
    Inventors: PO-YUN LIU, HSIEN-CHE CHUANG, CHIH-CHENG CHIEN, YEN-CHIEH WANG
  • Publication number: 20210075108
    Abstract: A communication device includes a ground plane and an antenna element. The antenna element includes a first radiation portion and a second radiation portion. The first radiation portion includes a meander section and a rectangular metal section. The meander section has a rectangular hook-shaped structure. A feed point is disposed at a first end of the meander section, and a second end of the meander section is electrically connected to the rectangular metal section. A first end of the second radiation portion of an L-shaped structure is electrically connected to the ground plane. A first end of the rectangular metal section is spaced apart from a second end of the second radiation portion by a first parallel slot. The communication device operates in a first frequency band with the first radiation portion and the second radiation portion, and operates in a second frequency band with the first radiation portion.
    Type: Application
    Filed: March 17, 2020
    Publication date: March 11, 2021
    Applicants: ASKEY COMPUTER CORP., ASKEY TECHNOLOGY (JIANGSU) LTD.
    Inventors: Chih-Chung Lin, Chih-Cheng Chien
  • Publication number: 20200358554
    Abstract: The invention provides a soluble honokiol derivative (such as a water soluble honokiol derivative) and its application in antagonizing glycoprotein VI receptor and providing antioxidant and neuroprotective effects.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 12, 2020
    Inventors: JOEN-RONG SHEU, FA-KUNG LEE, CHIH-CHENG CHIEN, CHIH-MING HO, CHAO-CHIEN CHANG, CHENG-YING HSIEH, JING-PING LIOU
  • Patent number: 10446708
    Abstract: An optocoupler device for receiving a load voltage larger than or equal to 5 KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 15, 2019
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Chien-Chung Hsiao, Chih-Cheng Chien
  • Patent number: 10439076
    Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: October 8, 2019
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Chih-Cheng Chien, Jane-Wang Lai, Chien-Chung Hsiao
  • Patent number: 10418352
    Abstract: An optical package structure of a mobile communication device includes a board, electrodes formed on the board, a light emitter and an IC chip both disposed on the board, and a light permeable package body encapsulating the light emitter and the IC chip. The electrodes are respectively arranged on a lower edge portion and two lateral edge portions of the board, and the number of the electrodes on the lower edge portion is larger than that on any of the two lateral edge portions. The light emitter is electrically coupled to at least one of the electrodes. The IC chip includes a light sensor corresponding in position to the light emitter and connecting pads electrically coupled to the electrodes. A distance from the light sensor to the upper edge portion is less than that to the lower edge portion, and is equal to or less than 250 ?m.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: September 17, 2019
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Chih-Cheng Chien, Chien-Chung Hsiao
  • Publication number: 20190259882
    Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.
    Type: Application
    Filed: May 14, 2018
    Publication date: August 22, 2019
    Inventors: CHIH-CHENG CHIEN, JANE-WANG LAI, CHIEN-CHUNG HSIAO
  • Publication number: 20190117587
    Abstract: The invention provides a soluble honokiol detivative (such as a water soluble honokiol derivative) and its application in antagonizing glycoprotein VI receptor and providing antioxidant and neuroprotective effects.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 25, 2019
    Inventors: JOEN-RONG SHEU, FA-KUNG LEE, CHIH-CHENG CHIEN, CHIH-MING HO, CHAO-CHIEN CHANG, CHENG-YING HSIEH, JING-PING LIOU
  • Publication number: 20190035966
    Abstract: An optocoupler device for receiving a load voltage larger than or equal to 5KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.
    Type: Application
    Filed: October 16, 2017
    Publication date: January 31, 2019
    Inventors: CHIEN-CHUNG HSIAO, CHIH-CHENG CHIEN
  • Publication number: 20140191143
    Abstract: An optocoupler is disclosed including a receiving unit, a metal bump, a substrate, a transparent light guiding block, a light emitting unit, and a transmitting unit. The metal bump is formed on the receiving unit and connects to the substrate. The transmitting unit is electrically connected to the light emitting unit, so as to selectively control whether the light emitting unit to emit the light or not. The metal bump is utilized to connect the substrate with the receiving unit, and then the transparent light guiding block is utilized to cover the light emitting unit, so as to simplify the structure of the optocoupler.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 10, 2014
    Applicant: CAPELLA MICROSYSTEMS (TAIWAN), INC.
    Inventors: CHENG-CHUNG SHIH, YUNG-CHUAN CHUANG, CHIH-CHENG CHIEN
  • Publication number: 20140028503
    Abstract: A multiband antenna for an electronic device includes a resonance radiation body, a grounding end, and a spread spectrum portion. The resonance radiation body receives a first electromagnetic wave signal at a first frequency (known as fundamental frequency). The grounding end and the electronic device are connected. The spread spectrum portion is disposed between the resonance radiation body and the grounding end. The spread spectrum portion includes first and second shunting bodies to form a loop bypass between the resonance radiation body and the grounding end and thereby decrease and increase the first frequency by a specific frequency value so as to define a bandwidth equal to two times the specific frequency value. Hence, the electronic device receives a second electromagnetic wave signal at any frequency within the bandwidth. Since the spread spectrum portion defines the bandwidth, the electronic device can receive the first and second electromagnetic wave signals.
    Type: Application
    Filed: November 9, 2012
    Publication date: January 30, 2014
    Applicant: ASKEY COMPUTER CORP.
    Inventors: CHIH-CHENG CHIEN, CHIN-HSU LAI
  • Patent number: 8545112
    Abstract: A main housing for optical sub-assembly for transceivers includes a cylindrical member and a bypass member. The cylindrical member has a first end for accommodating an optical transmission unit and a second end for accommodating an optical fiber connector. A tubular member forming groove is formed on an outer circumference of the cylindrical member. A sleeve forming reference hole is formed on a tubular wall of the cylindrical member in communication with the tubular member forming groove. The bypass member has a connection tube positioned in the tubular member forming groove, a filter holder positioned in the cylindrical member and connected with the connection tube for connecting a filter on the filter holder, and a sleeve for accommodating an optical receiving unit. The sleeve outward extends along the sleeve forming reference hole and is connected with the filter holder.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: October 1, 2013
    Assignee: Ezconn Corporation
    Inventor: Chih-Cheng Chien
  • Publication number: 20130128594
    Abstract: A weld-free optical sub-assembly for transceivers for light-emitting unit includes: a main housing including a flange end section, several threaded holes being formed on the flange end section; a light-emitting unit; and a locking structure including a collar. The collar has a sleeve sectionpositioned in the flange end section of the main housing. The sleeve section defines an inner hole for receiving the light-emitting unit. The locking structure further includes several screws. The screws are screwed into the threaded holes of the main housing until the sleeve section is inward recessed to form several locking sections in tight contact with the light-emitting unit, whereby the light-emitting unit is packaged in the main housing.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Applicants: EZCONN CORPORATION
    Inventor: Chih-Cheng CHIEN
  • Patent number: 8399967
    Abstract: A package structure including a circuit substrate, at least a chip, leads and an encapsulant is provided. The circuit substrate has a first surface, a second surface opposite to the first surface, and contacts disposed on the first surface. The chip is disposed on the second surface of the circuit substrate and electrically connected to the circuit substrate. The leads are disposed on the periphery of the second surface and surround the chip. Each lead has an inner lead portion and an outer lead portion and is electrically connected to the circuit substrate via the inner lead portion. The encapsulant encapsulates the circuit substrate, the chip and the inner lead portion and exposes the first surface of the circuit substrate and the outer lead portion, wherein the upper surface of the encapsulant and the first surface of the circuit substrate are coplanar with each other.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: March 19, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Chih-Cheng Chien
  • Publication number: 20130064504
    Abstract: A pigtail light guide structure for transmitting optical signals includes an optical transmission line and a fiber stub structure. The optical transmission line has an optical fiber, a coating enclosing the optical fiber and a buffer layer enclosing the coating. A part of the optical fiber is exposed to outer side of a free end of the optical transmission line. The fiber stub structure includes a sleeve and a capillary. The sleeve has a first internal receiving hole for accommodating the optical transmission line, and a second internal receiving hole in communication with the first internal receiving hole for accommodating the capillary. The second internal receiving hole has a diameter smaller than a diameter of the first internal receiving hole. The capillary has an internal passage for accommodating a part of the optical fiber of the optical transmission line.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 14, 2013
    Applicants: EZCONN CORPORATION
    Inventor: Chih-Cheng Chien
  • Patent number: D947722
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: April 5, 2022
    Assignee: J.D COMPONENTS CO., LTD.
    Inventor: Chih-Cheng Chien