Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A fastening device comprises a male retainer, a female retainer and a combination lock. The male retainer is made of a plastic material by injection molding and provided at one end thereof with a device engageable with a belt and at another end thereof with two retaining hooks. The female retainer is made of a plastic material by injection molding and provided at one end thereof with a device engageable with the retaining hooks of the male retainer. The female retainer has a hollow interior in which the combination lock is housed. The combination lock is provided with an arresting plate capable of preventing the retaining hooks from moving inwards when the process of locking the combination lock is under way. The arresting plate is provided with an arresting piece located between two retaining hooks and capable of being caused to move up and down by a numbered wheel of the combination lock so as to lock or unlock the fastening device.