Abstract: The present invention discloses an integrated choke assembly comprising: a base having a main body structure, a first protruding part and a second protruding part. A first choke has a first magnetic core and a first winding, wherein the first protruding part is arranged through the first opening of the first magnetic core so that the first choke is arranged on the upper surface of the main body structure, and the first winding is wound on the first magnetic core. A second choke has a second magnetic core and a second winding, wherein the second protruding part is arranged through the second opening of the second magnetic core so that the second choke is arranged on the lower surface of the main body structure, and the second winding is wound on the second magnetic core.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a plurality of first channel nanostructures and a plurality of second channel nanostructures in an n-type device region and a p-type device region of a substrate, respectively, and sequentially depositing a gate dielectric layer, an n-type work function metal layer, and a cap layer surrounding each of the first and second channel nanostructures. The cap layer merges in first spaces between adjacent first channel nanostructures and merges in second spaces between adjacent second channel nanostructures. The method further includes selectively removing the cap layer and the n-type work function metal layer in the p-type device region, and depositing a p-type work function metal layer over the cap layer in the n-type device region and the gate dielectric layer in the p-type device region. The p-type work function metal layer merges in the second spaces.

Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A method includes depositing a photoresist layer over a target layer, the photoresist layer comprising an organometallic material; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation; developing the exposed photoresist layer to form a photoresist pattern; forming a spacer on a sidewall of the photoresist pattern; removing the photoresist pattern; after removing the photoresist pattern, patterning the target layer through the spacer.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A display apparatus is provided, which includes a display module, a biosensor, an ambient-light sensor, and a display controller. The ambient-light sensor is configured to detect ambient-light brightness and an ambient-light color temperature of the display apparatus. The display controller is configured to receive a video signal from a host, and displays the video signal on the display module. When the biosensor detects that a user is located in front of the display apparatus, the biosensor transmits an image-adjustment control signal to the display controller to control the display apparatus to enter an image-adjustment mode. When the display apparatus is in the image-adjustment mode, the display controller adjusts screen brightness and a screen color temperature of the image signal displayed on the display module according to the ambient-light brightness and the ambient-light color temperature.

Abstract: A display apparatus, which is electrically connected to a host, is provided. The display apparatus includes a display panel, a display controller, an audio interface, and an audio-processing chip. The display controller is configured to control displaying of the display panel. The audio interface includes a detection circuit configured to detect whether a pair of headphones is plugged into the audio interface. The audio-processing chip is configured to receive an audio signal from the host, and to convert the audio signal into an output audio signal. When the detection circuit detects that the pair of headphones has been plugged into the audio interface, the audio-processing chip adjusts strength of the output audio signal according to a headphone-volume setting of the display apparatus, and transmits the adjusted output audio signal to the pair of headphones for playback through the audio interface.

Abstract: A display apparatus is provided, which includes a display module, a biosensor, an ambient-light sensor, and a display controller. The ambient-light sensor is configured to detect ambient-light brightness and an ambient-light color temperature of the display apparatus. The display controller is configured to receive a video signal from a host, and displays the video signal on the display module. When the biosensor detects that a user is located in front of the display apparatus, the biosensor transmits an image-adjustment control signal to the display controller to control the display apparatus to enter an image-adjustment mode. When the display apparatus is in the image-adjustment mode, the display controller adjusts screen brightness and a screen color temperature of the image signal displayed on the display module according to the ambient-light brightness and the ambient-light color temperature.

Abstract: A display apparatus is provided, which includes a display panel and a display controller. The display controller calculates an image average brightness of each image in a video signal from a host. When an absolute difference between a first image average brightness of a current image and a second image average brightness of a previous image is smaller than a predetermined value, the display controller activates a timer to obtain a timer value. When the timer value reaches a first duration, the display controller reduces brightness of each pixel in the current image by a first ratio. When the timer value reaches a second duration, the display controller reduces the brightness of each pixel in the current image by a second ratio. The second duration is longer than the first duration, and the second ratio is higher than the first ratio.

Abstract: A backlight module includes a case body, supporting structures, light-emitting elements, and an optical module. The case body includes a first side wall and a second side wall opposite to the first side wall. Each of the support structures includes two supporting members and a bearing member. Two supporting members are respectively disposed on the first side wall and the second side wall. Each of the supporting member includes a fitting portion, an extending portion, and a bending portion. The fitting portion is fixed to the first side wall and the second side wall. The bearing member is disposed between the two supporting members. The light-emitting elements are respectively disposed on the bearing surface of the bearing member of the corresponding supporting structures. The optical module is disposed on the extending surface of the extending portion of each of the supporting structures. A display device is also provided.

Abstract: An electronic device is provided. The electronic device includes: a display panel, a display controller, and a host. The display controller is configured to control displaying of the display panel. The host is electrically connected to the display controller. The host executes an application to render a display image, and transmits the display image to the display controller through an image-transmission channel between the host and the display controller. The display controller detects whether pixels in a specific area of the display image satisfy a predetermined condition. In response to the pixels in the specific area satisfying the predetermined condition, the display controller triggers a virtual input signal, and transmits the virtual input signal to the host through a data-transmission channel between the host and the display controller, so that the host executes a specific operation corresponding to the virtual input signal.

Abstract: An electronic device is provided. The electronic device includes: a display apparatus and a host. The display apparatus includes a display controller and a display panel. The host executes an application to render a display image, and transmits the display image to the display controller through an image-transmission channel between the host and the display controller, and the display controller displays the display image on the display panel. The display controller determines whether an external input signal from a user satisfies a predetermined condition. In response to the external input signal satisfying the predetermined condition, the display controller triggers a virtual input signal corresponding to a specific macro key, and transmits the virtual input signal to the host through a data-transmission channel between the host and the display controller, so that the host executes a keystroke sequence corresponding to the specific macro key.

Abstract: An electronic device is provided. The electronic device includes: a display panel, a display controller, and a host. The display controller is configured to control displaying of the display panel. The host is electrically connected to the display controller. The host executes an application to render a display image, and transmits the display image to the display controller through an image-transmission channel between the host and the display controller. The display controller detects whether pixels in a specific area of the display image satisfy a predetermined condition. In response to the pixels in the specific area satisfying the predetermined condition, the display controller triggers a virtual input signal, and transmits the virtual input signal to the host through a data-transmission channel between the host and the display controller, so that the host executes a specific operation corresponding to the virtual input signal.

Abstract: An electronic device is provided. The electronic device includes: a display panel and a host. The host is electrically connected to the display panel, and includes a processing unit and a graphics processing unit. The processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, wherein the display image includes a user interface. The processing unit obtains position information about a static area of the user interface. In response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display module for displaying.

Abstract: An electronic device is provided. The electronic device includes: a display apparatus and a host. The display apparatus includes a display controller and a display panel. The host executes an application to render a display image, and transmits the display image to the display controller through an image-transmission channel between the host and the display controller, and the display controller displays the display image on the display panel. The display controller determines whether an external input signal from a user satisfies a predetermined condition. In response to the external input signal satisfying the predetermined condition, the display controller triggers a virtual input signal corresponding to a specific macro key, and transmits the virtual input signal to the host through a data-transmission channel between the host and the display controller, so that the host executes a keystroke sequence corresponding to the specific macro key.