Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

Abstract: A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency.

Abstract: A semiconductor device package includes a redistribution layer structure, a semiconductor component, an encapsulant and a sensing component. The semiconductor component is disposed on a top surface of the RDL structure. The encapsulant covers the semiconductor component, the RDL structure, and an electrical connection member. The sensing component is disposed on a top surface of the encapsulant. The electrical connection member is in contact with a pad of the semiconductor component and has a first surface exposed from the top surface of the encapsulant, and the semiconductor component package includes a wire connecting the sensing component and the first surface of the electrical connection member.

Abstract: A method for impulse noise detection and removal in color images comprising a detection module and a vector median filter.

Abstract: A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency.

Abstract: A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency.

Abstract: A method for impulse noise detection and removal in color images comprising a detection module and a vector median filter.

Abstract: A method for impulse noise detection and removal in color images based on Moran's I statistic using Moran's I vector median filter (MIVMF) which comprises detection and removal components. The detection module determines if a pixel is noise or is noise-free. If it is a noise pixel, the vector median filter (VMF) will be used to remove the noise. This detection capability meets the so-called “switching” mechanism, which only selects noisy pixels for suppression. The inventive filter expedites processing time with the reduced number of vector calculations due to this new detection function, achieved with Moran's I index and the indication of 1-D Laplacian kernels. Compared to other vector-type median filters, the inventive MIVMF was faster in the filtering process and efficient in removing random impulse noise with different noise levels in color images. The MIVMF demonstrated a promising de-noising result based on the criteria of Peak Signal-to-Noise Ratio (PSNR) and Structural Similarity Index Metric (SSIM).

Abstract: A method for impulse noise detection and removal in color images based on Moran's/statistic using Moran's/vector median filter (MIVMF) which comprises detection and removal components. The detection module determines if a pixel is noise or is noise-free. If it is a noise pixel, the vector median filter (VMF) will be used to remove the noise. This detection capability meets the so-called “switching” mechanism, which only selects noisy pixels for suppression. The inventive filter expedites processing time with the reduced number of vector calculations due to this new detection function, achieved with Moran's/index and the indication of 1-D Laplacian kernels. Compared to other vector-type median filters, the inventive MIVMF was faster in the filtering process and efficient in removing random impulse noise with different noise levels in color images. The MIVMF demonstrated a promising de-noising result based on the criteria of Peak Signal-to-Noise Ratio (PSNR) and Structural Similarity Index Metric (SSIM).

Abstract: A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency.

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract: In a method of manufacturing a semiconductor package, a chip is disposed on a carrier. An inert gas is run around one end of a line portion of a copper bonding wire while the end is being formed into a spherical portion. The spherical portion is bonded to a pad of the chip. The chip and the copper bonding wire are sealed and the carrier is covered by a molding compound.

Abstract: In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract: A method for fabricating a cavity-down package is provided. A chip carrier includes a chip cavity. A chip is disposed inside the cavity, and a plurality of bonding materials is formed at the corners of the chip. The bonding materials are cured to protect the corners of the chip. Next, an encapsulant is formed in the cavity to seal the chip and the bonding materials to prevent stress concentration caused by thermal expansion mismatch on the chip corners and eliminate delamination between the encapsulant and the chip.

Abstract: A brake mechanism, which includes a mounting base fixedly fastened to the wheeled apparatus to be controlled, an actuating bar coupled between the mounting base and a brake cable at the wheeled apparatus, and a brake lever pivoted to the mounting base for operation by hand to move the actuating bar, wherein the brake lever is operated by hand and shifted between a first position where the brake cable is pulled up to stop the wheeled apparatus and the brake cable will be released when releasing the brake lever from the hand, a second position where the brake mechanism stands idle, and a third position where the brake cable is maintained pulled up and will not be released from the braking position when releasing the brake lever from the hand.