Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: A semiconductor structure includes at least one sub-word line driver. The sub-word line driver includes a plurality of first active areas and a main-word line. The main-word line includes a plurality of first gates and a plurality of second gates interconnected. The plurality of first gates correspond to the plurality of first active areas. An extension direction of the plurality of first gates in the main-word line and/or an extension direction of at least part of the second gates in the main-word line intersects both a first direction and a second direction. The first direction is parallel to a direction in which the first active areas extend, and the second direction is parallel to a plane in which the first active areas are located and is perpendicular to the first direction.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A touchpad device is to be operated by using a stylus pen, and includes a touchpad and a controller that are connected to each other. The controller is connected to an electronic device that includes a display panel, and operates in a stylus-pen mode where a handwriting area is presented on the display panel. When it is determined that a distance between the stylus pen and the touchpad is less than a preset pen-hover distance but is non-zero, the controller operates in a hover-move sub-mode where the controller outputs, based on a result of determination as to whether the electronic device is an iPad or not, two different control signals respectively for two different results of the determination to enable the electronic device to present, in the handwriting area, the cursor moving respectively in two different manners, without presenting a trace of the cursor.

Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.

Abstract: The present invention discloses an integrated choke assembly comprising: a base having a main body structure, a first protruding part and a second protruding part. A first choke has a first magnetic core and a first winding, wherein the first protruding part is arranged through the first opening of the first magnetic core so that the first choke is arranged on the upper surface of the main body structure, and the first winding is wound on the first magnetic core. A second choke has a second magnetic core and a second winding, wherein the second protruding part is arranged through the second opening of the second magnetic core so that the second choke is arranged on the lower surface of the main body structure, and the second winding is wound on the second magnetic core.

Abstract: A method of making a semiconductor device includes forming at least one fiducial mark on a photomask. The method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. The defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.

Abstract: A method for manufacturing a package structure includes: providing a first electrical element and a second electrical element on a surface of a first carrier, wherein the second electrical element is shifted with respect to the first electrical element; and moving the first electrical element along at least one direction substantially parallel with the surface of the first carrier until a first surface of the first electrical element is substantially aligned with a first surface of the second electrical element from a top view.

Abstract: A method includes depositing a photoresist layer over a target layer, the photoresist layer comprising an organometallic material; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation; developing the exposed photoresist layer to form a photoresist pattern; forming a spacer on a sidewall of the photoresist pattern; removing the photoresist pattern; after removing the photoresist pattern, patterning the target layer through the spacer.

Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.

Abstract: A touchpad device is to be operated by using a stylus pen, and includes a touchpad and a controller that are connected to each other. The controller is connected to an electronic device that includes a display panel, and operates in a stylus-pen mode where a handwriting area is presented on the display panel. When it is determined that a distance between the stylus pen and the touchpad is less than a preset pen-hover distance but is non-zero, the controller operates in a hover-move sub-mode where the controller outputs a control signal to enable the electronic device to present, in the handwriting area, the cursor moving, without presenting a trace of the cursor.

Abstract: A touchpad device is to be operated by using a stylus pen, and includes a touchpad and a controller that are connected to each other. The controller is connected to an electronic device that includes a display panel, and operates in a stylus-pen mode where a handwriting area is presented on the display panel. When it is determined that a distance between the stylus pen and the touchpad is less than a preset pen-hover distance but is non-zero, the controller operates in a hover-move sub-mode where the controller outputs, based on a result of determination as to whether the electronic device is an iPad or not, two different control signals respectively for two different results of the determination to enable the electronic device to present, in the handwriting area, the cursor moving respectively in two different manners, without presenting a trace of the cursor.

Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.

Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.

Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.

Abstract: A semiconductor device, a semiconductor device package, and a method of manufacturing a semiconductor device package are provided. The semiconductor device includes an electronic component and a first protection layer. The electronic component includes a first conductive pad protruded out of a first surface of the electronic component. The first protection layer covers an external surface of the first conductive pad. The first surface of the electronic component is exposed from the first protection layer.

Abstract: A driving assembly and a transfer device to allow an adjustable length of wheelbase for varying sizes of loads comprises a driving device, a driving wheel connected to the driving device rotatable by the driving device, a cantilever assembly comprising a cantilever configured for mounting to the bearing platform, and a driven wheel rotatably connected to one end of the cantilever. The other end of the cantilever is detachably connected to a fixed part of the driving device. The transfer device comprises a bearing platform and two driving assemblies.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure includes a substrate, a chip and a dielectric structure. The substrate includes a first portion and a second portion surrounding the first portion. The second portion defines a cavity over the first portion. The chip includes a terminal on an upper surface of the chip. The dielectric structure fills the cavity and laterally encroaches over the upper surface of the chip. The dielectric structure is free from overlapping with the terminal of the chip.

Abstract: A locking mechanism comprises a main body, an ejector rod, a guide rod assembly, a carrier plate and a fixing assembly. The carrier plate comprises a center hole and a plurality of annular strip holes. The fixing assembly comprises a rotary disc. The center hole and the annular strip holes can lock the rotary disc in different rotation angles. The guide rod assembly limits the rotation tolerance of the carrier plate, and makes the carrier plate move up and down in the vertical direction. The rotary disc with limited rotational freedom is fixedly connected with the ejector rod, so that the locking mechanism can not only realize the linear lifting motion of the ejector rod, but also reduce the rotation angle error between the carrier plate and the ejector rod. A rotating lifting platform is also provided.