Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: A test apparatus for testing function of a USB hub under the control of a USB host computer is provided. The USB host computer issues a USB command during the test. The test apparatus includes a USB bus, an emulation device, a standard bus and a micro-controller device. The USB bus is coupled to the USB hub. The emulation device emulates an USB device connected to the USB bus. The standard bus is connected to the USB host computer. The micro-controller device is connected to the standard bus and the emulation device respectively to process a USB transaction corresponding to the USB command. The invention provides a testing environment which is fully compliant to the WINDOWS 98 environment.