Patents by Inventor Chih-Chi Chou

Chih-Chi Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941298
    Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 26, 2024
    Assignee: MediaTek Inc.
    Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
  • Patent number: 11916077
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Patent number: 8240322
    Abstract: A splash-proof umbrella structure comprises a rod passing through a slide sleeve sliding up and down along the rod. The slide sleeve is coupled to support sticks. A piece of umbrella cloth is arranged on the support sticks. The upper side of the rod has a first rod sleeve and a second rod sleeve. The first rod sleeve has first link rods coupled to the support sticks. The second rod sleeve has second link rods coupled to the first link rods. The bottom of the rod has a handle. When getting off a vehicle in rain, the user can open the umbrella in a confined space to prevent from being wetted by rainwater via sliding the slide sleeve upward to stretch the umbrella cloth bottom-up. When not in use, the umbrella cloth can be collapsed via sliding the slide sleeve toward the handle. Further, the handle can collect rainwater.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: August 14, 2012
    Inventors: Tzu-cheng Chang, Chin-Sen Hsieh, Chih-Chi Chou
  • Publication number: 20120006367
    Abstract: A splash-proof umbrella structure comprises a rod passing through a slide sleeve sliding up and down along the rod. The slide sleeve is coupled to support sticks. A piece of umbrella cloth is arranged on the support sticks. The upper side of the rod has a first rod sleeve and a second rod sleeve. The first rod sleeve has first link rods coupled to the support sticks. The second rod sleeve has second link rods coupled to the first link rods. The bottom of the rod has a handle. When getting off a vehicle in rain, the user can open the umbrella in a confined space to prevent from being wetted by rainwater via sliding the slide sleeve upward to stretch the umbrella cloth bottom-up. When not in use, the umbrella cloth can be collapsed via sliding the slide sleeve toward the handle. Further, the handle can collect rainwater.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 12, 2012
    Inventors: Tzu-cheng Chang, Chin-Sen Hsieh, Chih-Chi Chou