Abstract: A method for permission management includes: generating a plurality of job roles with different permissions according to organization permission table; generating first permission structure directed graph according to the job roles; selecting one of the job roles in first permission structure directed graph as target job role; generating minimum directed spanning graph in first permission structure directed graph according to target job role; determining whether permission of each of the job roles in first permission structure directed graph matches job of each of the job roles in first permission structure directed graph; and adjusting permission and job of each of the job roles to generate second permission structure directed graph if it is determined that permission of each of the job roles in first permission structure directed graph does not match job of each of the job roles in first permission structure directed graph.

Abstract: A memory device, a failure bits detector, and a failure bits detection method thereof are provided. The failure bits detector includes a current generator, a current mirror, and a comparator. The current generator generates a first current according to a reference code. The current mirror mirrors the first current to generate a second current at a second end of the current mirror. The comparator compares a first voltage at a first input end with a second voltage at a second input end to generate a detection result.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.

Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.

Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.

Abstract: A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.

Abstract: The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component.

Abstract: The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component.

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract: A heat-dispersing module of an electronic device is disclosed.

Abstract: A combination structure of a socket and a container is provided. The combination structure includes a container having an opening, and a socket includes a connecting section for being engaged with the opening, a first end extended from the connecting section for being electrically connected to an electronic equipment which is positioned outside the container, and a second end extended from the connecting section for electrically connecting to a circuit unit which is positioned inside the container, wherein a cross-section of the second end is greater than that of the opening and the cross-section of the opening is greater than that of the first end so that the first end is passed through the opening from an inside of the container and exposed to an outside of the container, and the opening blocks the second end for avoiding the second end passing therethrough and fixing the socket inside the container besides mutually fixing the connecting section.

Abstract: A heat-dispersing module of an electronic device is disclosed.

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract: A combination structure of a socket and a container is provided. The combination structure includes a container having an opening, and a socket includes a connecting section for being engaged with the opening, a first end extended from the connecting section for being electrically connected to an electronic equipment which is positioned outside the container, and a second end extended from the connecting section for electrically connecting to a circuit unit which is positioned inside the container, wherein a cross-section of the second end is greater than that of the opening and the cross-section of the opening is greater than that of the first end so that the first end is passed through the opening from an inside of the container and exposed to an outside of the container, and the opening blocks the second end for avoiding the second end passing therethrough and fixing the socket inside the container besides mutually fixing the connecting section.

Abstract: A case for power supply having an air fan and a fan netting is developed. The case includes a case body having a fixing surface and a frame device disposed beyond the fixing surface such that the fan netting is fixed to the frame device from a first side of the fixing surface and the air fan is fixed to the frame device from a second opposite side of the fixing surface. The frame device further includes a frame disposed on the first side of the fixing surface and providing a space for accommodating therein the air fan and a fastener for putting the fan netting, the frame, and the air fan together upon the air fan being positioned in the space from the second side of the fixing surface so as to fix the fan netting and the air fan to the frame.