Abstract: According an embodiment of the disclosure, a sensing display apparatus including a display panel, an encapsulation layer, a sensing circuit layer and a cover is provided. The display panel includes a display region. The encapsulation layer encapsulates the display panel, and a minimum thickness of the encapsulation layer ranges from 1 micrometer (?m) to 10 ?m. The sensing circuit layer is disposed on the encapsulation layer. The ratio of a layout area of the sensing circuit layer to an area of the display region ranges from 3% to 15%. The encapsulation layer and the sensing circuit layer are covered by the cover and the thickness of the cover ranges from 10 ?m to 120 ?m.

Abstract: In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.

Abstract: A protective structure includes a substrate, a hard coating layer and an auxiliary layer. The auxiliary layer is disposed on the substrate. The hard coating layer is disposed on the auxiliary layer. The auxiliary layer is disposed between the substrate and the hard coating layer. The Young's modulus of the auxiliary layer is greater than the Young's modulus of the hard coating layer, and the Young's modulus of the hard coating layer is greater than the Young's modulus of the substrate.

Abstract: An interactive display system and an interactive display controlling method are provided. The interactive display system includes an interactive controller and an interactive display module. The interactive controller includes multiple marking patterns presented on a surface of the interactive controller. The interactive display module includes a display, an image capturing device and a processor. The image capturing device captures a marking image of the marking patterns. The processor is coupled to the display and the image capturing device, the processor obtains location information of the interactive controller, calculates a directional angle of the interactive controller according to a relative position relationship of the marking patterns in the marking image, and calculates a directional coordinate of the interactive controller according to the directional angle and the location information. The display displays an indication object at a position associated with the directional coordinate.

Abstract: A transparent display device including a substrate having a light emitting region and a light transmitting region, a light emitting element located in the light emitting region, a first wall structure having an undercut sidewall, a first top conductive pattern and a barrier multi-layer structure is provided. The first wall structure forms the boundary between the light emitting region and the light transmitting region and the light emitting element is located in the light emitting region surrounded by the first wall structure. The first top conductive pattern is disposed on the top surface of the first wall structure. The barrier multi-layer structure is disposed on the light emitting element. The barrier multi-layer structure includes a first barrier layer and a second barrier layer. An overlapping portion of the first barrier layer and the second barrier is located in the light emitting region surrounded by the first wall structure.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A transparent display device and a control method using the same are provided. The transparent display device includes a transparent display, a plurality of identification sensors, a scene sensor, and a controller. The identification sensors are configured to sense a user located at a first side of the transparent display to generate a plurality of identification data. The scene sensor is configured to sense scene information located at a second side. The controller obtains a user distance between the user and the transparent display, selects corresponding identification data generated by at least one of or multiple of the identification sensors according to the user distance, determines a location and a gaze direction of the user and a target object in the scene information according to the selected corresponding identification data, and presents target object information corresponding to the target object in the transparent display.

Abstract: An optical compensation structure including a substrate, a barrier layer, and a first coating layer is provided. The barrier layer is deposed on the substrate. The barrier layer has a first refractive region and a second refractive region adjacent thereto. A refractive index of the second refraction region is greater than a refractive index of the first refractive region. The first coating layer covers a portion of the second refractive region.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: A touch panel may include a substrate, a touch unit region and a covering layer. The touch unit region includes first electrode and a second electrode isolated from the first electrode. The covering layer covers at least one of the first electrode and the second electrode and has a touch surface. A distance between the touch surface and the first electrode or the second electrode ranges between 0.01 micrometers and 100 micrometers. A mutual capacitance value between the first electrode and the second electrode ranges between 0.1 pF and 10 pF when a touch has not occurred yet.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: A display panel including a substrate, a display device, a dielectric layer, and an optical resonance structure is provided. The substrate has a layout area and a light transmitting area located outside the layout area. The display device is disposed on the layout area of the substrate. The display device includes a first display electrode, a second display electrode, and a display media layer deposited between the first display electrode and the second display electrode. The dielectric layer is disposed on the substrate and covers the display device. The optical resonance structure is disposed on the dielectric layer and distributed correspondingly to the display device. The optical resonance structure includes a first transflective layer and a second transflective layer stacked on the display device and separated from each other.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: An optical film with touch function includes a substrate, a material layer, a plurality of columnar structures, and a filter electrode layer. The substrate has a carrying surface. The material layer is disposed on the carrying surface of the substrate. Each of the columnar structures is extended from a side of the material layer adjacent to the carrying surface to a side of the material layer away from the carrying surface. A side of each of the columnar structures adjacent to the substrate has a first end surface. The filter electrode layer is disposed between the substrate and the material layer. The filter electrode layer includes a plurality of sensing electrode regions electrically insulated from each other. The filter electrode layer has a plurality of openings, and the openings respectively expose the first end surfaces.

Abstract: A touch device is provided. The touch device includes a first insulating layer, a first sensing electrode layer, a second insulating layer, and a second sensing electrode layer. The first sensing electrode layer is located on the first insulating layer. The second insulating layer is located on the first sensing electrode layer. The second sensing electrode layer is located on the second insulating layer.

Abstract: A sensing display panel comprises a display panel including a first substrate and a reflective layer disposed on the first substrate; a buffer layer having a first surface and a second surface opposite to the first surface; a sensing panel; and connection electrodes. The display panel is disposed on the first surface. The sensing display, including at least one filter layer, a gray film and a sensing device layer, has a sensing surface disposed on the second surface. The reflective layer reflects light from the sensing surface toward the sensing panel, the buffer layer, and the display panel. First and second conductive layers included in the sensing device layer are electrically insulated from each other. The first connection electrodes are disposed on the second surface or the first substrate, the first connection electrodes electrically connect to the first and the second conductive layers, respectively.

Abstract: According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.

Abstract: A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.

Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.