Abstract: A method of handling a workpiece includes the following steps. A workpiece is placed on a chuck body, wherein the workpiece includes a tape carrier extending beyond a periphery of the chuck body and a workpiece body disposed on the tape carrier, and the chuck body includes a seal ring surrounding the periphery of the chuck body; the tape carrier is clamped outside the chuck body, wherein the tape carrier leans against the seal ring and an enclosed space is formed between the chuck body, the tape carrier and the seal ring; and a vacuum seal is formed by evacuating gas from the enclosed space to pull the periphery of the workpiece toward the chuck body.

Abstract: A semiconductor chiplet device includes a first die, a second die, a decoupling circuit and an interposer. The interposer includes a plurality of power traces and a plurality of ground traces. The first die and the second die are arranged on a first side of the interposer according to a configuration direction, and are coupled to the power traces and the ground traces. The decoupling circuit is arranged on a second side of the interposer, and is coupled to the power traces and the ground traces. The power traces and the ground traces are staggered with each other, and an extending direction of the ground traces and the power traces is the same as the configuration direction.

Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.

Abstract: A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: Embodiments with present disclosure provides a gate-all-around FET device including extended bottom inner spacers. The extended bottom inner prevents the subsequently formed epitaxial source/drain region from volume loss and induces compressive strain in the channel region to prevent strain loss and channel resistance degradation.

Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer.

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: A manufacturing method of the circuit board includes the following. The third substrate has an opening and includes a first, a second and a third dielectric layers. The opening penetrates the first and the second dielectric layers, and the opening is fully filled with the third dielectric layer. The first, the second and the third substrates are press-fitted so that the second substrate is located between the first and the third substrates. Multiple conductive structures are formed so that the first, the second and the third substrates are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, and the third dielectric layer of the third substrate. The conductive via structure is electrically connected to the first and the third substrates to define a signal path. The ground path surrounds the signal path.

Abstract: Disclosed are devices for optical sensing and manufacturing method thereof. In one embodiment, a device for optical sensing includes a substrate, a photodetector and a reflector. The photodetector is disposed in the substrate. The reflector is disposed in the substrate and spaced apart from the photodetector, wherein the reflector has a reflective surface inclined relative to the photodetector that reflects light transmitted thereto to the photodetector.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A stereoscopic display device includes a sensing device and a display device. The sensing device is suitable for sensing position information and viewing angle information of a user. The display device is connected to the sensing device and suitable for receiving the position information and the viewing angle information. The display device includes a substrate and a plurality of pixels, wherein each of the plurality of pixels includes a first sub-pixel, a second sub-pixel, and a third sub-pixel having main light-emitting directions different from each other. The display device correspondingly turns on at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel and turns off at least another of the first sub-pixel, the second sub-pixel, and the third sub-pixel based on the position information and the viewing angle information.

Abstract: Disclosed are a display device and an operating method thereof. The display device includes an eye tracking circuit, a main display, an extended display, and an image processing circuit. By the eye tracking circuit disposed in the main display, the image processing circuit obtains a viewing position of eyes of a user. The image processing circuit divides an original image into a first partial image and a second partial image. The first partial image is adapted to be displayed on the main display, and the second partial image is adapted to be virtually displayed on an extended virtual display. The image processing circuit converts any pixel position on the extended virtual display into a corresponding pixel position on the extended display based on the viewing position, so as to convert the second partial image into a converted second partial image to be displayed on the extended display.

Abstract: An electronic device with antibacterial effect detection and a portable device are provided. The electronic device includes an antibacterial housing, a light emitting unit, a light receiving unit and a processing unit. The antibacterial housing has a concave hole, which gradually shrinks from the inside to the outside. The light emitting unit is arranged under the concave hole of the antibacterial housing. The light emitting unit is used for emitting a detection light toward an inclined side wall of the concave hole. The light receiving unit is arranged under the concave hole of the antibacterial housing. The light receiving unit is used for receiving a detection light reflected from the inclined side wall of the concave hole. The processing unit is used for analyzing the antibacterial effect of the antibacterial housing according to the detection light.

Abstract: A power delivery system includes a PD source device and a PD sink device. The PD source device is configured to detect its connection status with the PD sink device and determine whether its power supply is high-voltage operation. When determining that the PD source device is supplying high-voltage power and detecting that the PD source device is detached from the PD sink device, the PD source device is configured to provide an oscillating rapid discharging path for its output capacitor, thereby rapidly reducing its output voltage and suppressing electrical arc.

Abstract: A power supply device is provided. The power supply device includes a housing, a power converter, a controller, multiple humidity sensitive capacitors, and a feedback circuit. The housing has multiple joints. The controller controls the power converter to provide an output voltage. The humidity sensitive capacitors are respectively configured in the housing and adjacent to a corresponding joint of the joints. The humidity sensitive capacitors jointly provide a sensing capacitance value. The feedback circuit changes a gain value and a compensation bandwidth of the output voltage in response to the change of the sensing capacitance value. When the humidity of at least one of the joints increases, the sensing capacitance value is reduced, so that the gain value and the compensation bandwidth are reduced.

Abstract: A keyboard device with a display panel including a base, a scissors feet assembly movably disposed on the base, an elastic member disposed on the base, a display panel supported by the scissors feet assembly and the elastic member, and multiple light transmittance keycaps disposed on the display panel is provided. The display panel has multiple display surfaces, multiple hollow portions, and multiple elastic portions. Each of the display surfaces is surrounded by the hollow portions, and is suspended between the hollow portions by the elastic portions. The light transmittance keycaps respectively and correspondingly cover the display surfaces.

Abstract: An electronic apparatus and a load adjusting method thereof are provided. The method includes the following steps. Powering of an external power supply is detected. A self-power consumption time of the battery from a full capacity to a preset capacity is calculated and recorded when the powering of the external power supply is detected. A first average value of multiple self-power consumption times recorded within a preset period from a current time is calculated, and the first average value is compared with a second average value of the self-power consumption times of a previous preset period of the preset period. A value of a power limit for controlling the electronic apparatus to enter a load adjusting state is adjusted according to a comparison result.

Abstract: A display apparatus including a display panel, a camera module, and a diffraction suppression device is provided. The display panel is provided with multiple signal lines and multiple display pixels. The signal lines and the display pixels are alternately arranged along at least one direction. The camera module has a light receiving surface facing the display panel. The light receiving surface is overlapped with the display panel. The diffraction suppression device is disposed between the display panel and the camera module, and has multiple first light-transmitting regions and multiple second light-transmitting regions alternately arranged along the at least one direction. The first light-transmitting regions are respectively overlapped with the display pixels. The second light-transmitting regions are respectively overlapped with the signal lines.