Abstract: A semiconductor wiring substrate includes at least one circuit layer, at least one dielectric layer and a redistribution layer. The at least one circuit layer includes multiple signal traces and multiple ground traces alternately arranged on the at least one circuit layer, and has a channel width in a direction. The at least one dielectric layer is between the at least one circuit layer. The redistribution layer is above the at least one circuit layer, allows a first solder bump and a second solder bump to be placed, and includes a first metal contact and a second metal contact. The first solder bump and the second solder bump connect the at least one circuit layer through the first metal contact and the second metal contact, respectively. The channel width is greater than spacing between the first solder bump and the second solder bump in the direction.

Abstract: A semiconductor chiplet device includes a first die, a second die, a decoupling circuit and an interposer. The interposer includes a plurality of power traces and a plurality of ground traces. The first die and the second die are arranged on a first side of the interposer according to a configuration direction, and are coupled to the power traces and the ground traces. The decoupling circuit is arranged on a second side of the interposer, and is coupled to the power traces and the ground traces. The power traces and the ground traces are staggered with each other, and an extending direction of the ground traces and the power traces is the same as the configuration direction.

Abstract: A semiconductor chiplet device includes a package substrate, an interposer layer, a first die and a second die. The first die includes a first interface, and the second die includes a second interface. A first side of the interposer layer is configured to arrange the first die and the second die. The first die and the second die perform a data transmission through the first interface, the interposer layer and the second interface. The package substrate is arranged on a second side of the interposer layer, and includes a decoupling capacitor. The decoupling capacitor is arranged between the first interface and the second interface, or arranged in a vertical projection area of the first interface and the second interface on the package substrate.

Abstract: A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.

Abstract: A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.

Abstract: A semiconductor chiplet device includes a package substrate, an interposer layer, a first die and a second die. The first die includes a first interface, and the second die includes a second interface. A first side of the interposer layer is configured to arrange the first die and the second die. The first die and the second die perform a data transmission through the first interface, the interposer layer and the second interface. The package substrate is arranged on a second side of the interposer layer, and includes a decoupling capacitor. The decoupling capacitor is arranged between the first interface and the second interface, or arranged in a vertical projection area of the first interface and the second interface on the package substrate.

Abstract: A computer implemented method for matching services to potential receivers of the services that includes registering at least one of service providers and service receivers as members to a service matching system. The service matching system collects data from the members. Permission to collect data from the members is revocable at any time by the members. The method further includes taking an order from a first service receiver to receive goods from a service provider; and calculating a route of the first service receiver to obtain the goods from the service provider. The method further includes matching the route of the first service receiver with a potential delivery route to a second service receiver having an order with the service provider; and offering a promotion to the first service receiver to deliver the order by the second service receiver with the service provider over the potential delivery route.

Abstract: A computer implemented method for matching services to potential receivers of the services that includes registering at least one of service providers and service receivers as members to a service matching system. The service matching system collects data from the members. Permission to collect data from the members is revocable at any time by the members. The method further includes taking an order from a first service receiver to receive goods from a service provider; and calculating a route of the first service receiver to obtain the goods from the service provider. The method further includes matching the route of the first service receiver with a potential delivery route to a second service receiver having an order with the service provider; and offering a promotion to the first service receiver to deliver the order by the second service receiver with the service provider over the potential delivery route.

Abstract: A rack for holding hairdressing tools including a U-shaped shelf that is detachably connected to and behind a back of a chair intended for hairdressing by means of connectors. The shelf includes several compartments for holding different hairdressing tools and is so sized and curved that an inner wall thereof is suitable for closely locating behind the back of a hairdressing chair. The connectors are connected to the inner wall of the shelf at suitable positions and each includes a supporting arm for supporting the shelf thereon, a clamping arm, and an elastic pressing plate. The clamping arms and the pressing plates cooperate with one another to clamp the back of the chair between them, so that the shelf is connected to and behind the back without occupying additional room and located at a height that allows a hairdresser to get the tools in the shelf without bending frequently.