Patents by Inventor Chih-Chiang Hung

Chih-Chiang Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240020260
    Abstract: A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.
    Type: Application
    Filed: July 13, 2022
    Publication date: January 18, 2024
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Fan Yang, Chih-Chiang Hung, Yuan-Hung Lin, Shih-Hsuan Hsu, Igor Elkanovich
  • Publication number: 20230144129
    Abstract: A semiconductor chiplet device includes a package substrate, an interposer layer, a first die and a second die. The first die includes a first interface, and the second die includes a second interface. A first side of the interposer layer is configured to arrange the first die and the second die. The first die and the second die perform a data transmission through the first interface, the interposer layer and the second interface. The package substrate is arranged on a second side of the interposer layer, and includes a decoupling capacitor. The decoupling capacitor is arranged between the first interface and the second interface, or arranged in a vertical projection area of the first interface and the second interface on the package substrate.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Inventors: Sheng-Fan YANG, Chih-Chiang HUNG, Chen LEE, Yuan-Hung LIN
  • Patent number: 11270250
    Abstract: A computer implemented method for matching services to potential receivers of the services that includes registering at least one of service providers and service receivers as members to a service matching system. The service matching system collects data from the members. Permission to collect data from the members is revocable at any time by the members. The method further includes taking an order from a first service receiver to receive goods from a service provider; and calculating a route of the first service receiver to obtain the goods from the service provider. The method further includes matching the route of the first service receiver with a potential delivery route to a second service receiver having an order with the service provider; and offering a promotion to the first service receiver to deliver the order by the second service receiver with the service provider over the potential delivery route.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: March 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Cheng-Fang Lin, Chih-Chiang Hung, Amanda PL Yang, Joey H. Y. Tseng, Ching-Chun Liu, Yu-Siang Chen
  • Publication number: 20210256590
    Abstract: A computer implemented method for matching services to potential receivers of the services that includes registering at least one of service providers and service receivers as members to a service matching system. The service matching system collects data from the members. Permission to collect data from the members is revocable at any time by the members. The method further includes taking an order from a first service receiver to receive goods from a service provider; and calculating a route of the first service receiver to obtain the goods from the service provider. The method further includes matching the route of the first service receiver with a potential delivery route to a second service receiver having an order with the service provider; and offering a promotion to the first service receiver to deliver the order by the second service receiver with the service provider over the potential delivery route.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 19, 2021
    Inventors: Cheng-Fang Lin, Chih-Chiang Hung, Amanda PL Yang, Joey H.Y. Tseng, Ching-Chun Liu, Yu-Siang Chen
  • Patent number: 6170680
    Abstract: A rack for holding hairdressing tools including a U-shaped shelf that is detachably connected to and behind a back of a chair intended for hairdressing by means of connectors. The shelf includes several compartments for holding different hairdressing tools and is so sized and curved that an inner wall thereof is suitable for closely locating behind the back of a hairdressing chair. The connectors are connected to the inner wall of the shelf at suitable positions and each includes a supporting arm for supporting the shelf thereon, a clamping arm, and an elastic pressing plate. The clamping arms and the pressing plates cooperate with one another to clamp the back of the chair between them, so that the shelf is connected to and behind the back without occupying additional room and located at a height that allows a hairdresser to get the tools in the shelf without bending frequently.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: January 9, 2001
    Inventor: Chih-Chiang Hung