Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.

Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A method for manufacturing a nanosheet semiconductor device includes forming a poly gate on a nanosheet stack which includes at least one first nanosheet and at least one second nanosheet alternating with the at least one first nanosheet; recessing the nanosheet stack to form a source/drain recess proximate to the poly gate; forming an inner spacer laterally covering the at least one first nanosheet; and selectively etching the at least one second nanosheet.

Abstract: A localized heating device includes a plasma deforming portion and a heating portion. The plasma deforming portion includes an inlet end having a circular hole, an outlet end having an elongated hole with a first length and a first width, and a channel smoothly connected with the circular hole and the elongated hole. The heating portion, disposed at the outlet end, includes two control covers spaced by a slot. The elongated hole and the slot being oppositely disposed with respect to the plasma deforming portion. A plasma flow provided by a plasma producing source being to enter the channel via the circular hole, then to flow through the elongated hole, and finally to reach the slot.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: The present disclosure provides a composition for submucosal injection including a divalent cation and an oligosaccharide obtained by exposing powdered polysaccharides to irradiation, heat, ultrasound, or ultraviolet radiation. The composition may be provided as a single solution; or the divalent cation and the oligosaccharide may be separately packaged, with the divalent cation being provided in solution form and the oligosaccharide being provided in powder form. The divalent cation may be 0.1-0.5% w/v of Ca2+, Mg2+, Fe2+, Cu2+, Ba2+, Zn2+, or any combination thereof. The oligosaccharide may be 0.5-2% w/v of degraded sodium alginate, degraded xanthan gum, degraded dextran, degraded welan gum, degraded gellan gum, degraded diutan gum, or any combination thereof. When the divalent cation is in contact with the oligosaccharide, viscosity of the composition is greater than 1000 cP, and injection pressure of the composition falls within a range of 2.5-4 kgf.

Abstract: An electrical connector assembly includes a first connector, and a second connector docked with the first connector. The first connector includes a first insulating housing, a plurality of first signal terminals disposed in the first insulating housing, and a plurality of first power terminals disposed in the first insulating housing. Extension directions of the plurality of the first power terminals are multiple directions. The second connector includes a second insulating housing, a plurality of second signal terminals disposed in the second insulating housing, and a plurality of second power terminals disposed in the second insulating housing. Extension directions of the plurality of the second power terminals are multiple directions. The plurality of the first signal terminals are corresponding to the plurality of the second signal terminals. The plurality of the second power terminals correspondingly contact with the plurality of the first power terminals.

Abstract: An electrical connector includes an insulating body, a plurality of signal terminals assembled to the insulating body, and a plurality of power terminals assembled to the insulating body. The plurality of the power terminals surround and are spaced from the plurality of the signal terminals. Each power terminal has a base plate. Two opposite sides of the base plate extend towards the plurality of the signal terminals to form two bending arms. Two free ends of the two bending arms extend towards each other to form two connecting portions. A middle of a rear end of the base plate slantwise extends inward and towards the docking connector to form one first elastic arm. Two rear ends of the two connecting portions slantwise extend inward and towards the docking connector to form two second elastic arms.

Abstract: An electrical connector includes an insulating body, a plurality of signal terminals assembled to the insulating body, and a plurality of power terminals assembled to the insulating body. The plurality of the power terminals surround and are spaced from the plurality of the signal terminals. Each power terminal has a base plate. Two opposite sides of the base plate extend towards the plurality of the signal terminals to form two bending arms. Two free ends of the two bending arms extend towards each other to form two connecting portions. A middle of a rear end of the base plate slantwise extends inward and towards the docking connector to form one first elastic arm. Two rear ends of the two connecting portions slantwise extend inward and towards the docking connector to form two second elastic arms.

Abstract: An electrical connector assembly includes a first connector, and a second connector docked with the first connector. The first connector includes a first insulating housing, a plurality of first signal terminals disposed in the first insulating housing, and a plurality of first power terminals disposed in the first insulating housing. Extension directions of the plurality of the first power terminals are multiple directions. The second connector includes a second insulating housing, a plurality of second signal terminals disposed in the second insulating housing, and a plurality of second power terminals disposed in the second insulating housing. Extension directions of the plurality of the second power terminals are multiple directions. The plurality of the first signal terminals are corresponding to the plurality of the second signal terminals. The plurality of the second power terminals correspondingly contact with the plurality of the first power terminals.

Abstract: The present disclosure provides a composition for submucosal injection including a divalent cation and an oligosaccharide obtained by exposing powdered polysaccharides to irradiation, heat, ultrasound, or ultraviolet radiation. The composition may be provided as a single solution; or the divalent cation and the oligosaccharide may be separately packaged, with the divalent cation being provided in solution form and the oligosaccharide being provided in powder form. The divalent cation may be 0.1-0.5% w/v of Ca2+, Mg2+, Fe2+, Cu2+, Ba2+, Zn2+, or any combination thereof. The oligosaccharide may be 0.5-2% w/v of degraded sodium alginate, degraded xanthan gum, degraded dextran, degraded welan gum, degraded gellan gum, degraded diutan gum, or any combination thereof. When the divalent cation is in contact with the oligosaccharide, viscosity of the composition is greater than 1000 cP, and injection pressure of the composition falls within a range of 2.5-4 kgf.

Abstract: A button assembly includes a pressing element, a tray, and a locking structure fastened between the pressing element and the tray. One side surface of the pressing element is recessed inward to form an accommodating space. The pressing element opens at least one first upper fixing hole. A bottom surface of the pressing element is recessed upward to form a first accommodating slot. The first accommodating slot opens at least one first opening. The tray of which one side is connected with the pressing element. The one side of the tray has a base portion mounted in the accommodating space. The base portion opens at least one second opening. A bottom surface of a peripheral wall of the at least one second opening is recessed upward to form at least one locking slot. The locking structure includes at least one locking element and an elastic arm.

Abstract: A button assembly of the present invention is configured in a communication equipment. The button assembly includes a button, a tray and at least an elastic arm. A side of the button is recessed inward to form a holding space. At least an inner side wall of the holding space is recessed to form a clamping groove. The tray is disposed in the holding space. The elastic arm has a fixing portion mounted on a side wall of the tray. The fixing portion is extended frontward and is protruded outward to form a contact part. The contact part is extended frontward and outward to form a clamping part disposed in the clamping groove. The clamping groove and the elastic arm are disposed to provide the button and the tray to be fixed or disengaged, achieving an effect of saving space in assembling of internal components of the communication equipment.

Abstract: A button assembly of the present invention is configured in a communication equipment. The button assembly includes a button, a tray and at least an elastic arm. A side of the button is recessed inward to form a holding space. At least an inner side wall of the holding space is recessed to form a clamping groove. The tray is disposed in the holding space. The elastic arm has a fixing portion mounted on a side wall of the tray. The fixing portion is extended frontward and is protruded outward to form a contact part. The contact part is extended frontward and outward to form a clamping part disposed in the clamping groove. The clamping groove and the elastic arm are disposed to provide the button and the tray to be fixed or disengaged, achieving an effect of saving space in assembling of internal components of the communication equipment.

Abstract: A button assembly includes a pressing element, a tray, and a locking structure fastened between the pressing element and the tray. One side surface of the pressing element is recessed inward to form an accommodating space. The pressing element opens at least one first upper fixing hole. A bottom surface of the pressing element is recessed upward to form a first accommodating slot. The first accommodating slot opens at least one first opening. The tray of which one side is connected with the pressing element. The one side of the tray has a base portion mounted in the accommodating space. The base portion opens at least one second opening. A bottom surface of a peripheral wall of the at least one second opening is recessed upward to form at least one locking slot. The locking structure includes at least one locking element and an elastic arm.

Abstract: A touch knob which can transmit user touches above to a touch-sensitive surface below includes a base, a rotating shaft, and a rotating cap. The rotating cap defines a receiving groove facing the base, and the rotating shaft extends into the receiving groove and is connected to the rotating cap. The rotating cap is configured to rotate to transmit user touches in a bounded circular area, at least one conductive touch head is located on the rotating cap and in the receiving groove, and moves as the rotating cap moves. The disclosure avoids the need to cut or form any opening in the cover of the touch-sensitive surface or panel for buttons to be installed. A device using the above touch knob is also provided.