Abstract: A packaged chip, including a package structure, a redistribution structure, and a carrier, where the package structure includes a first chip and a second chip adjacent to the first chip. The redistribution structure is configured to electrically connect the first chip and the carrier, and is configured to electrically connect the second chip and the carrier. The redistribution structure includes a main body made of an insulating material and a bump solder array welded to a lower surface of the main body. A metal redistribution wire group and a metal interconnection wire group that has a curve or bend design are disposed in the main body. An upper surface of the main body of the redistribution structure adheres to a lower surface of the first chip and a lower surface of the second chip. The redistribution structure is welded to an upper surface of the carrier.

Abstract: A packaged chip, including a package structure, a redistribution structure, and a carrier, where the package structure includes a first chip and a second chip adjacent to the first chip. The redistribution structure is configured to electrically connect the first chip and the carrier, and is configured to electrically connect the second chip and the carrier. The redistribution structure includes a main body made of an insulating material and a bump solder array welded to a lower surface of the main body. A metal redistribution wire group and a metal interconnection wire group that has a curve or bend design are disposed in the main body. An upper surface of the main body of the redistribution structure adheres to a lower surface of the first chip and a lower surface of the second chip. The redistribution structure is welded to an upper surface of the carrier.

Abstract: A continuous decoration transferring and punching apparatus and process thereof which is capable to continuously form a plurality of decorated products is provided. The continuous decoration transferring and punching apparatus includes a first roll feeder for providing a substrate, a second roll feeder for providing a plurality of decoration films, a transferring unit for continuously transferring the decoration films to the substrate and a punching unit for continuously punching the substrate after the decoration films are transferred to the substrate for forming a plurality of decorated pieces. By using the roll feeders to synchronously and continuously transfer the decoration films to the substrate, a large amount of decoration transferred substrates can be obtained at the same time. Moreover, a plurality of decorated pieces can be accomplished through the utilizing of a following punching operation after the transferring process.