Patents by Inventor Chih-Chiang Tsao

Chih-Chiang Tsao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and method for manufacturing the same
    Patent number: 9978716
    Abstract: A package structure includes a molding material, at least one through-via, at least one conductor, at least one dummy structure and an underfill. The through-via extends through the molding material. The conductor is present on the through-via. The dummy structure is present on the molding material and includes a dielectric material. The underfill is at least partially present between the conductor and the dummy structure.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: May 22, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20170317054
    Abstract: A package structure includes a molding material, at least one through-via, at least one conductor, at least one dummy structure and an underfill. The through-via extends through the molding material. The conductor is present on the through-via. The dummy structure is present on the molding material and includes a dielectric material. The underfill is at least partially present between the conductor and the dummy structure.
    Type: Application
    Filed: August 15, 2016
    Publication date: November 2, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chiang TSAO, Hsiu-Jen LIN, Chun-Cheng LIN, Chih-Wei LIN, Ming-Da CHENG, Ching-Hua HSIEH, Chung-Shi LIU
  • INTERCONNECTION JOINTS HAVING VARIABLE VOLUMES IN PACKAGE STRUCTURES AND METHODS OF FORMATION THEREOF
    Publication number: 20170025382
    Abstract: An embodiment method includes analyzing warpage characteristics of a first package component and a second package component and forming a plurality of solder paste elements on the first package component. A volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component. The method further includes aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component and bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.
    Type: Application
    Filed: July 23, 2015
    Publication date: January 26, 2017
    Inventors: Hsuan-Ting Kuo, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen, Chih-Chiang Tsao
  • Interconnection joints having variable volumes in package structures and methods of formation thereof
    Patent number: 9536865
    Abstract: An embodiment method includes analyzing warpage characteristics of a first package component and a second package component and forming a plurality of solder paste elements on the first package component. A volume of each of the plurality of solder paste elements is based on the warpage characteristics of the first package component and the second package component. The method further includes aligning a plurality of connectors disposed on the second package component to the plurality of solder paste elements on the first package component and bonding the second package component to the first package component by reflowing the plurality of connectors and the plurality of solder paste elements.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: January 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsuan-Ting Kuo, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen, Chih-Chiang Tsao
  • Laser emitting device of optical disc drive
    Publication number: 20050265409
    Abstract: A laser emitting device of an optical disc drive includes a housing having a laser-transmissive portion; a laser-emitting element disposed in the housing for emitting a laser light through the laser-transmissive portion; and a semiconductor substrate integrating therewith a laser sensor and a thermal sensor and disposed in the housing at a position that an intensity of the laser light is detectable by the laser sensor and a temperature inside the housing is detectable by the thermal sensor. By integration, the production of the optical pickup head can be simplified.
    Type: Application
    Filed: May 19, 2005
    Publication date: December 1, 2005
    Inventors: Chih-Chiang Tsao, Cheng-Yao Liao