Abstract: The disclosure provides a converter circuit, a power stage circuit and a temperature balancing method. The converter circuit includes power stage circuits and a control circuit. The power stage circuit includes a power circuit, a temperature sense circuit, a current sense circuit and a current feedback control circuit. The temperature sense circuit senses a temperature of the power stage circuit, to output a temperature sense value. The current sense circuit senses an output current of the power circuit, to output a current sense value. The current feedback control circuit compares the temperature sense value with a highest temperature value of the power stage circuits, and outputs one of the current sense value and adjusted current sense value to the control circuit according to a comparison result of the temperature sense value and the highest temperature value.

Abstract: A semiconductor structure has a frontside and a backside. The semiconductor structure includes an isolation structure at the backside; one or more transistors at the frontside, wherein the one or more transistors have source/drain epitaxial features; two metal plugs through the isolation structure and contacting two of the source/drain electrodes from the backside; and a dielectric liner filling a space between the two metal plugs, wherein the dielectric liner partially or fully surrounds an air gap between the two metal plugs.

Abstract: An integrated circuit includes a substrate having a semiconductor layer. The integrated circuit includes a transistor. The transistor includes stacked channels above the semiconductor layer, a first source/drain region in contact with the channels, and a second source/drain region in contact with the channels. A backside source/drain contact is positioned in the substrate directly below and electrically coupled to the first source/drain region. A frontside source/drain contact is directly above and electrically coupled to the first source/drain region. A bottom semiconductor structure is positioned below the second source/drain region and in contact with the semiconductor layer.

Abstract: Embodiments of the present disclosure provide a method for forming backside gate contacts and semiconductor fabricated thereof. A semiconductor device includes both signal outputs, such as source/drain contacts, and signal inputs, such as gate contacts, formed on a backside of the substrate. The backside gate contacts and backside source/drain contacts are formed in a self-aligned manner.

Abstract: An integrated circuit includes a substrate at a front side of the integrated circuit. A first gate all around transistor is disposed on the substrate. The first gate all around transistor includes a channel region including at least one semiconductor nanostructure, source/drain regions arranged at opposite sides of the channel region, and a gate electrode. A shallow trench isolation region extends into the integrated circuit from the backside. A backside gate plug extends into the integrated circuit from the backside and contacts the gate electrode of the first gate all around transistor. The backside gate plug laterally contacts the shallow trench isolation region at the backside of the integrated circuit.

Abstract: A semiconductor device may include one or more transistor structures that include a plurality of source/drain regions and a gate structure between the source/drain regions. The semiconductor device may further include one or more dielectric layers between a source/drain contact structure and a gate structure of the one or more of the transistor structures. The one or more dielectric layers may be manufactured using on oxidation treatment process to tune the dielectric constant of the one or more dielectric layers. The dielectric constant of the one or more dielectric layers may be tuned to reduce the parasitic capacitance between the source/drain contact structure and the gate structure (which are conductive structures). In particular, the dielectric constant of the one or more spacer dielectric may be tuned using the oxidation treatment process to lower the as-deposited dielectric constant of the one or more dielectric layers.

Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: A voltage conversion system includes a multi-phase voltage converter and a controller. The multi-phase voltage converter is coupled to a load. A first phase circuit, a second phase circuit, and a third phase circuit in the multi-phase voltage converter enter a charging state in sequence during a first period. At least one driver circuit in the multi-phase voltage converter is coupled to the first phase circuit, the second phase circuit, and the third phase circuit. The controller is coupled to the at least one driver circuit. According to a trigger event, the controller outputs at least one driving signal to the at least one driver circuit such that the at least one driver circuit adjusts the second phase circuit or the third phase circuit to be an activation item with highest priority during a second period after the first period.

Abstract: A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

Abstract: A display apparatus is disclosed. The display apparatus includes a color filter, a first backlight unit, a second backlight unit and a third backlight unit. The first backlight unit, the second backlight unit and the third backlight unit are disposed relative to the color filter and independently emit a first color light, a second color light and a third color light to the color filter respectively. In a brightness mode, the first color light has a first intensity, the second color light has a second intensity and the third color light has a third intensity. In a color mode, when a display image of the display apparatus is biased to a third color corresponding to the third color light, the display apparatus reduces at least one of the first intensity and the second intensity.

Abstract: A backlight module provides light to a display panel and includes a bottom board, a support frame, first and second magnetic members, a light guide device, and a light source. The support frame is connected to the bottom board to contain the light guide device. The light source is disposed on the bottom board corresponding to a light entrance surface of the light guide device. Light of the light source is incident into the light guide device via the light entrance surface and emitted to the display panel from a light exit surface of the light guide device. The first magnetic member is disposed on the support frame or the light guide device corresponding to the light source. The second magnetic member is disposed corresponding to the first magnetic member to generate a magnetic force for driving the light entrance surface to be aligned with the light source.

Abstract: A display apparatus is disclosed. The display apparatus includes a color filter, a first backlight unit, a second backlight unit and a third backlight unit. The first backlight unit, the second backlight unit and the third backlight unit are disposed relative to the color filter and independently emit a first color light, a second color light and a third color light to the color filter respectively. In a brightness mode, the first color light has a first intensity, the second color light has a second intensity and the third color light has a third intensity. In a color mode, when a display image of the display apparatus is biased to a third color corresponding to the third color light, the display apparatus reduces at least one of the first intensity and the second intensity.

Abstract: A display panel formed by connecting a plurality of panels, includes a first substrate, a plurality of first light-emitting elements, a first patterned conductive layer and a first driving circuit device. The first substrate has a first light output surface and a first sidewall, wherein the first sidewall connects to the first light output surface, and forms a non-180° angle with the first light output surface. The first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall. The first driving circuit device is disposed on the first substrate, adjacent to an edge of the first substrate and electrically connected to one of the first light-emitting elements.

Abstract: A display panel includes a first substrate used to connect with at least one other substrate, a plurality of first light-emitting elements and a first patterned conductive layer. The first substrate includes a first light output surface and a first sidewall connecting to the first light output surface, wherein the first sidewall forms a non-180° angle with the first light output surface. The plurality of first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall.

Abstract: A display device including a display panel, a light guide plate and a light emitting module is disclosed. The light guide plate is opposite to the display panel and has a light incident surface. The light emitting module emits a light to the light incident surface. The light emitting module includes a substrate, multiple first light emitting elements and multiple second light emitting elements. The first light emitting elements are disposed on the substrate along the first direction and divided into multiple first luminous areas. Each first luminous area includes at least two first light emitting elements. The second light emitting elements are disposed on the substrate along the first direction and divided into multiple second luminous areas. Each second luminous area includes at least two second light emitting elements. The first and second luminous areas are staggered along the second direction perpendicular to the first direction.

Abstract: A backlight module includes a light-transmitting shell, a first light-emitting device, a first light conversion layer and an LGP. The light-transmitting shell includes a first top plate and a first sidewall. The first top plate connects to the first sidewall and two collectively make a non-180° angle, so as to define a first light-mixing space. The first light-emitting device is disposed in the first light-mixing space to provide a first color light. The first light conversion layer is disposed on the first top plate to convert the first color light to a second color light. The LGP has a light incident surface and a light exit surface, the first top plate is disposed between the light incident surface and the first light-emitting device, and the second color light comes into the light guide plate from the light incident surface and is emitted outwards from the light exit surface.

Abstract: A backlight module provides light to a display panel and includes a bottom board, a support frame, first and second magnetic members, a light guide device, and a light source. The support frame is connected to the bottom board to contain the light guide device. The light source is disposed on the bottom board corresponding to a light entrance surface of the light guide device. Light of the light source is incident into the light guide device via the light entrance surface and emitted to the display panel from a light exit surface of the light guide device. The first magnetic member is disposed on the support frame or the light guide device corresponding to the light source. The second magnetic member is disposed corresponding to the first magnetic member to generate a magnetic force for driving the light entrance surface to be aligned with the light source.

Abstract: A backlight module includes a light-transmitting shell, a first light-emitting device, a first light conversion layer and an LGP. The light-transmitting shell includes a first top plate and a first sidewall. The first top plate connects to the first sidewall and two collectively make a non-180° angle, so as to define a first light-mixing space. The first light-emitting device is disposed in the first light-mixing space to provide a first color light. The first light conversion layer is disposed on the first top plate to convert the first color light to a second color light. The LGP has a light incident surface and a light exit surface, the first top plate is disposed between the light incident surface and the first light-emitting device, and the second color light comes into the light guide plate from the light incident surface and is emitted outwards from the light exit surface.

Abstract: A display panel formed by connecting a plurality of panels, includes a first substrate, a plurality of first light-emitting elements, a first patterned conductive layer and a first driving circuit device. The first substrate has a first light output surface and a first sidewall, wherein the first sidewall connects to the first light output surface, and forms a non-180° angle with the first light output surface. The first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall. The first driving circuit device is disposed on the first substrate, adjacent to an edge of the first substrate and electrically connected to one of the first light-emitting elements.

Abstract: A display panel includes a first substrate used to connect with at least one other substrate, a plurality of first light-emitting elements and a first patterned conductive layer. The first substrate includes a first light output surface and a first sidewall connecting to the first light output surface, wherein the first sidewall forms a non-180° angle with the first light output surface. The plurality of first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall.