Patents by Inventor Chih-Chien Ho
Chih-Chien Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128094Abstract: A method for forming integrated circuit (IC) packages includes mounting dies on a strip of interconnects and applying wire bonds in regions of the strip of interconnects proximate to mold shields. The method also includes adjusting the mold shields of the strip of interconnects. The method includes flowing a mold compound on the strip of interconnects to form a strip of IC packages. Mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects across the strip of interconnects to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through the regions of the strip of interconnects proximate to the mold shields. The method includes singulating the strip of IC packages to form the IC packages.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Inventor: CHIH-CHIEN HO
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Patent number: 11948721Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.Type: GrantFiled: May 26, 2020Date of Patent: April 2, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ying-Chuan Kao, Hung-Yu Chou, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho
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Patent number: 11908705Abstract: A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.Type: GrantFiled: October 18, 2021Date of Patent: February 20, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Chih-Chien Ho
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Patent number: 11817374Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.Type: GrantFiled: April 14, 2021Date of Patent: November 14, 2023Assignee: Texas Instruments IncorporatedInventors: Chih-Chien Ho, Bo-Hsun Pan, Yuh-Harng Chien
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Publication number: 20230317571Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.Type: ApplicationFiled: March 30, 2022Publication date: October 5, 2023Inventors: Hsiang Ming Hsiao, Hung-Yu Chou, Yuh-Harng Chien, Chih-Chien Ho, Che Wei Tu, Bo-Hsun Pan, Megan Chang
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Publication number: 20230121743Abstract: A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.Type: ApplicationFiled: October 18, 2021Publication date: April 20, 2023Inventor: Chih-Chien Ho
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Publication number: 20220336331Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.Type: ApplicationFiled: April 14, 2021Publication date: October 20, 2022Inventors: Chih-Chien Ho, Bo-Hsun Pan, Yuh-Harng Chien
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Patent number: 11444012Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.Type: GrantFiled: March 26, 2020Date of Patent: September 13, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yuh-Harng Chien, Chang-Yen Ko, Chih-Chien Ho
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Patent number: 11342247Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.Type: GrantFiled: February 12, 2020Date of Patent: May 24, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chia-Yu Chang, Chih-Chien Ho, Steven Su
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Publication number: 20210375525Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.Type: ApplicationFiled: May 26, 2020Publication date: December 2, 2021Inventors: Ying-Chuan Kao, Hung-Yu Chou, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho
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Publication number: 20210305139Abstract: In a described example, an apparatus includes a package substrate with a split die pad having a slot between a die mount portion and a wire bonding portion; a first end of the wire bonding portion coupled to the die mount portion at one end of the slot; a second end of the wire bonding portion coupled to a first lead on the package substrate. At least one semiconductor die is mounted on the die mount portion; a first end of a first wire bond is bonded to a first bond pad on the at least one semiconductor die; a second end of the first wire bond is bonded to the wire bonding portion; and mold compound covers the at least one semiconductor die, the die mount portion, the wire bonding portion, and fills the slot.Type: ApplicationFiled: March 26, 2020Publication date: September 30, 2021Inventors: Yuh-Harng Chien, Chang-Yen Ko, Chih-Chien Ho
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Patent number: 11081428Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.Type: GrantFiled: August 10, 2019Date of Patent: August 3, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Stanley Chou, Yuh-Harng Chien, Steven Alfred Kummerl, Bo-Hsun Pan, Pi-Chiang Huang, Frank Yu, Chih-Chien Ho
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Publication number: 20210043548Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.Type: ApplicationFiled: August 10, 2019Publication date: February 11, 2021Applicant: Texas Instruments IncorporatedInventors: Stanley Chou, Yuh-Harng Chien, Steven Alfred Kummerl, Bo-Hsun Pan, Pi-Chiang Huang, Frank Yu, Chih-Chien Ho
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Patent number: 10811343Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.Type: GrantFiled: January 21, 2019Date of Patent: October 20, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yuh-Harng Chien, Chih-Chien Ho, Steven Su
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Publication number: 20200185308Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.Type: ApplicationFiled: February 12, 2020Publication date: June 11, 2020Inventors: Chia-Yu Chang, Chih-Chien Ho, Steven Su
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Patent number: 10600724Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.Type: GrantFiled: May 10, 2016Date of Patent: March 24, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chia-Yu Chang, Chih-Chien Ho, Steven Su
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Patent number: 10573581Abstract: A leadframe has a peripheral frame. A die attach pad (DAP) is positioned inwardly and downwardly of the peripheral frame. Two spaced apart parallel arms engage one side of the DAP. In one embodiment the arms are portions of a U-shaped strap.Type: GrantFiled: September 29, 2016Date of Patent: February 25, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chih-Chien Ho, Chung-Hao Lin, Yuh-Harng Chien
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Patent number: 10529654Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.Type: GrantFiled: September 26, 2018Date of Patent: January 7, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yuh-Harng Chien, Chih-Chien Ho, Steven Su
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Publication number: 20190385899Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.Type: ApplicationFiled: August 26, 2019Publication date: December 19, 2019Inventors: Chang-Yen Ko, Chung-Ming Cheng, Megan Chang, Chih-Chien HO
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Patent number: 10395971Abstract: An apparatus includes a lead frame, a dam and adhesive on portions of the lead frame, and an integrated circuit die having a portion on the dam and another portion on the adhesive. The lead frame can include two portions, or two lead frames. The dam can bridge a space between the two lead frames. The dam can be smaller than the integrated circuit die in at least a width dimension of the dam relative to a width dimension of the integrated circuit die, providing that the integrated circuit die overhangs the dam on each side of the width dimension of the dam. Adhesive is located between the integrated circuit die and each lead frame, adjacent to and on each side of the dam. The dam prevents adhesive from spreading into the space between the lead frames.Type: GrantFiled: December 22, 2017Date of Patent: August 27, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chang-Yen Ko, Chung-Ming Cheng, Megan Chang, Chih-Chien Ho